8L -SOIC Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 Package Weight – Site 5 SZ/SW/ B1: 70.0006 mg B2: 69.9606 mg B3: 75.4600 mg B4: 75.7400 mg B5: 72.9999 mg B1: 68.0817 mg B2: 71.9711 mg B3: 88.9922 mg Body Size (mil/mm) Package Weight – Site 2 150 mils B1: 80.9901 mg B2: 85.3650 mg B3: 88.7576 mg B4: 75.6600 mg Package Weight – Site 4 B1: 71.5486 mg B2: 74.2242 mg B3: 76.0001 mg B4: 73.2214 mg B1: 70.6090 mg SUMMARY The 8L- SOIC package is qualified at multiple assembly sites. Packages from different assembly sites are likely to have different materials composition. However, Cypress guarantees that as long as products are being ordered with a Cypress Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT), or “F” (e.g. S25FL127SABMFI100) they meet the requirement of RoHS. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 023407, 121408, 140805, 142801,150403 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 Analysis Report Link/s CoA- SZ8CML As per MSDS As per MSdS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 1 of 27 8L -SOIC Pb-Free Package Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde 0 0 0 0 0 0 0 0 As per MSDS As per MSDS As per MSDS As per MSDS B1. MATERIAL COMPOSITION (Note 3) USING GOLD WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au Fused Silica Solid Epoxy Resin Phenol Resin Antimony Trioxide Crystalline Silica Carbon Black CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1309-64-4 14808-60-7 1333-86-4 Package Weight (mg): Weight by mg 7.7401 0.1900 0.0103 0.0103 0.0193 0.0003 0.0003 0.0234 0.0033 0.0018 0.0006 0.0006 0.0003 0.5300 0.0700 45.3807 6.1400 6.7479 0.7982 1.8420 0.4912 70.0006 % Weight of Substance per Homogeneous Material 97.3513% 2.3897% 0.1295% 0.1295% 96.9850% 1.5075% 1.5075% 78.0000% 11.0000% 6.0000% 2.0000% 2.0000% 1.0000% 100.0000% 100.0000% 73.9099% 10.0000% 10.9901% 1.3000% 3.0000% 0.8000% PPM % Weight of Substance per Package 110,572 2,714 147 147 276 4 4 334 47 26 9 9 4 7,571 1,000 648,290 87,714 96,398 11,403 26,314 7,017 11.0572% 0.2714% 0.0147% 0.0147% 0.0276% 0.0004% 0.0004% 0.0334% 0.0047% 0.0026% 0.0009% 0.0009% 0.0004% 0.7571% 0.1000% 64.8290% 8.7714% 9.6398% 1.1403% 2.6314% 0.7017% % Total: 100.0000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 2 of 27 8L -SOIC Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING COPPER WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acylate ester Organic Peroxide Si Cu Fused Silica Phenol Resin Epoxy Resin Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7.7402 0.1900 0.0103 0.0103 0.0192 0.0003 0.0003 0.0234 % Weight of Substance per Homogeneous Material 97.3513% 2.3897% 0.1295% 0.1295% 96.5203% 1.7370% 1.7427% 78.0000% Trade Secret 0.0033 11.0000% 47 Trade Secret 0.0018 6.0000% 26 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0006 0.0006 0.0003 0.5300 0.0300 54.6460 3.0700 3.5305 0.1535 2.0000% 2.0000% 1.0000% 100.0000% 100.0000% 89.0000% 5.0000% 5.7500% 0.2500% 9 9 4 7,576 429 781,096 43,882 50,464 2,194 0.0026% 0.0009% 0.0009% 0.0004% 0.7576% 0.0429% 78.1096% 4.3882% 5.0464% 0.2194% % Total: 100.0000% CAS Number Package Weight (mg): Weight by mg 69.9606 % Weight of Substance per Package PPM 110,635 2,716 147 147 275 5 5 334 11.0635% 0.2716% 0.0147% 0.0147% 0.0275% 0.0005% 0.0005% 0.0334% 0.0047% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 3 of 27 8L -SOIC Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) USING COPPER-PALLADIUM (Cu-Pd) WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Cu Ni Si Mg Nickel Palladium Gold Silver Carbocyclic acrylate Bismaleimide Resin Acrylate Additive Silicon Copper Palladium Silica - SiO2 Epoxy Resin Phenol Resin 14.5448 0.8166 0.0650 0.0150 0.7228 0.0005 0.0003 0.2628 % Weight of Substance per Homogeneous Material 94.1935% 5.2884% 0.4209% 0.0971% 99.8894% 