TI PTD08A010W

PTD08A010W
www.ti.com
SLTS285B – MAY 2007 – REVISED MARCH 2008
10-A, 4.75-V to 14-V INPUT, NON-ISOLATED,
WIDE-OUTPUT, DIGITAL POWERTRAIN™ MODULE
FEATURES
1
• Up to 10-A Output Current
• 4.75-V to 14-V Input Voltage
• Programmable Wide-Output Voltage
(0.7 V to 3.6 V)
• Efficiencies up to 96%
• Digital I/O
– PWM signal
– INHIBIT
– Current limit flag (FAULT)
– Sychronous Rectifier Enable (SRE)
• Analog I/O
– Temperature
– Output currrent
• Safety Agency Approvals: (Pending)
– UL/IEC/CSA-C22.2 60950-1
• Operating Temperature: –40°C to 85°C
2
APPLICATIONS
•
Digital Power Systems
using UCD9XXX Digital Controllers
DESCRIPTION
The PTD08A010W is a high-performance 10-A rated, non-isolated digital PowerTrain module. This module is the
power conversion section of a digital power system which incorporates TI's UCD7230 MOSFET driver IC. The
PTD08A010W must be used in conjunction with a digital power controller such as the UCD9240 or UCD9110
family. The PTD08A010W receives control signals from the digital controller and provides parametric and status
information back to the digital controller. Together, PowerTrain modules and a digital power controller form a
sophisticated, robust, and easily configured power management solution.
Operating from an input voltage range of 4.75 V to 14 V, the PTD08A010W provides step-down power
conversion to a wide range of output voltages from, 0.7 V to 3.6 V. The wide input voltage range makes the
PTD08A010W particularly suitable for advanced computing and server applications that utilize a loosely
regulated 8-V, 9.6-V or 12-V intermediate distribution bus. Additionally, the wide input voltage range increases
design flexibility by supporting operation with tightly regulated 5-V or 12-V intermediate bus architectures.
The module incorporates output over-current and temperature monitoring which protects against most load faults.
Output current and module temperature signals are provided for the digital controller to permit user defined
over-current and over-temperature warning and fault scerarios.
The module uses double-sided surface mount construction to provide a low profile and compact footprint.
Package options include both through-hole and surface mount configurations that are lead (Pb) - free and RoHS
compatible.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
POWERTRAIN is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
PTD08A010W
www.ti.com
SLTS285B – MAY 2007 – REVISED MARCH 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Standard PTD08A010W Application
Digital Lines
To/From
Digital Controller
12
11
VBIAS PWM
10
9
SRE FAULT
8
INH
VO
VI
1
VO
VI
4
PTD08A010W
+
L
O
A
D
+
[A]
CI1
CI2
330 mF
22 mF
(Recommended) (Required)
GND
TEMP
2
5
IOUT AGND
6
7
GND
3
GND
[A]
CO1
47 mF
(Required)
CO2
330 mF
(Recommended)
GND
Analog Lines To
Digital Controller
UDG-07054
A.
2
CI2 and CO1 are optional when the operating frequency is greater than 500 kHz.
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PTD08A010W
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SLTS285B – MAY 2007 – REVISED MARCH 2008
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
DATASHEET TABLE OF CONTENTS
DATASHEET SECTION
PAGE NUMBER
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
3
ELECTRICAL CHARACTERISTICS TABLE
4
TERMINAL FUNCTIONS
5
TYPICAL CHARACTERISTICS (VI = 12V)
6
TYPICAL CHARACTERISTICS (VI = 5V)
8
TAPE & REEL AND TRAY DRAWINGS
10
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
(Voltages are with respect to GND)
UNIT
VI
Input voltage
16
V
VB
Bias voltage
16
V
TA
Operating temperature range
Over VI range
Twave
Wave soldering temperature
Surface temperature of module body or pins
for 5 seconds maximum
suffix AD
260
Treflow
Solder reflow temperature
Surface temperature of module body or pins
suffix AG
260 (1)
Tstg
Storage temperature
–40 to 85
–55 to 125 (2)
Mechanical shock
Per Mil-STD-883D, Method 2002.3, 1msec,
1/2 sine, mounted
Mechanical vibration
Mil-STD-883D, Method 2007.2, 20-2000 Hz
suffix AD
200
suffix AG
200
(1)
(2)
G
15
Weight
MTBF
°C
Reliability
Per Telcordia SR-332, 50% stress, TA = 40°C, ground benign
Flammability
Meets UL94V-O
3.9
grams
9.4
106 Hr
During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above the
stated maximum.
