APTGT200SK60T3AG-Rev1.pdf

APTGT200SK60T3AG
Buck chopper
Trench + Field Stop IGBT3
Power Module
VCES = 600V
IC = 200A @ Tc = 100°C
Application


AC and DC motor control
Switched Mode Power Supplies
Features

28 27 26 25
23 22





20 19 18
29
16
30
15
Trench + Field Stop IGBT3 Technology
- Low voltage drop
- Low tail current
- Switching frequency up to 20 kHz
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- RBSOA and SCSOA rated
Very low stray inductance
Kelvin emitter for easy drive
Internal thermistor for temperature monitoring
High level of integration
AlN substrate for improved thermal performance
Benefits
14
31



13
32
2
3
4
7
8
10 11 12
Pins 29/30/31/32 must be shorted together
Pins 26/27/28/22/23/25 must be shorted together
to achieve a phase leg
Pins 16/18/19/20 must be shorted together


Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal for
easy PCB mounting
Low profile
RoHS Compliant
Absolute maximum ratings
Parameter
Collector - Emitter Breakdown Voltage
IC
Continuous Collector Current
ICM
VGE
PD
Pulsed Collector Current
Gate – Emitter Voltage
Maximum Power Dissipation
RBSOA
Reverse Bias Safe Operating Area
TC = 25°C
TC = 100°C
TC = 25°C
TC = 25°C
Tj = 150°C
Max ratings
600
290
200
400
±20
750
Unit
V
A
V
W
400A @ 550V
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1–6
APTGT200SK60T3AG – Rev 1 October, 2012
Symbol
VCES
APTGT200SK60T3AG
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
ICES
Zero Gate Voltage Collector Current
VCE(sat)
Collector Emitter Saturation Voltage
VGE(th)
IGES
Gate Threshold Voltage
Gate – Emitter Leakage Current
Test Conditions
Min
VGE = 0V, VCE = 600V
Tj = 25°C
VGE =15V
IC = 200A
Tj = 150°C
VGE = VCE , IC = 2 mA
VGE = 20V, VCE = 0V
5.0
Typ
1.5
1.7
5.8
Max
Unit
250
1.9
µA
6.5
400
V
nA
Max
Unit
V
Dynamic Characteristics
Symbol
Cies
Coes
Cres
QG
Td(on)
Tr
Td(off)
Tf
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Test Conditions
VGE = 0V
VCE = 25V
f = 1MHz
VGE= ±15V ; VCE=300V
IC=200A
Inductive Switching (25°C)
VGE = ±15V
VBus = 300V
IC = 200A
RG = 2
Inductive Switching (150°C)
VGE = ±15V
VBus = 300V
IC = 200A
RG = 2
Tj = 25°C
VGE = ±15V
Tj = 150°C
VBus = 300V
IC = 200A
Tj = 25°C
RG = 2
Tj = 150°C
VGE ≤15V ; VBus = 360V
tp ≤ 6µs ; Tj = 150°C
Gate charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Td(on)
Tr
Turn-on Delay Time
Rise Time
Td(off)
Turn-off Delay Time
Tf
Fall Time
Eon
Turn on Energy
Eoff
Turn off Energy
Isc
Short Circuit data
Min
Typ
12.3
0.8
0.4
nF
2.2
µC
115
45
225
ns
55
130
50
ns
300
70
1
1.8
5.7
7
mJ
mJ
1000
A
Chopper diode ratings and characteristics
IRM
IF
Maximum Reverse Leakage Current
Test Conditions
VR=600V
DC Forward Current
VF
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Er
Reverse Recovery Energy
IF = 200A
VGE = 0V
IF = 200A
VR = 300V
di/dt =2800A/µs
www.microsemi.com
Min
600
Typ
Tj = 25°C
Tj = 150°C
Tc = 80°C
Tj = 25°C
Tj = 150°C
Tj = 25°C
Tj = 150°C
Tj = 25°C
200
1.6
1.5
125
220
9
Tj = 150°C
Tj = 25°C
Tj = 150°C
20
2.2
4.8
Max
250
500
Unit
V
µA
A
2
V
ns
µC
mJ
2–6
APTGT200SK60T3AG – Rev 1 October, 2012
Symbol Characteristic
VRRM Maximum Peak Repetitive Reverse Voltage
APTGT200SK60T3AG
Thermal and package characteristics
Symbol Characteristic
RthJC
VISOL
TJ
TSTG
TC
Torque
Wt
Min
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
Typ
IGBT
Diode
To heatsink
M4
4000
-40
-40
-40
2
Max
0.20
0.31
Unit
°C/W
V
175
125
100
3
110
°C
N.m
g
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol
R25
∆R25/R25
B25/85
∆B/B
Characteristic
Resistance @ 25°C
Min
T25 = 298.15 K
TC=100°C
RT 
R25
Typ
50
5
3952
4
Max
Unit
k
%
K
%
T: Thermistor temperature