0.0691% 0.0415% 82.8238% 192,748 10,822 861 199 9,579 7 4 3,483 19.2748% 1.0822% 0.0861% 0.0199% 0.9579% 0.0007% 0.0004% 0.3483% Trade Secret 0.0332 10.4633% 440 0.0440% Trade Secret 0.0126 3.9710% 167 0.0167% Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 0.0044 0.0043 1.8430 0.6553 0.0001 49.9629 3.5017 3.0147 1.3867% 1.3552% 100.0000% 99.9847% 0.0153% 88.4623% 6.2000% 5.3377% 58 57 24,424 8,684 1 662,111 46,405 39,951 0.0058% 0.0057% 2.4424% 0.8684% 0.0001% 66.2111% 4.6405% 3.9951% % Total: 100.0000% CAS Number 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Package Weight (mg): Weight by mg 75.4600 PPM % Weight of Substance per Package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 4 of 27 8L -SOIC Pb-Free Package B4. MATERIAL COMPOSITION (Note 3) USING AU WIRE and GREEN MOLD COMPOUND Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acylate ester Organic Peroxide Si Gold Fused Silica Phenol Resin Epoxy Resin Carbon Black CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): 0.7546 0.0185 0.0010 0.0010 0.0121 0.0002 0.0002 0.1346 % Weight of Substance per Homogeneous Material 97.3514% 2.3897% 0.1295% 0.1295% 96.5204% 1.7370% 1.7427% 78.0000% 0.0190 0.0104 0.0035 0.0035 0.0017 2.4166 0.4163 64.0327 3.5973 4.1369 0.1799 Weight by mg 75.7400 9,963 245 13 13 159 3 3 1,778 % Weight of Substance per Package 0.9963% 0.0245% 0.0013% 0.0013% 0.0159% 0.0003% 0.0003% 0.1778% 11.0000% 251 0.0251% 6.0000% 2.0000% 2.0000% 1.0000% 100.0000% 100.0000% 89.0000% 5.0000% 5.7500% 0.2500% 137 46 46 23 31,907 5,496 845,427 47,496 54,620 2,375 0.0137% 0.0046% 0.0046% 0.0023% 3.1907% 0.5496% 84.5427% 4.7496% 5.4620% 0.2375% % Total: 100.0000 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 5 of 27 8L -SOIC Pb-Free Package B5. MATERIAL COMPOSITION (Note 3) USING AU WIRE and GREEN MOLD COMPOUND with NiPdAu-Ag Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Die Wire Adhesive Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cu Fe P Zn Ni Pd Au Ag Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acylate ester Organic Peroxide Si Gold Fused Silica Phenol Resin Epoxy Resin 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Package Weight (mg): II. Type Tube Tape and Reel Others 8.5182 0.2091 0.0113 0.0113 0.0099 0.0002 0.0001 0.0000 0.1074 % Weight of Substance per Homogeneous Material 97.3514% 2.3897% 0.1295% 0.1295% 96.5204% 1.7370% 1.3070% 0.4357% 78.0000% 116,688 2,864 155 155 136 2 2 1 1,471 % Weight of Substance per Package 11.6688% 0.2864% 0.0155% 0.0155% 0.0136% 0.0002% 0.0002% 0.0001% 0.1471% 0.0151 11.0000% 207 0.0207% 0.0083 0.0028 0.0028 0.0014 1.9268 0.4163 54.9655 3.0879 3.7055 6.0000% 2.0000% 2.0000% 1.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 113 38 38 19 26,395 5,702 752,952 42,301 50,761 0.0113% 0.0038% 0.0038% 0.0019% 2.6395% 0.5702% 75.2952% 4.2301% 5.0761% % Total: 100.0000 Weight by mg 72.9999 PPM DECLARATION OF PACKAGING INDIRECT MATERIALS Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 6 of 27 8L -SOIC Pb-Free Package ASSEMBLY Site 2 : Amkor Technology Philippines (P1/P2) Package Qualification Report # 030301, 103507, 124706, 152801 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report Link/s CoA-SZ8Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 7 of 27 8L -SOIC Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING STANDARD MOLD COMPOUND Material Purpose of Use Leadframe Base Material Leadfinish External Plating Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation 31.0808 0.7494 0.0097 0.0389 0.5612 1.3600 % Weight of Substance per Homogeneous Material 95.8101% 2.3101% 0.0299% 0.1199% 1.7300% 100.0000% 383,760 9,253 120 481 6,929 16,792 % Weight of Substance per Package 38.3760% 0.9253% 0.0120% 0.0481% 0.6929% 1.6792% Trade Secret 7440-22-4 Trade Secret Trade Secret Trade Secret 0.2300 