The shipping tray or tape and reel cannot be used to bake parts at temperatures higher than 65°C.
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SLTS285B – MAY 2007 – REVISED MARCH 2008
ELECTRICAL CHARACTERISTICS
PTD08A010W
TA= 25°C, FSW= 350kHz, VI= 12 V, VO= 3.3 V, VB= VI, CI1= 330 µF, CI2= 22 µF ceramic, CO1= 47 µF ceramic, CO2= 330 µF,
and IO= IO(max) (unless otherwise stated)
PARAMETER
TEST CONDITIONS
PTD08A010W
MIN
UNIT
MAX
IO
Output current
Over VO range
0
10
A
VI
Input voltage range
Over IO range
4.75
14 (1)
V
VOADJ
Output voltage adjust range
Over IO range
0.7 (1)
3.6
V
η
Efficiency
VOPP
VO Ripple (peak-to-peak)
VB
Bias voltage
VB
UVLO
Bias voltage under voltage
lockout
IB
Bias current
VIH
High-level input voltage
VIL
Low-level input voltage
PWM input
TEMP output
25°C, natural convection
TYP
VI = VB = 5 V
IO = 10 A,
fs = 350 kHz
VO = 3.3 V
95%
VO = 2.5 V
92%
VO = 1.8 V
89%
VO = 1.5 V
88%
VO = 1.2 V
86%
VO = 1.0 V
84%
20-MHz bandwidth
20
4.75
VB increasing
4.25
4.5
4.75
VB decreasing
4.0
4.25
4.5
Inhibit (pin 8) to AGND
Standby
4
Switching
34
2.0
SRE, INH, & PWM input levels
Frequency range
300
Pulse width limits
130
Range
-40
Accuracy, -40°C ≤ TA ≤ 85°C
VOL
FAULT output
ILIM
5.5
-4
2.7
(2)
(3)
(4)
(5)
4
0.6
4
Nonceramic
Ceramic
Capacitance Value
22
(2)
47
(3)
Nonceramic
Ceramic
1 (5)
15
330
(2)
330
(3)
V
%
V/A
0.6
10
V
A
3.5
0.1
External input capacitance
°C
mV
15
Gain
Equivalent series resistance (non-ceramic)
(1)
°C
3.3
0.15
Output Impedance
External output capacitance
125
500
0
Offset, IO = 0A, VO = 1.2V
CO
kHz
mV/°C
Accuracy
CI
1000
6
Overcurrent threshold; Reset, followed by auto-recovery
IOUT output
V
10
Low-level output voltage, IFAULT = 4mA
Range
V
ns
Slope
High-level output voltage, IFAULT = 4mA
V
mA
0.8
Offset, TA = 0°C
VOH
mVPP
14
V
21
kΩ
µF
5000 (4)
(3)
µF
mΩ
The maximum input voltage is duty cycle limited to (VO/(130ns × FSW)) or 14 V, whichever is less. The maximum allowable input voltage
is a function of switching frequency.
A 22 µF ceramic input capacitor is required for proper operation. An additional 330 µF bulk capacitor rated for a minimum of 500mA rms
of ripple current is recommended. When operating at frequencies > 500kHz the 22 µF ceramic capacitor is only recommended. Refer to
the UCD9240 controller datasheet and user interface for application specific capacitor specifications.
A 47 µF ceramic output capacitor is required for basic operation. An additional 330 µF bulk capacitor is recommended for improved
transient response. When operating at frequencies > 500kHz the 47 µF ceramic capacitor is only recommended. Refer to the UCD9240
controller datasheet and user interface for application specific capacitor specifications.
5,000 µF is the calculated maximum output capacitance given a 1V/msec output voltage rise time. Additional capacitance or increasing
the output voltage rise rate may trigger the overcurrent threshold at start-up. Refer to the UCD9240 controller datasheet and user
interface for application specific capacitor specifications.
This is the minimum ESR for all non-ceramic output capacitance. Refer to the UCD9240 controller datasheet and user interface for
application specific capacitor specifications.
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SLTS285B – MAY 2007 – REVISED MARCH 2008
TERMINAL FUNCTIONS
TERMINAL
NAME
VI
NO.
1
GND
2
3
DESCRIPTION
The positive input voltage power node to the module, which is referenced to common GND.
This is the common ground connection for the VI and VO power connections.
VO
4
The regulated positive power output with respect to GND.
TEMP
5
Temperature sense output. The voltage level on this pin represents the temperature of the module.
IOUT
6
Current sense output. The voltage level on this pin represents the average output current of the module.
AGND
7
Analog ground return. It is the 0 Vdc reference for the control inputs.
(1)
8
The inhibit pin is a negative logic input that is referenced to AGND. Applying a low-level signal to this pin disables the
module and turns off the output voltage. A 10 kΩ pull-up to 3.3 V or 5 V is required if the INH signal is not used.
FAULT
9
Current limit flag. The Fault signal is a 3.3 V digital output which is latched high after an over-current condition. The
Fault is reset after two complete PWM cycles without an over-current condition (third rising edge of the PWM).
SRE
10
Synchronous Rectifier Enable. This pin is a high impedance digital input. A 3.3 V or 5 V logic level signals is used to
enable the synchronous rectifier switch. When this signal is high, the module will source and sink output current. When
this signal is low, the module will only source current.
PWM
11
This is the PWM input pin. It is a high impedance digital input that accepts 3.3 V or 5 V logic level signals up to 1 MHz.
VBIAS
12
Bias voltage supply required to power internal circuitry. For optimal performance connect VBIAS to VI.
INH
(1)
Denotes negative logic: High = Normal operation, Low = Function active
1
12
11
10
9
8
7
6
5
Texas
Instruments
PTD08A010W
(Top View)
2
3
4
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SLTS285B – MAY 2007 – REVISED MARCH 2008
TYPICAL CHARACTERISTICS (VI = 12 V) (1)
EFFICIENCY vs
LOAD CURRENT
EFFICIENCY vs
LOAD CURRENT
100
100
3.3 V
100
2.5 V
2.5 V
3.3 V
90
80
80
80
1.8 V
1.2 V
60
fSW = 350 kHz
50
VO
3.3V
2.5V
1.8V
1.2V
0.8V
0.8 V
40
1.8 V
70
1.2 V
60
fSW = 500 kHz
VO
3.3V
2.5V
1.8V
1.2V
0.8V
50
0.8 V
40
30
h – Efficiency – %
90
70
2
4
6
IO – Ouput Current – A
8
10
70
1.8 V
60
0.8 V
40
2
4
6
IO – Ouput Current – A
8
10
0
POWER DISSIPATION
vs LOAD CURRENT
POWER DISSIPATION
vs LOAD CURRENT
4
70
1.8 V
60
fSW = 1 MHz
1.2 V
VO
3.3V
2.5V
1.8V
1.2V
0.8V
50
40
fSW = 500 kHz
VO
3.3V
2.5V
1.8V
1.2V
0.8V
3
2
PD – Power Dissipation – W
2.5 V
PD – Power Dissipation – W
3.3 V
2.5 V
1.8 V
1.2 V
1
0.8 V
VO
3.3V
2.5V
1.8V
1.2V
0.8V
3
3.3 V
2.5 V
1.8 V
2
1.2 V
0.8 V
1
0.8 V
30
4
6
IO – Ouput Current – A
8
0
0
10
0
2
4
6
IO – Ouput Current – A
8
10
0
2
4
6
IO – Ouput Current – A
8
Figure 4.
Figure 5.
Figure 6.
POWER DISSIPATION
vs LOAD CURRENT
POWER DISSIPATION
vs LOAD CURRENT
INPUT BIAS CURRENT vs
SWITCHING FREQUENCY
4
4
90
3.3 V
2.5 V
PD – Power Dissipation – W
VO
3.3V
2.5V
1.8V
1.2V
0.8V
1.8 V
2
1.2 V
0.8 V
1
10
3.3 V
fSW = 1 MHz
fSW = 750 kHz
VO
3.3V
2.5V
1.8V
1.2V
0.8V
3
2.5 V
IBIAS – Input Bias Current – mA
h – Efficiency – %
10
EFFICIENCY vs
LOAD CURRENT
80
PD – Power Dissipation – W
8
Figure 3.
3.3 V
3
4
6
IO – Ouput Current – A
Figure 2.
fSW = 350 kHz
2
2
Figure 1.
