CYStech Electronics Corp. High Speed Switching Transistor BVCEO IC RCESAT BTC5103I3 Features Spec. No. : C651I3 Issued Date : 2005.10.05 Revised Date :2009.02.04 Page No. : 1/5 60V 5A 110mΩ • Low VCE(sat), VCE(sat)=0.33 V(typical), at IC / IB = 3A / 0.3A • High Switching Speed • Wide SOA • Complementary to BTA1952I3 • RoHS compliant package Symbol Outline BTC5103I3 TO-251 B：Base C：Collector E：Emitter B CC E Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation (TA=25℃) Power Dissipation (TC=25℃) Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC ICP Pd Tj Tstg Limits 100 60 6 5 9 *1 1 30 *2 150 -55~+150 Note : *1. Single Pulse Pw=100ms *2. Printed circuit board, 1.7mm thick, collector copper plating 10mm*10mm or larger BTC5103I3 Unit V V V A W °C °C CYStek Product Specification CYStech Electronics Corp. Spec. No. : C651I3 Issued Date : 2005.10.05 Revised Date :2009.02.04 Page No. : 2/5 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE 1 *hFE 2 fT Cob Min. 100 60 6 82 30 - Typ. 0.33 30 80 Max. 10 10 0.4 1.2 270 - Unit V V V μA μA V V MHz pF Test Conditions IC=1mA, IE=0 IC=1mA, IB=0 IE=1mA, IC=0 VCB=100V, IE=0 VEB=5V, IC=0 IC=3A, IB=0.3A IC=3A, IB=0.3A VCE=2V, IC=1A VCE=2V, IC=3A VCE=5V, IC=1A, f=30MHz VCB=10V, f=1MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Ordering Information Device BTC5103I3 BTC5103I3 Package TO-251 (RoHS compliant) Shipping Marking 80 pcs / tube, 50 tubes / box C5103 CYStek Product Specification Spec. No. : C651I3 Issued Date : 2005.10.05 Revised Date :2009.02.04 Page No. : 3/5 CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 10000 Saturation Voltage---(mV) Current Gain---HFE VCE(SAT) 100 VCE=2V 1000 IC=20IB 100 10 IC=10IB 1 10 1 10 100 1000 1 10000 Collector Current---IC(mA) 1000 10000 On Vottage vs Collector Current 10000 10000 VBE(ON)@VCE=2V VBE(SAT) @ IC=10IB On Voltage---(mV) Saturation Voltage---(mV) 100 Collector Current---IC(mA) Saturation Voltage vs Collector Current 1000 100 1000 100 1 10 100 1000 Collector Current---IC(mA) 10000 1 Power Derating Curve 10 100 1000 Collector Current---IC(mA) 10000 Power Derating Curve 1.2 35 1 30 Power Dissipation---PD(W) Power Dissipation---PD(W) 10 0.8 0.6 0.4 0.2 25 20 15 10 5 0 0 0 BTC5103I3 50 100 150 Ambient Temperature---TA(℃) 200 0 50 100 150 200 Case Temperature---TC(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C651I3 Issued Date : 2005.10.05 Revised Date :2009.02.04 Page No. : 4/5 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature BTC5103I3 Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. CYStek Product Specification Spec. No. : C651I3 Issued Date : 2005.10.05 Revised Date :2009.02.04 Page No. : 5/5 CYStech Electronics Corp. TO-251 Dimension A B C Marking: D C5103 F G 3 K E I H 2 1 Style: Pin 1.Base 2.Collector 3.Emitter 3-Lead TO-251 Plastic Package CYStek Package Code: I3 J *: Typical Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2441 0.2677 0.2677 0.2835 DIM A B C D E F Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.20 6.80 6.80 7.20 DIM G H I J K Inches Min. Max. 0.2559 *0.1811 0.0449 0.0346 0.2047 0.2165 Millimeters Min. Max. 6.50 *4.60 1.14 0.88 5.20 5.50 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: KFC; pure tin plated • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTC5103I3 CYStek Product Specification