STMICROELECTRONICS STPS052Z

STPS0520Z
®
SCHOTTKY RECTIFIERS
MAIN PRODUCT CHARACTERISTICS
IF(AV)
0.5 A
VRRM
20 V
VF (max)
0.32 V
FEATURES AND BENEFITS
■
■
■
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
EXTREMELY FAST SWITCHING
DESCRIPTION
Single Schottky rectifier suited for switch mode
power supplies and high frequency DC to DC
converters.
SOD-123
Packaged in SOD-123, this device is intended for
use in low voltage, high frequency inverters, free
wheeling and polarity protection applications. Due
to the small size of the package this device fits
GSM and PCMCIA requirements.
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
20
V
IF(RMS)
RMS forward current
2
A
IF(AV)
Average forward current
δ=0.5
Ta=25°C
0.5
A
IFSM
Surge non repetitive forward current
tp=10ms
sinusoidal
5.5
A
dV/dt
Critical rate of rise of reverse voltage
10000
V/µs
- 65 to + 125
°C
Tstg
* :
Storage temperature range
Tj
Maximum operating junction temperature *
125
°C
TL
Maximum temperature for soldering during 10s
260
°C
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j − a )
January 2002 - Ed : 2B
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STPS0520Z
THERMAL RESISTANCE
Symbol
Rth (j-a)
Parameter
Junction to ambient
Value
Unit
430 (*)
210 (**)
°C/W
(*) Mounted on epoxy board with recommended Pad Layout.
(**) Mounted on epoxy board with 50mm2 copper area.
STATIC ELECTRICAL CHARACTERISTICS
Value
Symbol
Parameter
Tests conditions
STPS0520Z
typ.
IR *
Reverse leakage current
Tj = 25°C
VR = 10 V
Tj = 100°C
Tj = 25°C
2.5
VR = VRRM
Tj = 100°C
VF **
Forward voltage drop
Tj = 25°C
4.3
IF = 0.1 A
Tj = 100°C
Tj = 25°C
0.18
IF = 0.5 A
Tj=100°C
Pulse test :
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.23 x IF(AV) + 0.18 x IF2(RMS)
2/5
max.
60
µA
5
mA
150
µA
8
mA
0.3
V
0.22
0.385
0.29
Unit
0.32
STPS0520Z
Fig. 1: Average forward power dissipation versus
average forward current
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5)
IF(av)(A)
PF(av)(W)
0.25
δ = 0.05
δ = 0.1
δ = 0.2
0.6
δ = 0.5
0.5
0.20
δ=1
0.4
0.15
0.3
0.10
0.2
T
0.05
T
0.1
IF(av) (A)
0.00
0.0
0.1
0.2
δ=tp/T
0.3
0.4
δ=tp/T
tp
0.5
0.6
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
0.0
0
25
50
75
100
125
Fig. 4: Relative variation of thermal impedance
junction to ambient versus pulse duration (Epoxy
printed circuit board FR4 with recommended pad
layout).
IM(A)
Zth(j-a)/Rth(j-a)
3.0
1E+0
2.5
δ = 0.5
δ = 0.2
Ta=25°C
2.0
1E-1
Ta=50°C
δ = 0.1
Ta=75°C
1.5
1.0
0.5
Tamb(°C)
tp
1E-2
IM
T
Single pulse
t
t(s)
δ=0.5
0.0
1E-3
1E-2
tp(s)
1E-1
1E+0
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
1E-3
1E-3
1E-2
1E-1
δ=tp/T
1E+0
1E+1
tp
1E+2
Fig. 6: Relative variation of reverse leakage current versus junction temperature (typical values).
IR[Tj] / IR[Tj=25°C]
IR(mA)
2E+1
1E+1
1E+3
Tj=125°C
VR=VRRM
Tj=100°C
1E+2
1E+0
Tj=70°C
1E+1
1E-1
Tj=25°C
1E+0
1E-2
Tj(°C)
VR(V)
1E-3
0
2
4
6
8
10
12
14
16
18
20
1E-1
0
25
50
75
100
125
3/5
STPS0520Z
Fig. 7: Junction capacitance versus reverse voltage applied (typical values).
Fig. 8-1: Forward voltage drop versus forward current (maximum values, low level)
C(pF)
IFM(A)
200
0.5
F=1MHz
Tj=25°C
Tj=100°C
Typical values
0.4
100
0.3
50
Tj=100°C
Tj=25°C
0.2
20
0.1
VR(V)
10
1
2
5
VFM(V)
10
20
Fig. 8-2: Forward voltage drop versus forward current (maximum values, high level)
0.0
0.0
0.1
0.2
0.3
0.4
0.5
Fig. 9: Variation of thermal resistance junction to
ambient versus copper surface under each lead
(Printed circuit board FR4, e(Cu) = 35µm).
IFM(A)
Rth(j-a) (°C/W)
5.0
350
P=0.25W
Tj=100°C
Typical values
300
250
1.0
Tj=100°C
Tj=25°C
200
150
S(mm²)
VFM(V)
0.1
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
4/5
100
0
20
40
60
80
100
STPS0520Z
PACKAGE MECHANICAL DATA
SOD-123
DIMENSIONS
H
A2
A1
b
REF.
Millimeters
Min.
Max.
A
E
A
D
c
G
Inches
Min.
1.45
Max.
0.057
A1
0
0.1
0
0.004
A2
0.85
1.35
0.033
0.053
b
0.55 Typ.
0.022 Typ.
c
0.15 Typ.
0.039 Typ.
D
2.55
2.85
0.1
0.112
E
1.4
1.7
0.055
0.067
G
0.25
H
3.55
0.01
3.95
0.14
0.156
FOOTPRINT (in millimeters)
4.45
0.65
2.51
0.97
0.97
MARKING
■
■
Type
Marking
Package
Weight
Base qty
Delivery mode
STPS0520Z
Z52
SOD-123
0.01g.
3000
Tape & reel
STPS0520Z10K
Z52
SOD-123
0.01 g
10000
Tape & reel
Epoxy meets UL94, V0.
Band indicates cathode.
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
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