INTEGRATED CIRCUITS DATA SHEET TEA1111A Speech circuit with dialler interface, regulated supply and earpiece volume control Product specification Supersedes data of 1999 Sep 28 File under Integrated Circuits, IC03 1999 Nov 22 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A FEATURES APPLICATIONS • Low DC line voltage; operates down to 1.5 V (excluding voltage drop across external polarity guard) • Line powered telephone sets with LCD module • Line voltage regulator with adjustable DC voltage • Fax machines • Cordless telephones • 3.25 V regulated strong supply point for peripheral circuits compatible with: • Answering machines. – Speech mode GENERAL DESCRIPTION – Ringer mode The TEA1111A is a bipolar integrated circuit that performs all speech and line interface functions required in fully electronic telephone sets. It performs electronic switching between speech and dialling. The IC operates at a line voltage down to 1.5 V DC (with reduced performance) to facilitate the use of telephone sets connected in parallel. – Trickle mode. • Transmit stage with: – Microphone amplifier with symmetrical high impedance inputs – DTMF amplifier with confidence tone on earpiece. When the line current is high enough, a fixed amount of current is derived from the LN pin in order to create a strong supply point at pin VDD. The voltage at pin VDD is regulated to 3.25 V to supply peripherals such as dialler, LCD module and microcontroller. • Receive stage with: – Earpiece amplifier with adjustable gain and volume control. • MUTE input for pulse or DTMF dialling • AGC line loss compensation for microphone and earpiece • LED control output. QUICK REFERENCE DATA Iline = 15 mA; VEE = 0 V; VVCI = 0 V; RSLPE = 20 Ω; AGC pin connected to VEE; Zline = 600 Ω; f = 1 kHz; measured according to test circuits given in Figs 14, 15 and 16; Tamb = 25 °C; unless otherwise specified. SYMBOL Iline PARAMETER CONDITIONS line current operating range MIN. TYP. MAX. UNIT normal operation 11 − 140 mA with reduced performance 1 − 11 mA 3.7 4.0 4.3 V VLN DC line voltage ICC internal current consumption VCC = 3.3 V − 1.15 1.4 mA VCC supply voltage for internal circuitry (unregulated) IP = 0 mA − 3.3 − V VDD regulated supply voltage for peripherals speech mode IDD = −3 mA 2.95 3.25 3.55 V ringer mode IDD = 75 mA 3.0 3.3 3.6 V − − −3 mA 45.2 dB IDD available supply current for peripherals Gv(TX) typical voltage gain for microphone amplifier VMIC = 4 mV (RMS) 43.2 44.2 Gv(QR) typical voltage gain for earpiece amplifier VIR = 4 mV (RMS) 26.4 27.4 28.4 dB ∆Gv(QR) volume control range for earpiece amplifier 0 14.5 − dB ∆Gv(trx) gain control range for microphone and earpiece amplifiers with respect to Iline = 15 mA Iline = 85 mA − 6.0 − dB MUTE = LOW − 80 − dB ∆Gv(trx)(m) gain reduction for microphone and earpiece amplifiers 1999 Nov 22 2 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TEA1111AT SO16 DESCRIPTION VERSION plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 BLOCK DIAGRAM handbook, full pagewidth IR MUTE 4 VCI GAR 9 12 receive amplifier V I VOLUME CONTROL I CURRENT AND VOLTAGE REFERENCE 0.5VCC 6 ATTENUATOR 16 VDD V MIC+ MIC− QR earpiece amplifier 8 V DTMF 11 7 REGULATOR I 13 14 1 V VCC VDD LN I microphone amplifier VEE 10 AGC CIRCUIT LOW VOLTAGE CIRCUIT AGC 5 LED CONTROL TEA1111A 3 15 REG LEDC Fig.1 Block diagram. 1999 Nov 22 3 2 SLPE FCA051 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A PINNING SYMBOL PIN DESCRIPTION LN 1 positive line terminal SLPE 2 slope (DC resistance) adjustment REG 3 line voltage regulator decoupling IR 4 receive amplifier input AGC 5 automatic gain control/ line loss compensation DTMF 6 handbook, halfpage dual-tone multi-frequency input VDD 7 regulated supply for peripherals MUTE 8 mute input to select speech or dialling mode (active LOW) VCI 9 volume control input VEE 10 negative line terminal QR 11 earpiece amplifier output GAR 12 earpiece amplifier gain adjustment MIC+ 13 non-inverting microphone amplifier input MIC− 14 inverting microphone amplifier input LEDC 15 LED control output VCC 16 supply voltage for internal circuit 16 VCC LN 1 SLPE 2 15 LEDC REG 3 14 MIC− IR 4 13 MIC+ TEA1111A AGC 5 DTMF 6 11 QR VDD 7 10 VEE MUTE 8 9 VCI FCA052 Fig.2 Pin configuration. FUNCTIONAL DESCRIPTION The voltage at pin LN is: All data given in this chapter concerns typical values, except when otherwise specified. VLN = Vref + RSLPE × ISLPE Supply (pins LN, SLPE, REG, VCC and VDD) where: ISLPE = Iline − ICC − IP − ISUP − ILEDC Iline = line current The supply for the TEA1111A and its peripherals is obtained from the telephone line (see Fig.3). ICC = current consumption of the IC IP = supply current for external circuits THE LINE INTERFACE (PINS LN, SLPE AND REG) ISUP = current consumed between LN and VEE by the VDD regulator The IC generates a stabilized reference voltage (Vref) across pins LN and SLPE. Vref is temperature compensated and can be adjusted by using an external resistor (RVA). Vref equals 3.8 V and can be increased by connecting RVA between pins REG and SLPE or decreased by connecting RVA between pins REG and LN. The voltage at pin REG is used by the internal regulator to generate Vref and is decoupled by CREG, which is connected to VEE. This capacitor, converted to an equivalent inductance, (see Section “Set impedance”) determines the set impedance conversion from its DC value (RSLPE) to its AC value (RCC in the audio-frequency range). The voltage at pin SLPE is proportional to the line current. 1999 Nov 22 12 GAR ILEDC = supply current for external LED circuitry. The preferred value for RSLPE is 20 Ω. Changing RSLPE will affect more than the DC characteristics; it also influences the microphone and DTMF gains, the gain control characteristics, the sidetone level and the maximum output swing on the line. The DC line current flowing into the set is determined by the exchange supply voltage (VEXCH), the feeding bridge resistance (REXCH), the DC resistance of the telephone line (Rline) and the reference voltage (Vref). With line currents below Ilow (9 mA), the internal reference voltage (generating Vref) is automatically adjusted to a lower value. 4 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A The VCC voltage (see also Figs 4 and 5) depends on the current consumed by the IC and the peripheral circuits as: This means that several sets can operate in parallel with DC line voltages (excluding the polarity guard) down to an absolute minimum voltage of 1.5 V. At line currents below Ilow, the circuit has limited sending and receiving levels. This is called the low voltage area. VCC = VCC0 − RCC × (IP + Irec) THE INTERNAL SUPPLY POINT (PIN VCC) Where Irec is the current consumed by the output stage of the earpiece amplifier. VCC0 = VLN − RCC × ICC The internal circuitry of the TEA1111A is supplied from pin VCC. This voltage supply is derived from the line voltage by means of a resistor (RCC) and must be decoupled by a capacitor CVCC. It may also be used to supply some external circuits. handbook, full pagewidth Rline RCC Iline ILEDC ILN ICC VCC LN LED CIRCUIT REXCH LEDC internal circuitry VDD REGULATOR LED CONTROL VDD TEA1111A VEXCH SLPE REG IP 100 µF ISUP from preamplifier CVCC VEE external circuits IDD peripherals CVDD 220 µF ISLPE CREG RSLPE 4.7 µF 20 Ω FCA053 Fig.3 Supply configuration. 1999 Nov 22 5 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control handbook, halfpage RCC TEA1111A VCC Irec VCC0 EXTERNAL CIRCUITS VEE IP MGK806 Fig.4 VCC used as supply voltage for external circuits. FCA054 2 handbook, halfpage IP (mA) 1.6 1.2 0.8 (1) (2) 0.4 0 2.2 2.6 3.0 VCC (V) 3.4 VCC ≥ 2.2 V; VLN = 4 V at Iline = 15 mA; RCC = 619 Ω; RSLPE = 20 Ω. (1) Curve 1 is valid when the earpiece amplifier is driven: VQR(rms) = 150 mV; RL = 150 Ω. (2) Curve 2 is valid when the earpiece amplifier is not loaded. Fig.5 Typical current IP available from VCC for peripheral circuitry. 1999 Nov 22 6 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A • Ringer mode: The regulator operates as a shunt stabilizer to keep VDD at 3.3 V. The input voltage VLN equals 0 V while the input current into pin VDD is delivered by the ringing signal. VDD has to be decoupled by a capacitor CVDD. THE REGULATED SUPPLY POINT (PIN VDD) The VDD regulator delivers a stabilized voltage for the peripherals in transmission mode (nominal VLN) as well as in ringer mode (VLN = 0 V). The regulator (see Fig.6) consists of a sense input circuit fed by pin LN, a current switch and a VDD output stabilizer. • Trickle mode: When VDD is below 2 V, the regulator is inhibited. The current consumption of the VDD regulator in trickle mode is very low to save most of the trickle current for memory retention of a dialler. The regulator function depends on the transmission, ringer and trickle modes as follows: • Transmission mode: The regulator operates as a current source at the LN input; it takes a constant current of ISUP = 4.3 mA (at nominal conditions) from pin LN. The current switch reduces the distortion on the line at large signal swings. Output VDD follows the DC voltage at pin LN (with typically 0.35 V difference) up to VDD = 3.25 V. The input current of the regulator is constant while the output (source) current is determined by the consumption of the peripherals. The difference between input and output currents is shunted by the internal VDD stabilizer. handbook, full pagewidth Rline RCC Iline I CC I LN VCC LN CVCC VDD REXCH ISUP 100 µF IDD SENSE SWITCH peripherals VEXCH VDD regulator CVDD TEA1111A VEE 220 µF FCA055 Fig.6 VDD regulator configuration. 1999 Nov 22 7 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A LED control (pin LEDC) The TEA1111A gives an on-hook/off-hook status indication. This is achieved by a current made available at pin LEDC to drive an external LED circuit connected between pins SLPE and LN (see Fig.7). In the low voltage area, which corresponds to low line current conditions, no current is available for this LED. For line currents higher than a threshold, the LEDC current increases proportionally to the line current (with a ratio of 1:150). The LEDC current is internally limited to 470 µA (see Fig.8). For 12 mA < Iline < 82 mA: I LEDC LN 24 Ω 2.4 kΩ LEDC BC858B I line – 12 = -------------------150 This LED circuit is referenced to SLPE. Consequently, all the LED supply current will flow through the RSLPE resistor, and does not affect the behaviour of the AGC. SLPE FCA056 Set impedance In the audio frequency range, the dynamic impedance is mainly determined by the RCC resistor. The equivalent impedance of the circuit is illustrated in Fig.9. Fig.7 LED circuit configuration. FCA057 500 handbook, halfpage I LEDC handbook, halfpage (µA) LN 400 LEQ Vref 300 RP RCC 619 Ω REG VCC CREG 4.7 µF CVCC 100 µF SLPE RSLPE 200 20 Ω VEE MBE788 100 0 0 20 40 60 80 I line (mA) 100 LEQ = CREG × RSLPE × RP. RP = internal resistance. RP = 17.5 kΩ. Fig.8 LEDC current versus line current. 1999 Nov 22 Fig.9 Equivalent impedance between LN and VEE. 8 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control Transmit stage (pins MIC+, MIC− and DTMF) Automatic gain control is provided on this amplifier for line loss compensation. MICROPHONE AMPLIFIER (PINS MIC+ AND MIC−) The TEA1111A has symmetrical microphone inputs. The input impedance between pins MIC+ and MIC− is 68 kΩ (2 × 34 kΩ). The voltage gain from pins MIC+/MIC− to pin LN is set at 44.2 dB (typical) at 600 Ω line load. VOLUME CONTROL (PIN VCI) A positive DC voltage applied to pin VCI allows the gain of the earpiece amplifier to be increased in steps of 4.85 dB. The volume control range is 27.4 to 41.9 dB (14.5 dB typical). A proportional voltage decoder at pin VCI defines a gain of 27.4 dB when VVCI equals VEE and a gain of 41.9 dB when VVCI equals VDD. Automatic gain control is provided on this amplifier for line loss compensation. DTMF AMPLIFIER (PIN DTMF) 1 The intermediate steps correspond to: V VCI = --- V DD 3 When the DTMF amplifier is enabled, dialling tones may be sent on line. These tones are also sent to the receive output QR at a low level (confidence tone), the level is controlled by pin VCI. 2 and V VCI = --- V DD . 3 The TEA1111A has an asymmetrical DTMF input. The input impedance between DTMF and VEE is 20 kΩ and it is biased at VEE. The voltage gain from pin DTMF to pin LN is set at 25.9 dB. Automatic gain control (pin AGC) The TEA1111A performs automatic line loss compensation. The automatic gain control varies the gain of the microphone amplifier and the gain of the receive amplifier in accordance with the DC line current. Automatic gain control has no effect on the DTMF amplifier. The control range is 6.0 dB (which corresponds approximately to a line length of 5 km for a 0.5 mm diameter twisted-pair copper cable with a DC resistance of 176 Ω/km and an average attenuation of 1.2 dB/km). Receiving stage (pins IR, GAR, QR and VCI) The receive part consists of an earpiece amplifier and a volume control block. The IC can be used with different configurations of feeding bridge (supply voltage and bridge resistance) by connecting an external resistor RAGC between pins AGC and VEE. This resistor enables the Istart and Istop line currents to be increased (the ratio between Istart and Istop is not affected by the resistor). The AGC function is disabled when pin AGC is left open circuit. EARPIECE AMPLIFIER The earpiece amplifier has one input (IR) and one output (QR). The input impedance between pin IR and pin VEE is 22 kΩ. When pin VCI is tied to VEE, the voltage gain from pin IR to pin QR is set at 27.4 dB (typical) which reduces the attenuation of the receive signal by the anti-sidetone network from 32 dB to 4.6 dB. The gain can be decreased by connecting an external resistor RGARext between pins GAR and QR; the adjustment range is 6 dB. Two external capacitors CGAR (connected between pins GAR and QR) and CGARS (connected between pins GAR and VEE) ensure stability. Capacitor CGAR provides a first-order low-pass filter. The cut-off frequency corresponds to the time constant CGAR × RGARint. Where RGARint is the internal resistor (123 kΩ typical) which sets the gain. The relationship CGARS = 10 × CGAR must be complied with to ensure stability. Mute function (pin MUTE) The mute function performs the switching between the speech mode and the dialling mode. When MUTE is LOW, the DTMF input is enabled and the microphone and receive amplifier inputs are disabled. In this mode, the DTMF tones are sent to the receive output at a low level (confidence tone). When MUTE is HIGH, the microphone and receiving amplifiers inputs are enabled while the DTMF input is disabled. The MUTE input is provided with an internal pull-up current source to VDD. The output voltage of the earpiece amplifier is specified for continuous wave drive. The maximum output swing depends on the DC line voltage, the RCC resistor, the ICC current consumption of the circuit, the IP current consumption of the peripheral circuits and the load impedance. 