0.7800 0.0300 0.0300 0.0300 20.9100% 70.9100% 2.7300% 2.7300% 2.7300% 2,840 9,631 371 371 371 0.2840% 0.9631% 0.0371% 0.0371% 0.0371% 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret 1309-64-4 3.4600 0.1600 2.9687 36.9616 1.2699 1.2699 100.0000% 100.0000% 6.9900% 87.0300% 2.9900% 2.9900% 42,721 1,976 36,655 456,371 15,679 15,679 4.2721% 0.1976% 3.6655% 45.6371% 1.5679% 1.5679% Package Weight (mg): 80.9901 % Total: 100.0000% Substance Composition CAS Number Weight by mg Cu Fe P Zn Ag Pure Sn 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 Resin Ag Metal Oxide Amine Gamma Butyrolactone Si Au Dicyclopentadi SiO2 Phenol Resin Antimony Trioxide PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 8 of 27 8L -SOIC Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING GREEN MOLD COMPOUND Material Purpose of Use Substance Composition 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 35.1610 0.8470 0.0110 0.0430 0.3160 % Weight of Substance per Homogeneo us Material 96.6546% 2.3283% 0.0302% 0.1182% 0.8687% CAS Number Weight by mg PPM % Weight of Substance per Package Leadframe Base Material Cu Fe P Zn Ag Leadfinish External Plating Pure Sn 7440-31-5 1.3640 100.0000% 15,978 1.5978% Ag Epoxy Resin A Epoxy Resin B Lactone Polyoxyprople nediamine 2,6-Diglycidyl phenyl allyl ether oligomer Si Au SiO2 Multi-aromatic Resin Phenol Resin Epoxy Cresol Novolac Carbon Black 7440-22-4 Trade Secret Trade Secret Trade Secret 1.8650 0.1700 0.0970 0.0970 76.9707% 7.0161% 4.0033% 4.0033% 21,847 1,991 1,136 1,136 2.1847% 0.1991% 0.1136% 0.1136% Trade Secret 0.0970 4.0033% 1,136 0.1136% Trade Secret 0.0970 4.0033% 1,136 0.1136% 9.1630 0.1000 30.9060 100.0000% 100.0000% 86.0005% 107,339 1,171 362,047 10.7339% 0.1171% 36.2047% Trade Secret 2.6950 7.4992% 31,570 3.1570% Trade Secret 1.4370 3.9987% 16,834 1.6834% 29690-82-2 0.7190 2.0007% 8,423 0.8423% 1333-86-4 0.1800 0.5009% 2,109 0.2109% % Total: 100.0000% Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation 7440-21-3 7440-57-5 60676-86-0 Package Weight (mg): 85.3650 411,890 9,922 129 504 3,702 41.1890% 0.9922% 0.0129% 0.0504% 0.3702% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 9 of 27 8L -SOIC Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) USING COPPER WIRE Material Purpose of Use Substance Composition 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 79.5644 1.9599 0.1093 0.0327 2.2756 % Weight of Substance per Homogeneou s Material 94.7872 2.3348 0.1302 0.0369 2.7109 CAS Number Weight by mg PPM % Weight of Substance per Package Leadframe Base Material Cu Fe Zn P Ag Leadfinish External Plating Pure Sn 7440-31-5 0.1364 100.0000 1,537 0.1537 Ag Epoxy Resin A Epoxy Resin B Lactone Polyoxyprople nediamine 2,6-Diglycidyl phenyl allyl ether oligomer Si Cu SiO2 Multi-aromatic Resin Phenol Resin Epoxy Cresol Novolac Carbon Black 7440-22-4 Trade Secret Trade Secret Trade Secret 0.0432 0.0039 0.0022 0.0022 77.0000 7.0000 4.0000 4.0000 487 44 25 25 0.0487 0.0044 0.0025 0.0025 Trade Secret 0.0022 4.0000 25 0.0025 Trade Secret 0.0022 4.0000 25 0.0025 7440-21-3 7440-50-8 60676-86-0 0.1586 0.0046 3.8358 100.0000 100.0000 86.0000 1,788 52 43,216 0.1788 0.0052 4.3216 Trade Secret 0.3345 7.5000 3,769 0.3769 Trade Secret 0.1784 4.0000 2,010 0.2010 29690-82-2 0.0892 2.0000 1,005 0.1005 1333-86-4 0.0223 0.5000 251 0.0251 % Total: 100.0000% Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation Package Weight (mg): 88.7576 896,422 22,082 1,231 368 25,638 89.6422 2.2082 0.1231 0.0368 2.5638 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 10 of 27 8L -SOIC Pb-Free Package B4. MATERIAL COMPOSITION (Note 3) USING GOLD WIRE WITH G700LS MOLD COMPOUND AND ROUGHENED NIPDAU LEADFRAME CAS Number Weight by mg 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 9003-36-5 68475-94-5 7440-22-4 96-48-0 26.8150 0.6470 0.0340 0.0230 0.1090 0.0060 0.0080 0.0470 0.0270 0.5170 0.0270 % Weight of Substance per Homogeneou s Material 97.4400% 2.3500% 0.1300% 0.0800% 88.2600% 5.2400% 6.5000% 7.0000% 4.0000% 77.0000% 4.0000% 9046-10-0 0.0270 4.0000% 357 0.0400% Trade Secret 0.0270 4.0000% 357 0.0400% 7440-21-3 7440-57-5 7440-22-4 7440-70-2 1.3520 0.1560 0.0000 0.0000 100.0000% 99.9973% 0.0005% 0.0022% 17869 2062 0 0 1.7900% 0.2100% 0.0000% 0.0000% Trade Secret 5.2740 11.5000% 69707 6.9700% 60676-86-0 1333-86-4 40.3350 0.2290 88.0000% 0.5000% 533109 3027 53.3000% 0.3000% Material Purpose of Use Leadframe Base Material Leadfinish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Cu Fe Zn P Ni Pd Au Epoxy Resin A Epoxy Resin B Ag Lactone Polyoxypropyle nediamine 2,6-Diglycidyl Phenyl Allyl Ether Oligomer Si Au Ag Ca Multi-aromatic Resin SiO2 Filler Carbon Black Package Weight (mg): II. Type Tube Tape and Reel Others 75.6600 % Weight of Substance per Package PPM 354414 8551 449 304 1441 79 106 621 357 6833 357 35.4400% 0.8600% 0.0400% 0.0300% 0.1400% 0.0100% 0.0100% 0.0600% 0.0400% 0.6800% 0.0400% % Total: 100.0000% DECLARATION OF PACKAGING INDIRECT MATERIALS Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 11 of 27 8L -SOIC Pb-Free Package ASSEMBLY Site 3: Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report # 050701, 111403, 120409 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report Link/s CoA-SZ8OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 12 of 27 8L -SOIC Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Hitachi Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Pb Polyimide NBR Bismaleimide Phenol resin Ni Pd Au Acrylic resin Polybutadiene derivative Butadiene copolymer Epoxy resin Acrylate Peroxide Additive Silver Silicon Au Epoxy Resin(1) Epoxy Resin(2) Phenol Resin Carbon black Silica Others 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 Trade Secret 9003-18-3 79922-55-7 28453-20-5 7440-02-0 7440-05-3 7440-57-5 Trade Secret Trade Secret 18.1700 0.4352 0.0280 0.0187 0.0037 0.0168 0.0037 0.0037 0.0019 0.1892 0.0189 0.0019 0.0336 0.0210 % Weight of Substance per Homogeneous Material 97.2700% 2.3300% 0.1500% 0.1000% 0.0200% 0.0900% 0.0200% 0.0200% 0.0100% 90.0900% 9.0100% 0.9000% 8.0000% 5.0000% Trade Secret 0.0084 2.0000% 123 0.0123% Trade Secret Trade Secret Trade Secret Trade Secret 7440-22-4 7440-21-3 7440-57-5 158117-90-9 85954-11-6 26834-02-6 1333-86-4 60676-86-0 Trade Secret 0.0084 0.0168 0.0042 0.0084 0.3192 0.6500 0.1200 1.6800 0.9600 1.6800 0.0960 42.7200 0.8640 2.0000% 4.0000% 1.0000% 2.0000% 76.0000% 100.0000% 100.0000% 3.5000% 2.0000% 3.5000% 0.2000% 89.0000% 1.8000% 123 247 62 123 4,688 9,547 1,763 24,676 14,101 24,676 1,410 627,481 12,691 0.0123% 0.0247% 0.0062% 0.0123% 0.4688% 0.9547% 0.1763% 2.4676% 1.4101% 2.4676% 0.1410% 62.7481% 1.2691% % Total: 100.0000% CAS Number Package Weight (mg): Weight by mg 68.0817 PPM % Weight of Substance per Package 266,885 6,392 411 275 54 247 54 54 28 2,779 278 28 494 308 26.6885% 0.6392% 0.0411% 0.0275% 0.0054% 0.0247% 0.0054% 0.0054% 0.0028% 0.2779% 0.0278% 0.0028% 0.0494% 0.0308% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 13 of 27 8L -SOIC Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING SUMITOMO G631 MOLD COMPOUND and YizBond 9246 DIE ATTACH Material Leadframe Leadfinish Die Attach Purpose of Use Base Material External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Fe Zn P Ni Pd Au Silver Flake Epoxy Acrylate Substituted Polyamine Bisphenol F 2-Ethylhexyl Glycidyl Ether Si Au Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused Silica Fused Silica,crystalline 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 15625-89-5 22.8766 0.5716 0.0435 0.0219 0.0799 0.0019 0.0011 0.1514 0.0144 % Weight of Substance per Homogeneous Material 97.2910% 2.4310% 0.1850% 0.0930% 96.3400% 2.2500% 1.4100% 79.0000% 7.5000% 68490-66-4 0.0019 28064-14-4 2461-15-6 CAS Number Weight by mg % Weight of Substance per Package PPM 317858 7941 604 304 1110 26 16 2103 200 31.7858% 0.7941% 0.0604% 0.0304% 0.1110% 0.0026% 0.0016% 0.2103% 0.0200% 1.0000% 27 0.0027% 0.0144 0.0096 7.5000% 5.0000% 200 133 0.0200% 0.0133% 7440-21-3 7440-57-5 Trade Secret 29690-82-2 3.9404 0.1286 2.2057 2.2057 100.0000% 100.0000% 5.0000% 5.0000% 54750 1787 30647 30647 5.4750% 0.1787% 3.0647% 3.0647% Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 2.2057 2.2057 0.1323 30.6151 4.4114 0.1323 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 30647 30647 1839 425381 61294 1839 3.0647% 3.0647% 0.1839% 42.5381% 6.1294% 0.1839% % Total: 100.0000% Package Weight (mg): 71.9711 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 14 of 27 8L -SOIC Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) USING COPPER WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe Zn P Ni Pd Au Silver Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Silicon Copper Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 28.5963 0.6781 0.0369 0.0243 0.0958 0.0516 0.0012 0.1251 0.0068 0.0101 0.0068 0.0101 0.0085 % Weight of Substance per Homogeneou s Material 97.4798% 2.3117% 0.1256% 0.0829% 64.4841% 34.7222% 0.7937% 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% 5.0000% 461-58-5 Trade Secret 0.0008 0.0008 7440-21-3 7440-50-8 Trade Secret 29690-82-2 Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 CAS Number Package Weight (mg): Weight by mg % Weight of Substance per Package PPM 321,335 7,620 414 273 1,077 580 13 1,406 76 114 76 114 95 32.1335% 0.7620% 0.0414% 0.0273% 0.1077% 0.0580% 0.0013% 0.1406% 0.0076% 0.0114% 0.0076% 0.0114% 0.0095% 0.5000% 0.5000% 10 10 0.0010% 0.0010% 3.6777 0.0396 2.7811 2.7811 100.0000% 100.0000% 5.0000% 5.0000% 41,326 445 31,251 31,251 4.1326% 0.0445% 3.1251% 3.1251% 2.7811 2.7811 0.1669 38.6013 5.5622 0.1669 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 31,251 31,251 1,875 433,760 62,502 1,875 3.1251% 3.1251% 0.1875% 43.3760% 6.2502% 0.1875% % Total: 100.0000% 88.9922 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 15 of 27 8L -SOIC Pb-Free Package II. Type Tube Tape and Reel Others DECLARATION OF PACKAGING INDIRECT MATERIALS Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 16 of 27 8L -SOIC Pb-Free Package ASSEMBLY Site 4: UTAC Thailand Limited (UTL) Package Qualification Report # 134513, 133302, 141703, 142502, 141703 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report Link/s CoA-SZ8UTAC As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 17 of 27 8L -SOIC Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING COPPER PALLADIUM WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe Zn P Ni Pd Au Silver Trimethylbicyclo metharcrylate Bis-1H-pyrrole dione Acrylic acid Silicon Copper Palladium Silica Fused Epoxy resin Epoxy,Cresol Novolac Phenol Novolac Carbon Black 32.4883 0.7835 0.0417 0.0275 0.1453 0.0134 0.0023 0.3059 0.0838 % Weight of Substance per Homogeneo us Material 97.4425% 2.3500% 0.1250% 0.0825% 90.2500% 8.3000% 1.4500% 73.0000% 20.0000% 0.0272 1017237-78-3 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret 29690-82-2 Trade Secret 1333-86-4 CAS Number 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7534-94-3 3006-93-7 Package Weight (mg): Weight by mg % Weight of Substance per Package PPM 454,074 10,951 582 384 2,031 187 32 4,275 1,171 45.4074% 1.0951% 0.0582% 0.0384% 0.1031% 0.0187% 0.0032% 0.4275% 0.1171% 6.5000% 381 0.0381% 0.0021 2.866 0.1017 0.0018 30.1525 2.0795 0.6932 0.5000% 100.0000% 98.2500% 1.7500% 87.0000% 6.0000% 2.0000% 29 40,057 1,421 24 421,427 29,064 9,688 0.0029% 4.0057% 0.1421% 0.0025% 42.1427% 2.9064% 0.9688% 1.6982 0.0347 4.9000% 0.1000% 23,736 484 2.3736% 0.0484% % Total: 100.0000% 71.5486 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 18 of 27 8L -SOIC Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING Au WIRE Material Leadframe Lead Finish Purpose of Use Base Material External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Fe Zn P Pb Ag Sn 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7439-92-1 7440-22-4 7440-22-4 22.1000 0.5600 0.0300 0.0200 0.0000 1.2000 0.9143 % Weight of Substance per Homogeneo us Material 92.4300% 2.3500% 0.1300% 0.0800% 0.0100% 5.0000% 100.0000% Silver 7440-22-4 0.1400 Bisphenol-1 1,4 Bis(2,3epoxypropoxy) Aromatic amine Silicon Au Silica Fused Epoxy resin Epoxy,Cresol Novolac Phenol Novolac Carbon Black 9003-36-5 2425-79-8 Substance Composition CAS Number Weight by mg % Weight of Substance per Package PPM 297,760 7,570 403 266 32 16,107 12,320 29.7800% 0.7600% 0.0400% 0.0300% 0.0000% 1.6100% 1.2300% 77.0000% 1928 0.1900% 0.0300 0.0100 15.0000% 4.0000% 376 100 0.0400% 0.0100% Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret 29690-82-2 0.0100 2.2428 0.2571 40.6400 2.8000 0.9300 4.0000% 100.0000% 100.0000% 87.0000% 6.0000% 2.0000% 100 30,221 3,464 547,538 37,761 12,587 0.0100% 3.0200% 0.3500% 54.7500% 3.7800% 1.2600% Trade Secret 1333-86-4 2.2900 0.0500 4.9000% 0.1000% 30,838 629 3.0800% 0.0600% % Total: 100.0000% Package Weight (mg): 74.2242 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 19 of 27 8L -SOIC Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Gold wire and 8600 Adhesive Material Purpose of Use Substance Composition 7440-50-8 7439-89-6 7440-66-6 7723-14-0 31.7005 0.7508 0.0097 0.0390 % Weight of Substance per Homogeneo us Material 97.5401% 2.3101% 0.0299% 0.1199% CAS Number Weight by mg % Weight of Substance per Package PPM Leadframe Base Material Cu Fe Zn P Lead Finish External Plating Sn 7440-31-5 1.3600 100.0000% 17,895 Silver Di-ester Resin Functionalized Ester Polymeric Compound Silicon Gold Silica Fused Phenol Resin Epoxy Resin Epoxy, Cresol Novolac Carbon Black 7440-22-4 Trade Secret Trade Secret 0.3178 0.0091 87.5000% 2.5000% 4,182 119 1.7895% 0.4182% 0.0120% 0.0272 7.5000% 358 0.0358% 0.0091 5.0853 0.3388 31.1725 1.8176 2.5447 2.5000% 100.0000% 100.0000% 85.7500% 5.0000% 7.0000% 119 66,911 4,458 410,164 23,916 33,483 0.0120% 6.6912% 0.4458% 41.0164% 2.3916% 3.3483% 0.7271 0.0909 2.0000% 0.2500% 9,567 1,196 0.9567% 0.1196% % Total: 100.0000% Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation 417,112 9,879 128 513 41.7111% 0.9879% 0.0128% 0.0513% Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 29690-82-2 1333-86-4 Package Weight (mg): 76.0001 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 20 of 27 8L -SOIC Pb-Free Package B4. MATERIAL COMPOSITION (Note 3) Using CuPd Wire and 8600 Adhesive Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Fe Zn P Pd Ag Sn 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7439-92-1 7440-22-4 7440-22-4 22.1000 0.5600 0.0300 0.0200 0.0010 1.2000 0.9143 % Weight of Substance per Homogeneo us Material 92.4300% 2.3500% 0.1300% 0.0800% 0.0100% 5.0000% 100.0000% Silver Octahydro-4.7methano1 H Pt-2-ylmethacrylate Isobomyl acrylate Bis (alpha..alphaDimet Silicon Copper Palladium Silica Fused Epoxy resin Epoxy,Cresol Novolac Phenol Novolac Carbon Black 7440-22-4 0.5400 0.0400 7534-94-3 Substance Composition CAS Number Weight by mg % Weight of Substance per Package PPM 298,626 7592 404 267 32 16154 12356 29.8600% 0.7600% 0.0400% 0.0300% 0.0010% 1.6200% 1.2500% 81.5000% 6.0000% 7313 538 0.7300% 0.0500% 0.0400 6.0000% 538 0.0500% 15888-33-5 0.0400 6.0000% 538 0.0500% 80-43-3 0.0030 0.5000% 45 0.0090% 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret 29690-82-2 1.5494 0.2500 0.0018 40.6387 2.8024 0.9341 100.0000% 98.2500% 1.7500% 87.0000% 6.0000% 2.0000% 20,938 3414 61 549,131 37,871 12,624 2.0900% 0.3400% 0.0100% 54.9100% 3.7900% 1.2600% Trade Secret 1333-86-4 2.2886 0.0467 4.9000% 0.1000% 30,927 631 3.0900% 0.0600% % Total: 100.0000% 42594-17-2 Package Weight (mg): 74.