4
0
VO
3.3V
2.5V
1.8V
1.2V
0.8V
30
0
100
90
fSW = 750 kHz
1.2 V
50
30
0
2.5 V
3.3 V
90
h – Efficiency – %
h – Efficiency – %
EFFICIENCY vs
LOAD CURRENT
1.8 V
1.2 V
2
0.8 V
1
80
60
40
VI = 12 V
0
0
0
2
4
6
IO – Ouput Current – A
8
Figure 7.
(1)
6
10
0
2
4
6
IO – Ouput Current – A
8
Figure 8.
10
20
300
400
500
600
700
800
900
fSW – Switching Frequency – kHz
1000
Figure 9.
The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter.
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SLTS285B – MAY 2007 – REVISED MARCH 2008
TYPICAL CHARACTERISTICS (VI = 12 V)
Safe Operating Area (1)
AMBIENT TEMPERATURE
vs LOAD CURRENT
90
AMBIENT TEMPERATURE
vs LOAD CURRENT
90
90
400 LFM
400 LFM
TA – Ambient Temperature – °C
100 LFM
200 LFM
70
Nat Conv
60
50
fSW = 350 kHz
VO = 3.3 V
40
400LFM
200LFM
100LFM
Nat conv
30
80
200 LFM
70
100 LFM
Nat Conv
60
50
fSW = 500 kHz
VO = 3.3 V
40
400LFM
200LFM
100LFM
Nat conv
30
20
2
4
6
IO – Ouput Current – A
8
10
60
50
fSW = 350 kHz
VO = 1.2 V
40
Nat conv
20
0
2
4
6
IO – Ouput Current – A
Figure 10.
8
10
0
2
4
6
IO – Ouput Current – A
Figure 11.
AMBIENT TEMPERATURE
vs LOAD CURRENT
90
8
10
Figure 12.
AMBIENT TEMPERATURE
vs LOAD CURRENT
90
200 LFM
400 LFM
80
Nat Conv
70
TA – Ambient Temperature – °C
80
TA – Ambient Temperature – °C
Nat Conv
70
30
20
0
100 LFM
60
50
fSW = 500 kHz
VO = 1.2 V
40
200LFM
100LFM
Nat conv
30
70
Nat Conv
100 LFM
200 LFM
60
50
fSW = 750 kHz
VO = 1.2 V
40
400LFM
200LFM
100LFM
Nat conv
30
20
20
0
2
4
6
IO – Ouput Current – A
8
10
0
2
4
6
IO – Ouput Current – A
Figure 13.
(1)
TA – Ambient Temperature – °C
80
80
TA – Ambient Temperature – °C
AMBIENT TEMPERATURE
vs LOAD CURRENT
8
10
Figure 14.
The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.
For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for more
information.
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SLTS285B – MAY 2007 – REVISED MARCH 2008
TYPICAL CHARACTERISTICS (VI = 5 V) (1)
EFFICIENCY vs
LOAD CURRENT
100
3.3 V
EFFICIENCY vs
LOAD CURRENT
100
2.5 V
1.2 V
0.8 V
70
fSW = 350 kHz
60
VO
3.3V
2.5V
1.8V
1.2V
0.8V
1.8 V
1.2 V
70
0.8 V
fSW = 500 kHz
60
VO
3.3V
2.5V
1.8V
1.2V
0.8V
2
4
6
IO – Ouput Current – A
8
10
2.5 V
80
1.8 V
1.2 V
70
fSW = 750 kHz
0.8 V
60
VO
3.3V
2.5V
1.8V
1.2V
0.8V
50
40
0
40
0
2
4
6
IO – Ouput Current – A
8
10
0
2
4
6
IO – Ouput Current – A
8
Figure 15.
Figure 16.
Figure 17.
EFFICIENCY vs
LOAD CURRENT
POWER DISSIPATION
vs LOAD CURRENT
POWER DISSIPATION
vs LOAD CURRENT
100
2.5 V
fSW = 350 kHz
PD – Power Dissipation – W
80
1.8 V
70
1.2 V
60
fSW = 1 MHz
0.8 V
VO
3.3V
2.5V
1.8V
1.2V
0.8V
50
40
fSW = 500 kHz
VO
3.3V
2.5V
1.8V
1.2V
0.8V
2.5
2.0
1.5
VO
3.3V
2.5V
1.8V
1.2V
0.8V
2.5
PD – Power Dissipation – W
90
10
3.0
3.0
3.3 V
Others
1.0
2.0
1.5
18V
&
2.5 V
1.0
Others
0.5
0.5
0.8 V
30
0
2
4
6
IO – Ouput Current – A
8
0
0
10
0
2
4
6
IO – Ouput Current – A
8
10
0
8
Figure 20.
POWER DISSIPATION
vs LOAD CURRENT
POWER DISSIPATION
vs LOAD CURRENT
INPUT BIAS CURRENT vs
SWITCHING FREQUENCY
3.0
fSW = 750 kHz
50
VO
3.3V
2.5V
1.8V
1.2V
0.8V
PD – Power Dissipation – W
2.5
1.5
1.2 V
1.0
0.8 V
&
3.3 V
0.5
10
fSW = 1 MHz
18V
&
2.5 V
VO
3.3V
2.5V
1.8V
1.2V
0.8V
2.0
4
6
IO – Ouput Current – A
Figure 19.
3.0
2.5
2
Figure 18.
2.0
IBIAS – Input Bias Current – mA
h – Efficiency – %
80
50
40
3.3 V
90
h – Efficiency – %
1.8 V
80
50
PD – Power Dissipation – W
100
2.5 V
90
h – Efficiency – %
h – Efficiency – %
90
3.3 V
EFFICIENCY vs
LOAD CURRENT
All
1.5
1.0
40
30
20
0.5
VI = 5 V
0
0
0
2
4
6
IO – Ouput Current – A
8
Figure 21.
(1)
8
10
0
2
4
6
IO – Ouput Current – A
8
Figure 22.
10
10
300
400
500
600
700
800
900
fSW – Switching Frequency – kHz
1000
Figure 23.
The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter.
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TYPICAL CHARACTERISTICS (VI = 5 V)
Safe Operating Area (1)
AMBIENT TEMPERATURE
vs LOAD CURRENT
AMBIENT TEMPERATURE
vs LOAD CURRENT
90
90
90
80
Nat Conv
70
60
50
fSW = 350 kHz
VO = 3.3 V
40
Nat conv
80
TA – Ambient Temperature – °C
TA – Ambient Temperature – °C
80
TA – Ambient Temperature – °C
AMBIENT TEMPERATURE
vs LOAD CURRENT
Nat Conv
70
60
50
fSW = 500 kHz
VO = 3.3 V
40
Nat conv
30
30
0
2
4
6
IO – Ouput Current – A
8
50
fSW = 500 kHz
VO = 1.2 V
40
Nat conv
20
0
10
60
30
20
20
Nat Conv
70
2
Figure 24.
4
6
IO – Ouput Current – A
8
10
Figure 25.
0
2
4
6
IO – Ouput Current – A
8
10
Figure 26.
AMBIENT TEMPERATURE
vs LOAD CURRENT
90
200 LFM
TA – Ambient Temperature – °C
80
100 LFM
70
Nat Conv
60
50
fSW = 750 kHz
VO = 1.2 V
40
200LFM
100LFM
Nat conv
30
20
0
2
4
6
IO – Ouput Current – A
8
10
Figure 27.
(1)
The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.
For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for more
information.
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SLTS285B – MAY 2007 – REVISED MARCH 2008
APPLICATION INFORMATION
DIgital Power
Vin
+3.3V
FCX491A
VBIAS
FAULT
+3.3V
PWM
VI
Temp-rail1A
PTD08A020W
UCD 7230 Driver
temp
sensor
Commutation
logic
TEMP
VO
SRE
INH
INH
+ Vsens-rail1
- Vsens-rail1
+ Vsens-rail2
- Vsens-rail2
+ Vsens-rail3
- Vsens-rail3
+ Vsens-rail4
- Vsens-rail4
50
51
52
53
54
55
56
57
CS-rail1A
CS-rail2A
CS-rail3A
CS-rail4A
CS-rail1B
CS-rail2B
61
60
59
3
2
1
63
62
4
5
6
Vtrack
15
16
27
28
39
EAp1
EAn1
EAp2
EAn2
EAp3
EAn3
EAp4
EAn4
V33FB
V33A
V33D
V33DIO-1
V33DIO-2
BPCap
58
46
45
7
44
47
CS-rail1A
AddrSens0
AddrSens1
CS-1 A( COMP1)
CS-2 A( COMP2)
CS-3 A( COMP3)
CS-4 A( COMP4)
CS-1B
CS-2B
Vin
Vtrack
Temp
PMBus-Clk
PMBus- Data
PMBus- Alert
PMBus-Ctrl
PowerGood
Agnd-1
Agnd-2
Agnd-3
Dgnd-1
Dgnd-2
Dgnd-3
9 - RESET
FAULT-1A
FAULT-1B
FAULT-2A
FAULT-2B
FAULT-3A
FAULT-4A
SRE-1A
SRE-1B
SRE-2A
SRE-2B
SRE-3A
SRE-4A
17
18
19
20
21
23
Temp-rail1B
FAULT
PWM
SRE
INH
PTD08A020W
IOUT
CS-rail1B
11
12
13
14
25
34
+ Vsens-rail1