1999 Nov 22 TEA1111A 9 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A The anti-sidetone network for the TEA1111A attenuates the receive signal from the line by 32 dB before it enters the receive stage. The attenuation is almost constant over the whole audio frequency range. Sidetone suppression The TEA1111A anti-sidetone network comprising RCC // Zline, Rast1, Rast2, Rast3, RSLPE and Zbal (see Fig.10) suppresses the transmitted signal in the earpiece. Maximum compensation is obtained when the following conditions are fulfilled: A Wheatstone bridge configuration (see Fig.11) may also be used. R SLPE × R ast1 = R CC × ( R ast2 + R ast3 ) More information on the balancing of an anti-sidetone bridge can be obtained in our publication “Semiconductors for Wired Telecom Systems; Applications Handbook IC03b”. R ast2 × ( R ast3 + R SLPE ) k = -----------------------------------------------------------R ast1 × R SLPE For ordering information, please contact the Philips Semiconductors sales office. Z bal = k × Z line The scale factor k is chosen to meet the compatibility with a standard capacitor from the E6 or E12 range for Zbal. In practice, Zline varies considerably with the line type and the line length. Therefore, the value of Zbal should be for an average line length, which gives satisfactory sidetone suppression with short and long lines. The suppression also depends on the accuracy of the match between Zbal and the impedance of the average line. LN handbook, full pagewidth Zline RCC Rast1 Im VEE IR Zir Rast2 RSLPE Rast3 SLPE Zbal MBE787 Fig.10 Equivalent circuit of TEA1111A anti-sidetone bridge. 1999 Nov 22 10 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control handbook, full pagewidth TEA1111A LN Zline RCC Zbal IR Im VEE RSLPE Zir Rast1 RA SLPE MBE786 Fig.11 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT positive continuous line voltage VEE − 0.4 12 V repetitive line voltage during switch-on or line interruption VEE − 0.4 13.2 V IDD maximum input current at pin VDD − mA VCC supply voltage VEE − 0.4 12 VLN 75 V VEE − 0.4 VDD + 0.4 V VMUTE, VVCI maximum voltage on pins MUTE and VCI VEE − 0.4 VCC + 0.4 V Vn(max) maximum voltage on all pins except pins VDD, MUTE and VCI Iline line current RSLPE = 20 Ω; see Fig.12 − Ptot TEA1111AT total power dissipation Tamb = 75 °C; see Fig.12 − 416 mW Tstg storage temperature −40 +125 °C Tamb ambient temperature −25 +75 °C Tj junction temperature − +125 °C 1999 Nov 22 11 140 mA Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient in free air; note 1 VALUE UNIT 110 K/W Note 1. Mounted on epoxy board 40.1 × 19.1 × 1.5 mm. FCA058 150 handbook, full pagewidth 130 I LN (mA) 110 90 (4) (3) (2) (1) 70 50 30 (1) (2) (3) (4) 2 3 4 5 6 7 8 9 Tamb = 45 °C; Ptot = 0.666 W. Tamb = 55 °C; Ptot = 0.583 W. Tamb = 65 °C; Ptot = 0.500 W. Tamb = 75 °C; Ptot = 0.416 W. Fig.12 SO16 safe operating area (TEA1111AT). 1999 Nov 22 12 10 11 VLN − VSLPE (V) 12 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A CHARACTERISTICS Iline = 15 mA; VEE = 0 V; VVCI = 0 V; RSLPE = 20 Ω; pin AGC connected to VEE; Zline = 600 Ω; f = 1 kHz; measured according to test circuits given in Figs 14, 15 and 16; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (pins LN, VCC, SLPE, REG and VDD) THE LINE INTERFACE (PINS LN, SLPE AND REG) Vref stabilized reference voltage between pins LN and SLPE VLN DC line voltage 3.5 3.8 4.1 V Iline = 1 mA − 1.5 − V Iline = 4 mA − 2.5 − V Iline = 15 mA 3.7 4.0 4.3 V Iline = 140 mA − 6.7 7.2 V VLN(Rext) DC line voltage with an external resistor RVA RVA = 90 kΩ (between pins LN and REG) − 3.6 − V ∆VLN(T) DC line voltage variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±40 − mV THE INTERNAL SUPPLY POINT (PIN VCC) ICC internal current consumption VCC = 3.3 V − 1.15 1.4 mA VCC supply voltage for internal circuitry IP = 0 mA − 3.3 − V Iline = 1 mA − 0 − mA Iline = 4 mA − 1.2 − mA Iline ≥ 11 mA − 4.3 − mA 3.25 3.55 V THE REGULATED SUPPLY POINT (PIN VDD) ISUP VDD IDD 1999 Nov 22 input current of the VDD regulator (current from pin LN not flowing through pin SLPE) regulated supply voltage in: speech mode 2.95 IDD = −3 mA; VLN > 3.6 V + 0.28 V (typ.); Iline ≥ 11 mA speech mode at reduced performance Iline = 4 mA − VLN − 0.35 − V ringer mode Iline = 0 mA; IDD = 75 mA 3.0 3.3 3.6 V speech mode Iline ≥ 11 mA − − −3 mA speech mode at reduced performance Iline = 4 mA − −1 − mA trickle mode Iline = 0 mA; VCC discharging; VDD = 1.2 V − − 100 nA regulated supply current available in: 13 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control SYMBOL PARAMETER TEA1111A CONDITIONS MIN. TYP. MAX. UNIT LED control (pin LEDC) Iline(h) highest line current for ILEDC < 5 µA − 13 − mA Iline(l) lowest line current for maximum ILEDC − 82 − mA ILEDC(max) maximum available output current from pin LEDC − 470 − µA differential between pins MIC+ and MIC− − 68 − kΩ single-ended between pins MIC+/MIC− and VEE − 34 − kΩ Transmit stage (pins MIC+, MIC− and DTMF) MICROPHONE AMPLIFIER (PINS MIC+ AND MIC−) Zi input impedance Gv(TX) voltage gain from pins MIC+/MIC− to pin LN VMIC = 4 mV (RMS) 43.2 44.2 45.2 dB ∆Gv(TX)(f) voltage gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.2 − dB ∆Gv(TX)(T) voltage gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.3 − dB CMRR common mode rejection ratio − 80 − dB Iline = 15 mA; THD = 2% 1.8 2 − V Iline = 4 mA; THD = 10% − 0.45 − V psophometrically weighted − (P53 curve); pins MIC+/MIC− short circuited through 200 Ω −77 − dBmp − 20 − kΩ VLN(max)(rms) maximum sending signal (RMS value) Vno(LN) noise output voltage at pin LN DTMF AMPLIFIER (PIN DTMF) Zi input impedance Gv(DTMF) voltage gain from pin DTMF to pin LN VDTMF = 20 mV (RMS); MUTE = LOW 24.9 25.9 26.9 dB ∆Gv(DTMF)(f) voltage gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.2 − dB ∆Gv(DTMF)(T) voltage gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.4 − dB Gv(ct) VDTMF = 20 mV (RMS); RL = 150 Ω; MUTE = LOW; VVCI = 0 V − −15.6 − dB 1999 Nov 22 voltage gain from pin DTMF to pin QR (confidence tone) 14 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control SYMBOL PARAMETER TEA1111A CONDITIONS MIN. TYP. MAX. UNIT Receive stage (pins IR, GAR, QR and VCI) THE EARPIECE AMPLIFIER (PINS IR AND QR) Zi input impedance − 22 − kΩ Gv(QR) voltage gain from pin IR to pin QR VIR = 4 mV (RMS); VVCI = 0 V 26.4 27.4 28.4 dB ∆Gv(QR)(f) voltage gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.2 − dB ∆Gv(QR)(T) voltage gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.3 − dB ∆Gv(QR) voltage gain reduction range external resistor connected − between pins GAR and QR − 6 dB IP = 0 mA; sine wave drive; 0.5 RL = 150 Ω; THD = 2%; VVCI = VDD 0.6 − V IP = 0 mA; sine wave drive; 0.8 RL = 450 Ω; THD = 2%; VVCI = VDD 0.9 − V IR open circuit; − RL = 150 Ω; VVCI = 0 V; psophometrically weighted (P53 curve) −90 − dBVp VVCI = VDD − −75 − dBVp VQR(max)(rms) maximum receiving signal