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 21 of 27 8L -SOIC Pb-Free Package B5. MATERIAL COMPOSITION (Note 3) Dual Die, G600 MC,8200T D/A and Au wire Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die (1+2) Wire Circuit Interconnect Mold Compound Encapsulation Cu Fe Zn P Pb Ag 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7439-92-1 7440-22-4 22.1000 0.5600 0.0300 0.0200 0.0000 1.2000 % Weight of Substance per Homogeneo us Material 92.4300% 2.3500% 0.1300% 0.0800% 0.0100% 5.0000% Sn 7440-02-0 0.9143 Silver 7440-22-4 Exo-1,7,7trimeththylbicycl eo (2.2.1) hept2-yl methacrylate Substance Composition Bis-1H-pyrrole dione Acrylic acid Silicon Au Silica Fused Epoxy resin Epoxy,Cresol Novolac Phenol Novolac Carbon Black CAS Number Weight by mg % Weight of Substance per Package PPM 301819 7673 408 269 33 16326 30.1800% 0.7700% 0.0400% 0.0300% 0.0000% 1.6300% 100.0000% 12488 1.2500% 0.2400 73.0000% 3269 0.3300% 7534-94-3 0.0700 20.0000% 896 0.0900% 3006-93-7 0.0200 6.5000% 291 0.0300% 1017237-78-3 7440-21-3 7440-57-5 60676-86-0 Trade Secret 29690-82-2 0.0000 1.1000 0.2600 40.63518 2.802426 0.934142 0.5000% 100.0000% 100.0000% 87.0000% 6.0000% 2.0000% 22 15059 3512 555003 38276 12759 0.0000% 1.5100% 0.3500% 55.5000% 3.8300% 1.2800% Trade Secret 1333-86-4 2.288648 0.046707 4.9000% 0.1000% 31259 638 3.1300% 0.0500% % Total: 100.0000% Package Weight (mg): 73.2214 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 22 of 27 8L -SOIC Pb-Free Package II. Type Tube Tape and Reel Others DECLARATION OF PACKAGING INDIRECT MATERIALS Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R ASSEMBLY Site 5: Lingsen Manufacturing (LP) Package Qualification Report # (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report Link/s CoA- SZLP As per MSDS As per MSdS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 23 of 27 8L -SOIC Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING Au WIRE Material Purpose of Use Substance Composition 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 17.1229 0.4060 0.0176 0.0176 0.0882 % Weight of Substance per Homogeneous Material 97.0000% 2.3000% 0.1000% 0.1000% 0.5000% 1.3100 100.0000% 18553 1.8553% CAS Number Weight by mg PPM % Weight of Substance per Package Leadframe Base Material Cu Fe P Zn Ag Lead Finish External Plating Sn 7440-31-5 Ag Epoxy resin A Epoxy resin B Diluent A Diluent B Hardener Dicyandiamide Organic Peroxide Si Au Fused Silica Epoxy Resin Epoxy Cresol Novolac Phenol Resin Carbon Black 7440-22-4 9003-36-5 Trade secret Trade secret Trade secret Trade secret 461-58-5 3006-86-8 7440-21-3 7440-57-5 60676-86-0 Trade secret 0.4875 0.0390 0.0390 0.0325 0.0325 0.0130 0.0032 0.0032 8.0000 0.2000 36.3774 2.5678 75.0000% 6.0000% 6.0000% 5.0000% 5.0000% 2.0000% 0.5000% 0.5000% 100.0000% 100.0000% 85.0000% 6.0000% 6904 552 552 460 460 184 46 46 113329 2806 515192 36366 0.6904% 0.0552% 0.0552% 0.0460% 0.0460% 0.0184% 0.0046% 0.0046% 11.3299% 0.2804% 51.5192% 3.6366% 29690-82-2 1.0699 2.5000% 15152 1.5152% Trade secret 1333-86-4 2.5678 0.2139 6.0000% 0.5000% 36367 3030 3.6366% 0.3030% % Total: 100.0000% Die Attach Die Wire Adhesive Circuit Interconnect Mold Compound Encapsulation Package Weight (mg): II. Type Tube Tape and Reel Others 70.6090 242501 5750 250 250 1250 24.2501% 0.5750% 0.0250% 0.0250% 0.1250% DECLARATION OF PACKAGING INDIRECT MATERIALS Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 24 of 27 8L -SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. 