SMD Type Product specification NDS356AP General Description Features TM SuperSOT -3 P-Channel logic level enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage applications such as notebook computer power management, portable electronics, and other battery powered circuits where fast high-side switching, and low in-line power loss are needed in a very small outline surface mount package. -1.1 A, -30 V, RDS(ON) = 0.3 Ω @ VGS=-4.5 V RDS(ON) = 0.2 Ω @ VGS=-10 V. Industry standard outline SOT-23 surface mount package using proprietary SuperSOTTM-3 design for superior thermal and electrical capabilities. High density cell design for extremely low RDS(ON). Exceptional on-resistance and maximum DC current capability. ________________________________________________________________________________ D S G Absolute Maximum Ratings Symbol Parameter VDSS T A = 25°C unless otherwise noted NDS356AP Units Drain-Source Voltage -30 V VGSS Gate-Source Voltage - Continuous ±20 V ID Maximum Drain Current - Continuous ±1.1 A (Note 1a) - Pulsed PD TJ,TSTG Maximum Power Dissipation ±10 (Note 1a) 0.5 (Note 1b) 0.46 Operating and Storage Temperature Range W -55 to 150 °C THERMAL CHARACTERISTICS RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 250 °C/W RθJC Thermal Resistance, Junction-to-Case (Note 1) 75 °C/W http://www.twtysemi.com [email protected] 4008-318-123 1 of 3 SMD Type Product specification NDS356AP Electrical Characteristics (TA = 25°C unless otherwise noted) Symbol Parameter Conditions Min -30 Typ Max Units OFF CHARACTERISTICS BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = -250 µA V IDSS Zero Gate Voltage Drain Current VDS = -24 V, VGS = 0 V IGSSF Gate - Body Leakage, Forward VGS = 20 V, VDS = 0 V IGSSR Gate - Body Leakage, Reverse VGS = -20V, VDS = 0 V -100 nA -1.6 -2.5 V TJ =55°C -1 µA -10 µA 100 nA ON CHARACTERISTICS (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = -250 µA RDS(ON) Static Drain-Source On-Resistance VGS = -4.5 V, ID = -1.1 A -0.8 TJ =125°C -0.5 TJ =125°C VGS = -10 V, ID = -1.3 A -1.3 -2.2 0.25 0.3 0.35 0.4 0.14 0.2 -3 Ω ID(ON) On-State Drain Current VGS = -4.5 V, VDS = -5 V A gFS Forward Transconductance VDS = -5 V, ID = -1.1 A 2 S VDS = -10 V, VGS = 0 V, f = 1.0 MHz 280 pF 170 pF 65 pF DYNAMIC CHARACTERISTICS Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance SWITCHING CHARACTERISTICS (Note 2) 8 15 ns 17 30 ns Turn - Off Delay Time 53 90 ns Turn - Off Fall Time 38 80 ns 3.4 4.4 tD(on) Turn - On Delay Time tr Turn - On Rise Time tD(off) tf Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge http://www.twtysemi.com VDD = -10 V, ID = -1 A, VGS = -10 V, RGEN = 50 Ω VDS = -10 V, ID = -1.1 A, VGS = -5 V [email protected] nC 0.7 nC 1.5 nC 4008-318-123 2 of 3 SMD Type Product specification NDS356AP Electrical Characteristics (TA = 25°C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units -0.42 A -10 A -1.2 V DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS IS Maximum Continuous Source Current ISM Maximum Pulsed Drain-Source Diode Forward Current VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = -0.42 (Note 2) -0.8 Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. PD (t) = T J −T A R θJA(t) = T J −T A R θJC +R θCA (t) = I 2D(t) × R DS(ON)@T J Typical RθJA using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment: o 2 a. 250 C/W when mounted on a 0.02 in pad of 2oz copper. o 2 b. 270 C/W when mounted on a 0.001 in pad of 2oz copper. 1a 1b Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%. http://www.twtysemi.com [email protected] 4008-318-123 3 of 3