on pin QR (RMS value) Vno(QR)(rms) noise output voltage at pin QR (RMS value) VOLUME CONTROL (PIN VCI) ∆Gv(QR)max maximum increase in voltage gain VIR = 4 mV (RMS); VVCI = VDD 12 14.5 17 dB ∆Gv(QR)step step voltage gain VIR = 4 mV (RMS) 3.85 4.85 5.85 dB Iline = 85 mA − 6.0 − dB Automatic gain control (pin AGC) ∆Gv(trx) voltage gain control range for microphone and earpiece amplifiers w.r.t. Iline = 15 mA Istart highest line current for maximum gain − 23 − mA Istop lowest line current for min. gain − 59 − mA Mute function (pin MUTE) VIL LOW-level input voltage VEE − 0.4 − VEE + 0.3 V VIH HIGH-level input voltage VEE + 1.5 − VDD + 0.4 V IMUTE input current −10 −2 − µA ∆Gv(trx)(m) voltage gain reduction for: 1999 Nov 22 microphone amplifier MUTE = LOW − 80 − dB earpiece amplifier MUTE = LOW − 80 − dB DTMF amplifier MUTE = HIGH − 80 − dB 15 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A TEST AND APPLICATION INFORMATION Rprot handbook, full pagewidth Cz D1 AB D2 Dz Vd 10 V 1N4004 D3 D4 RCC Cemc 10 nF Rz 24 Ω CVCC VCC LN SLPE Rast1 130 kΩ CREG CIR 4.7 µF 100 nF RAGC Rast2 3.92 kΩ Rast3 392 Ω Rbal1 130 Ω Rbal2 820 Ω CDTMF DTMF 220 nF VDD RSLPE 20 Ω peripheral supply BC858 LEDC REG MIC− RTX3 IR AGC CMIC− RTX1 MIC− MIC+ TEA1111A MIC+ CEAR RGARext GAR DTMF VDD CGAR 10 µF 100 pF 1 nF VEE R CVDD MUTE 220 µF earpiece CGARS VCI1 VCI 2R VCI 0 VEE MUTE 16 CMIC+ RTX2 QR Fig.13 Basic application diagram. 1999 Nov 22 2.4 kΩ 100 µF BA Cbal 220 nF 619 Ω FCA059 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control Iline handbook, full pagewidth TEA1111A CVCC RCC 619 Ω 24 Ω CVDD ILN ICC LN VCC 220 µF IDD VDD 10 µF R L LEDC BC858 QR 100 µF Iline 100 µF 3 mA 2.4 kΩ IR VO RGARext MIC− TEA1111A VMIC CGAR GAR CGARS MIC+ DTMF SLPE REG AGC VEE MUTE VCI 600 Ω VDTMF RSLPE 20 Ω CREG 4.7 µF S1 FCA060 V Voltage gain defined as Gv = 20 log ------O- ; VI = VMIC or VDTMF. VI Microphone gain: S1 = open. DTMF gain: S1 = closed. Inputs not being tested should be open circuit. Fig.14 Test circuit for defining transmit gains. 1999 Nov 22 17 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control handbook,Iline full pagewidth TEA1111A CVCC RCC 619 Ω 24 Ω 100 µF 3 mA 2.4 kΩ CVDD ILN ICC LN BC858 VCC 220 µF IDD VDD VO LEDC 10 µF R L QR IR 100 µF MIC− Iline RGARext TEA1111A GAR CGARS MIC+ VIR CGAR DTMF 220 nF SLPE REG AGC VEE MUTE VCI 600 Ω VDTMF RSLPE 20 Ω CREG 4.7 µF S1 EVCI FCA061 V Voltage gain defined as Gv = 20 log ------O- ; VI = VIR or VDTMF. VI Earpiece gain: S1 = open. Confidence tone: S1 = closed. Inputs not being tested should be open circuit. Fig.15 Test circuit for defining earpiece gains. 1999 Nov 22 18 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control handbook, full pagewidth TEA1111A RCC 619 Ω LN VCC VDD IR QR MIC− MIC+ VCC GAR TEA1111A VDD DTMF LEDC 10 µF IDD VCI REG AGC CREG 4.7 µF SLPE VEE MUTE RSLPE 20 Ω FCA062 Inputs not being tested should be open circuit. Fig.16 Test circuit for defining regulated supply (VDD) performance in ringer and trickle modes. 1999 Nov 22 19 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.041 0.228 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC 1999 Nov 22 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 20 o 8 0o Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 1999 Nov 22 TEA1111A 21 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable suitable(2) HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Nov 22 22 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control NOTES 1999 Nov 22 23 TEA1111A Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 465002/02/pp24 Date of release: 1999 Nov 22 Document order number: 9397 750 06482