8L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04305 Description of Change ** *A ECN No. Orig. of Change 390185 GFJ 2610922 MAHA *B DCON 3040415 HLR *C 3377471 EBZ *D 3414374 HLR Changed CML to WEB in distribution list. Changed the % composition of Leadfinish on Assembly Site 1. Added package weight B2 for Site 3. Added QTP#111403 for Assembly Site- 3. Added B2: Material Composition table for Site-3 Updated the material composition table to reflect 4 decimal places on values. New document Updated Cypress logo. Revised the first sentence of Summary to “The 8L- SOIC package is qualified at three assembly sites.”. Added data for Assembly site 3. Added the following for Assembly Site 1: 1. CAS numbers for Fused Silica, Antimony Trioxide, Crystalline Silica, and Carbon Black. 2. “% weight of substance per Homogeneous Material” and “% Weight of Substance per Package” on the Material Composition table. 3. Completed the RoHS Substances namely: Lead, Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. Added the following for Assembly Site 2: 1. CAS numbers for Silica and Antimony Trioxide. 2. “% weight of substance per Homogeneous Material” and “% Weight of Substance per Package” on the Material Composition table. 3. Completed the RoHS Substances namely: Lead, Cadmium, Mercury, Chromium VI, PBB and PBDE on the Declaration of Packaging Indirect Materials table. Added Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 25 of 27 8L -SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. *E 8L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04305 ECN No. Orig. of Change 3605695 JARG COPI *F 3636789 JARG *G 3920428 HLR *H 4033421 YUM *I 4063009 JARG *J *K *L 4087057 YUM 4285027 JSO 4450719 AWP/ HLR *M 4566656 PRCH/ HLR *N *O 4575908 PRCH 4766877 HLR Description of Change Added Assembly Site 2-B2 – Amkor Assembled using Green Mold Compound Added Assembly Site 1-B2 – CML Assembled using Copper Wire in reference to QTP 121408 Added Assembly Site 3-B3 – OSE Taiwan Assembled using Copper Wire in reference to QTP 120409 Changed Au to Cu for the material composition table Assembly Site 1-B2. Corrected the total weight of Assembly Site 1 – B2 Copper Wire composition. Added Assembly site name in the Assembly heading. Changed Assembly Code to Assembly Site Name. Updated Assembly Site 1:B2 to reflect correct material composition table based on QTP121408. Added Material Composition for Assembly Site 2 – B3 for Amkor Philippines using Copper (Cu) wire in reference to QTP 124706. Added “P1/P2” in the assembly heading in site 2. Added assembly site 4 Added Material Composition (B3) (Cu-Pd) wire on Assembly Site1-Cypress Manufacturing Limited referenceQTP#140805. Added B4 on Assembly Site 1 in reference to QTP No. 142801. Added Material Composition B2 to Site 4, Added QTP#133302 to site 4 Added new material declaration for UTL, added 841LMISR4 D/A material for the Panasonic qual Added Package Code – SW for UTL SOIC. Added material composition for Assembly Site 4.B2 – Reference QTP No. 141703 Added 8600 D/A material to UTL QTP# 142502 B4 Added B5 Material Composition on Assembly Site 1 in reference to QTP No. 150403. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 26 of 27 8L -SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. 8L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04305 Description of Change *P *Q *R ECN No. Orig. of Change 4790789 PRCH 4806552 PRCH 4864615 PRCH *S DCON 4910459 UDR *T 5007155 HLR *U *V 5157936 CHAL 5286784 CHAL Removed distribution and posting. Added QTP#152801 and B4 in Material Composition under Assembly Site 2 Changed the substances with “-------------“to “Trade Secret”. Added 8L SOIC (SOC008) ChipMOS & ZKT assembly Remove 8L SOIC (SOC008) ChipMOS & ZKT assembly (created a separate spec for SOC008 (002-12918) Add Lingsen 8l SOIC Add QTP# 141703 to site 4 B2 Added QTP#141703 Bosch dual die package qual Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04305 Rev.*V Page 27 of 27