- Vsens-rail1
Temp-rail2A
FAULT
PTD08A010W
PWM
SRE
INH
22
24
33
35
29
30
31
TMUX-0
32
TMUX-1
42
TMUX-2
41
FAN- PWM
36
FAN- TACH
38
SYNC-IN
37
SYNC- OUT
40
10
49
48
64
8
26
43
+3.3V
DPWM-1A
DPWM-1B
DPWM-2A
DPWM-2B
DPWM-3A
DPWM-4A
IOUT
CS-rail2A
IOUT
Temp-rail2B
FAULT
PWM
SRE
INH
PTD08A010W
CS-rail2B
IOUT
FAN- PWM
FAN- Tach
Sync-in
Sync-out
Temp-rail3A
FAULT
PWM
SRE
INH
PTD08A010W
CS-rail3A
IOUT
+3.3V
13
14
15
12
1
5
2
4
A0 Com
A1
A2
S2
A3
S1
A4
S0
A5 - EN
A6
A7
CD74HC4051
Temp-rail1A
Temp-rail1B
Temp-rail2A
Temp-rail2B
Temp-rail3A
Temp-rail4A
+ Vsens-rail2
- Vsens-rail2
+ Vsens-rail3
- Vsens-rail3
Temp-rail4A
FAULT
PWM
SRE
INH
PTD08A010W
CS-rail4A
IOUT
+ Vsens-rail4
- Vsens-rail4
UDG-08036
Figure 28. Typical Application Schematic
Figure 28 shows the UCD9240 power supply controller working in a system which requires the regulation of four
independent power supplies. The loop for each power supply is created by the respective voltage outputs feeding
into the Error ADC differential inputs, and completed by DPWM outputs feeding into the UCD7230 drivers which
are shown on the PTD08A010W and PTD08A020W modules.
10
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Product Folder Link(s): PTD08A010W
PTD08A010W
www.ti.com
SLTS285B – MAY 2007 – REVISED MARCH 2008
UCD9240 Graphical User Interface (GUI)
When using the UCD9240 digital controller along with digital PowerTrain modules to design a digital power
system, several internal parameters of the modules are required to run the Fusion Digital Power Designer GUI.
See the plant parameters below for the PTD08A010W and PTD08A020W digital PowerTrain modules.
PTD08A010W Plant Parameters
PTD08A010W Plant Parameters
L (µH)
DCR (mΩ)
Rds-on-hi (mΩ)
Rds-on-lo (mΩ)
0.90
2.2
3.6
3.6
PTD08A020W Plant Parameters
PTD08A020W Plant Parameters
L (µH)
DCR (mΩ)
Rds-on-hi (mΩ)
Rds-on-lo (mΩ)
1.0
1.5
5.0
2.5
Internal output capacitance is present on the digital PowerTrain modules themselves. When using the GUI
interface this capacitance information must be included along with any additional external capacitance. See the
capacitor parameters below for the PTD08A010W and PTD08A020W digital PowerTrain modules.
PTD08A010W Capacitor Parameters
PTD08A010W Capacitor Parameters
C (µF)
ESR (mΩ)
ESL (µH)
Quantity
47
1.5
2.5
1
PTD08A020W Capacitor Parameters
PTD08A020W Capacitor Parameters
C (µF)
ESR (mΩ)
ESL (µH)
Quantity
47
1.5
2.5
2
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): PTD08A010W
11
PTD08A010W
www.ti.com
SLTS285B – MAY 2007 – REVISED MARCH 2008
TAPE & REEL
TRAY
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): PTD08A010W
PACKAGE OPTION ADDENDUM
www.ti.com
4-Apr-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
PTD08A010WAD
ACTIVE
DIP MOD
ULE-TH
EGS
Pins Package Eco Plan (2)
Qty
12
36
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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