CYStech Electronics Corp. Spec. No. : C847M3 Issued Date : 2003.04.17 Revised Date :2014.10.16 Page No. : 1/6 Low Vcesat NPN Epitaxial Planar Transistor BTD2098M3 Features • Low VCE(sat), VCE(sat)=0.35 V (typical), at IC / IB = 3A / 0.1A • Excellent DC current gain characteristics • Complementary to BTB1386M3 • Pb-free lead plating and halogen-free package Symbol Outline BTD2098M3 SOT-89 B：Base C：Collector E：Emitter B C E Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation Symbol VCBO VCEO VEBO IC Pd Thermal resistance, junction to ambient RθJA Thermal resistance, junction to case Junction Temperature Storage Temperature RθJC Tj Tstg Limits 40 30 6 5 8 0.6 1 2 125 62.5 16 150 -55~+150 *1 *2 *3 *2 *3 Unit V V V A A W °C/W °C °C Note : *1 Single pulse , Pw=10ms *2 Printed circuit board, glass epoxy board, 1.7mm thick with collector copper plating 10mm*10mm. *3 When mounted on a 40*40*0.7mm ceramic board. BTD2098M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C847M3 Issued Date : 2003.04.17 Revised Date :2014.10.16 Page No. : 2/6 Ordering Information Device BTD2098M3-S-T2-G Package SOT-89 (Pb-free lead plating and halogen-free package) Shipping 1000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T2 :1000 pcs/tape & reel, 7” reel Product rank, zero for no rank products Product name Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE *hFE *hFE fT Cob Min. 40 30 6 250 270 150 - Typ. 0.35 150 30 Max. 0.5 0.5 1.0 560 50 Unit V V V μA μA V MHz pF Test Conditions IC=50μA, IE=0 IC=1mA, IB=0 IE=50μA, IC=0 VCB=40V, IE=0 VEB=5V, IC=0 IC=3A, IB=0.1A VCE=2V, IC=20mA VCE=2V, IC=500mA VCE=2V, IC=2A VCE=6V, IC=50mA, f=100MHz VCB=20V, IE=0A, f=1MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE Rank S Range 270~560 BTD2098M3 CYStek Product Specification Spec. No. : C847M3 Issued Date : 2003.04.17 Revised Date :2014.10.16 Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 VCE(SAT) Saturation Voltage---(mV) Current Gain---HFE VCE=5V VCE=2V 100 VCE=1V IC=50IB 100 IC=40IB 10 1 10 1 10 100 1000 1 10000 Collector Current---IC(mA) 10 100 1000 10000 Collector Current---IC(mA) Saturation Voltage vs Collector Current Power Derating Curve 10000 2.5 VBE(SAT) @ IC=10IB Power Dissipation---PD(W) Saturation Voltage---(mV) IC=30IB IC=10IB 1000 100 2 See Note 3 on page 1 See Note 2 on page 1 1.5 1 0.5 0 1 10 100 1000 Collector Current---IC(mA) 10000 0 50 100 150 Ambient Temperature---TA(℃) 200 Recommended soldering footprint BTD2098M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C847M3 Issued Date : 2003.04.17 Revised Date :2014.10.16 Page No. : 4/6 Reel Dimension Carrier Tape Dimension BTD2098M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C847M3 Issued Date : 2003.04.17 Revised Date :2014.10.16 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTD2098M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C847M3 Issued Date : 2003.04.17 Revised Date :2014.10.16 Page No. : 6/6 SOT-89 Dimension Marking: A 2 1 Control code 3 Product Code H C HFE rank D B Style: Pin 1. Base 2. Collector 3. Emitter E I F 3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3 G Inches Min. Max. 0.1732 0.1811 0.1551 0.1673 0.0610 REF 0.0906 0.1024 0.0126 0.0205 DIM A B C D E Millimeters Min. Max. 4.40 4.60 3.94 4.25 1.55 REF 2.30 2.60 0.32 0.52 DIM F G H I Inches Min. Max. 0.0591 TYP 0.1181 TYP 0.0551 0.0630 0.0138 0.0173 Millimeters Min. Max. 1.50 TYP 3.00 TYP 1.40 1.60 0.35 0.44 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD2098M3 CYStek Product Specification