 1
1  RT: Thermistor value at T
exp  B25 / 85 
 
T
T
 25


See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com
www.microsemi.com
3–6
APTGT200SK60T3AG – Rev 1 October, 2012
SP3 Package outline (dimensions in mm)
APTGT200SK60T3AG
Typical Performance Curve
Output Characteristics (VGE=15V)
Output Characteristics
400
400
TJ=25°C
350
200
150
100
100
50
50
TJ=25°C
0.5
1
1.5
VCE (V)
VGE=9V
0
2
2.5
0
3
14
350
1
300
10
E (mJ)
250
200
TJ=125°C
2.5
3
3.5
Eoff
8
Er
6
4
100
TJ=150°C
2
50
TJ=25°C
5
6
7
8
9
Eon
0
0
10
11
0
12
50
100 150 200 250 300 350 400
IC (A)
VGE (V)
Switching Energy Losses vs Gate Resistance
16
VCE = 300V
VGE =15V
IC = 200A
TJ = 150°C
12
Reverse Bias Safe Operating Area
500
400
Eoff
Eon
8
IF (A)
E (mJ)
1.5
2
VCE (V)
VCE = 300V
VGE = 15V
RG = 2Ω
TJ = 150°C
12
TJ=25°C
150
0.5
Energy losses vs Collector Current
Transfert Characteristics
400
IC (A)
VGE=15V
200
150
0
VGE=13V
250
IC (A)
IC (A)
TJ=150°C
250
0
VGE=19V
300
TJ=125°C
300
TJ = 150°C
350
300
200
4
Eon
Er
VGE=15V
TJ=150°C
RG=2Ω
100
0
0
0
2
4
6
8
10
12
Gate Resistance (ohms)
14
0
100
200
300 400
VCE (V)
500
600
700
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
IGBT
0.2
0.9
0.15
0.7
0.1
0.5
0.3
0.05
0.1
0.05
0
0.00001
Single Pulse
0.0001
0.001
0.01
0.1
1
10
Rectangular Pulse Duration in Seconds
www.microsemi.com
4–6
APTGT200SK60T3AG – Rev 1 October, 2012
Thermal Impedance (°C/W)
0.25
APTGT200SK60T3AG
Forward Characteristic of diode
400
100
VCE=300V
D=50%
RG=2Ω
TJ=150°C
ZVS
ZCS
80
350
300
250
Tc=85°C
IF (A)
Fmax, Operating Frequency (kHz)
Operating Frequency vs Collector Current
120
60
200
TJ=125°C
150
40
Hard
switching
20
TJ=150°C
100
50
TJ=25°C
0
0
0
50
100
150
IC (A)
200
0
250
0.4
0.8
1.2
1.6
VF (V)
2
2.4
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.3
0.9
0.25
0.7
0.2
0.15
0.1
0.05
Diode
0.5
0.3
0.1
0.05
0
0.00001
Single Pulse
0.0001
0.001
0.01
0.1
1
10
Rectangular Pulse Duration in Seconds
www.microsemi.com
5–6
APTGT200SK60T3AG – Rev 1 October, 2012
Thermal Impedance (°C/W)
0.35
APTGT200SK60T3AG
DISCLAIMER
The information contained in the document (unless it is publicly available on the Web without access restrictions) is
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement
will also apply. This document and the information contained herein may not be modified, by any person other than
authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by
Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product
is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
www.microsemi.com
6–6
APTGT200SK60T3AG – Rev 1 October, 2012
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.