ETC 2SB0937/2SB0937A(2SB937/2SB937A)

Power Transistors
2SB0937, 2SB0937A (2SB937, 2SB937A)
Silicon PNP epitaxial planar type Darlington
Unit: mm
For power amplification and switching
Complementary to 2SD1260 and 2SD1260A
emitter voltage 2SB0937A
10.0±0.3
Unit: mm
–60
V
–80
Emitter to base voltage
VEBO
–5
V
Peak collector current
ICP
–4
A
Collector current
IC
–2
A
Collector power TC=25°C
dissipation
Ta=25°C
Tj
Storage temperature
Tstg
150
˚C
–55 to +150
˚C
Symbol
2SB0937
current
2SB0937A
Collector cutoff
2SB0937
current
2SB0937A
Emitter cutoff current
Collector to emitter
2SB0937
voltage
2SB0937A
Forward current transfer ratio
6.0±0.3
1.0±0.1
R0.5
R0.5
0 to 0.4
1.1 max.
5.08±0.5
1
2
1:Base
2:Collector
3:Emitter
N Type Package (DS)
3
(TC=25˚C)
Parameter
Collector cutoff
3.4±0.3
2.54±0.3
W
1.3
■ Electrical Characteristics
8.5±0.2
0.8±0.1
35
PC
Junction temperature
2.0
V
–80
VCEO
1:Base
2:Collector
3:Emitter
N Type Package
3
14.7±0.5
2SB0937
2
+0.4
Collector to
–60
VCBO
1
Unit
3.0–0.2
2SB0937A
Ratings
4.4±0.5
base voltage
5.08±0.5
+0
2SB0937
10.5min.
2.54±0.3
(TC=25˚C)
Symbol
Collector to
0.5max.
1.5–0.4
Parameter
1.1max.
0.8±0.1
10.0±0.3
■ Absolute Maximum Ratings
1.5max.
2.0
●
High foward current transfer ratio hFE
High-speed switching
N type package enabling direct soldering of the radiating fin to
the printed circuit board, etc. of small electronic equipment.
4.4±0.5
●
1.0±0.1
1.5±0.1
6.0±0.5
■ Features
●
3.4±0.3
8.5±0.2
Conditions
min
typ
max
VCB = –60V, IE = 0
–1
VCB = –80V, IE = 0
–1
VCE = –30V, IB = 0
–2
VCE = –40V, IB = 0
–2
IEBO
VEB = –5V, IC = 0
–2
VCEO
IC = –30mA, IB = 0
hFE1
VCE = –4V, IC = –1A
1000
hFE2*
VCE = –4V, IC = –2A
2000
ICBO
ICEO
–60
Unit
mA
mA
mA
V
–80
10000
Base to emitter voltage
VBE
VCE = –4V, IC = –2A
–2.8
V
Collector to emitter saturation voltage
VCE(sat)
IC = –2A, IB = –8mA
–2.5
V
Transition frequency
fT
VCE = –10V, IC = – 0.5A, f = 1MHz
Turn-on time
ton
Storage time
tstg
Fall time
tf
*h
FE2
Internal Connection
Rank classification
Rank
hFE2
Q
IC = –2A, IB1 = –8mA, IB2 = 8mA
P
20
MHz
0.4
µs
1.5
µs
0.5
µs
C
B
2000 to 5000 4000 to 10000
E
Note)The part numbers in the parenthesis
show conventional part number.
1
Power Transistor
2SB0937, 2SB0937A
PC — Ta
IC — VCE
IC — VBE
–5
(1)
30
20
10
IB=–2.0mA
–1.8mA
–1.6mA
–1.4mA
–1.2mA
–1.0mA
– 0.8mA
–4
–3
– 0.6mA
–2
– 4.0mA
– 0.2mA
–1
25˚C
TC=100˚C
–4
–25˚C
–2
0
0
20
40
60
80 100 120 140 160
0
0
Ambient temperature Ta (˚C)
–1
–2
–3
–4
VCE(sat) — IC
TC=100˚C
–25˚C
– 0.3
25˚C
– 0.1
– 0.03
– 0.01
– 0.01 – 0.03 – 0.1 – 0.3
–1
–3
TC=100˚C
104
25˚C
1000
–25˚C
103
102
Collector current IC (A)
–1
–3
Area of safe operation (ASO)
–10
ICP
–3
t=1ms
IC
10ms
300ms
– 0.3
– 0.03
-3
–10
–30
2SB0937A
2SB0937
– 0.1
–100 –300 –1000
Collector to emitter voltage VCE
(V)
30
10
3
–1
–3
–10
–30
Rth(t) — t
Thermal resistance Rth(t) (˚C/W)
Non repetitive pulse
TC=25˚C
100
(1) Without heat sink
(2) With a 50 × 50 × 2mm Al heat sink
(1)
102
(2)
10
1
10–1
10–2
10–4
10–3
10–2
10–1
–100
Collector to base voltage VCB (V)
103
–30
300
1
– 0.1 – 0.3
–10
Collector current IC (A)
–100
–3.2
IE=0
f=1MHz
TC=25˚C
3000
10
– 0.01 – 0.03 – 0.1 – 0.3
–10
–2.4
Cob — VCB
Collector output capacitance Cob (pF)
Forward current transfer ratio hFE
–3
–1.6
10000
VCE=–4V
–10
–1
– 0.8
Base to emitter voltage VBE (V)
hFE — IC
IC/IB=250
– 0.01
–1
0
105
–30
–1
–5
Collector to emitter voltage VCE (V)
–100
Collector to emitter saturation voltage VCE(sat) (V)
–6
– 0.1mA
(3)
Collector current IC (A)
–8
(2)
0
2
VCE=–4V
Collector current IC (A)
40
–10
TC=25˚C
(1) TC=Ta
(2) With a 50 × 50 × 2mm
Al heat sink
(3) Without heat sink
(PC=1.3W)
Collector current IC (A)
Collector power dissipation PC (W)
50
1
Time t (s)
10
102
103
104
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the
"Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial
property, the granting of relative rights, or the granting of any license.
(3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(4) The products and product specifications described in this material are subject to change without
notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to
make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, redundant design is recommended,
so that such equipment may not violate relevant laws or regulations because of the function of our
products.
(6) When using products for which dry packing is required, observe the conditions (including shelf life
and after-unpacking standby time) agreed upon when specification sheets are individually exchanged.
(7) No part of this material may be reprinted or reproduced by any means without written permission
from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic
semiconductor products best suited to their applications.
Due to modification or other reasons, any information contained in this material, such as available
product types, technical data, and so on, is subject to change without notice.
Customers are advised to contact our semiconductor sales office and obtain the latest information
before starting precise technical research and/or purchasing activities.
B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but
there is always the possibility that further rectifications will be required in the future. Therefore,
Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material.
C. These materials are solely intended for a customer's individual use.
Therefore, without the prior written approval of Panasonic, any other use such as reproducing,
selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR