PANASONIC XP4313

Composite Transistors
XP04313 (XP4313)
Silicon NPN epitaxial planar type (Tr1)
Silicon PNP epitaxial planar type (Tr2)
0.2±0.05
5
0.12+0.05
–0.02
1.25±0.10
2.1±0.1
4
5˚
• Two elements incorporated into one package
(Transistors with built-in resistor)
• Reduction of the mounting area and assembly cost by one half
1
0.2±0.1
6
■ Features
Unit: mm
(0.425)
For switching/digital circuits
3
2
(0.65) (0.65)
■ Basic Part Number
1.3±0.1
2.0±0.1
• UNR2213 (UN2213) + UNR2113 (UN2113)
Symbol
Rating
Unit
Collector-base voltage
(Emitter open)
VCBO
50
V
Collector-emitter voltage
(Base open)
VCEO
50
V
IC
100
mA
Collector-base voltage
(Emitter open)
VCBO
−50
V
Collector-emitter voltage
(Base open)
VCEO
−50
V
Collector current
Tr2
Overall
Collector current
IC
−100
mA
Total power dissipation
PT
150
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
1: Emitter (Tr1)
2: Base (Tr1)
3: Collector (Tr2)
EIAJ: SC-88
0 to 0.1
Parameter
Tr1
0.9±0.1
■ Absolute Maximum Ratings Ta = 25°C
0.9+0.2
–0.1
10˚
4: Emitter (Tr2)
5: Base (Tr2)
6: Collector (Tr1)
SMini6-G1 Package
Marking Symbol: BZ
Internal Connection
6
5
4
Tr1
Tr2
1
2
3
Note) The part number in the parenthesis shows conventional part number.
Publication date: June 2003
SJJ00178CED
1
XP04313
■ Electrical Characteristics Ta = 25°C ± 3°C
• Tr1
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
50
Collector-emitter voltage (Base open)
VCEO
IC = 2 mA, IB = 0
50
Collector-base cutoff current (Emitter open)
ICBO
VCB = 50 V, IE = 0
Collector-emitter cutoff current (Base open)
ICEO
VCE = 50 V, IB = 0
0.5
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = 6 V, IC = 0
0.1
mA
hFE
VCE = 10 V, IC = 5 mA
Forward current transfer ratio
Collector-emitter saturation voltage
VCE(sat)
Conditions
Min
Typ
VOH
VCC = 5 V, VB = 0.5 V, RL = 1 kΩ
Output voltage low-level
VOL
VCC = 5 V, VB = 3.5 V, RL = 1 kΩ
Unit
V
V
0.1
µA

80
IC = 10 mA, IB = 0.3 mA
Output voltage high-level
Max
0.25
4.9
V
V
0.2
V
Input resistance
R1
−30%
47
+30%
kΩ
Resistance ratio
R1 / R 2
0.8
1.0
1.2

Transition frequency
fT
VCB = 10 V, IE = −2 mA, f = 200 MHz
150
MHz
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
• Tr2
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = −10 µA, IE = 0
−50
Collector-emitter voltage (Base open)
VCEO
IC = −2 mA, IB = 0
−50
Collector-base cutoff current (Emitter open)
ICBO
VCB = −50 V, IE = 0
Collector-emitter cutoff current (Base open)
ICEO
VCE = −50 V, IB = 0
− 0.5
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = −6 V, IC = 0
− 0.1
mA
hFE
VCE = −10 V, IC = −5 mA
Forward current transfer ratio
Collector-emitter saturation voltage
VCE(sat)
Conditions
Min
Typ
VOH
VCC = −5 V, VB = − 0.5 V, RL = 1 kΩ
Output voltage low-level
VOL
VCC = −5 V, VB = −3.5 V, RL = 1 kΩ
Unit
V
V
− 0.1
µA

80
IC = −10 mA, IB = − 0.3 mA
Output voltage high-level
Max
− 0.25
V
− 0.2
V
−4.9
V
Input resistance
R1
−30%
47
+30%
kΩ
Resistance ratio
R1 / R 2
0.8
1.0
1.2

Transition frequency
fT
VCB = −10 V, IE = 1 mA, f = 200 MHz
80
MHz
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Common characteristics chart
PT  Ta
Total power dissipation PT (mW)
250
200
150
100
50
0
0
40
80
120
160
Ambient temperature Ta (°C)
2
SJJ00178CED
XP04313
Characteristics charts of Tr1
VCE(sat)  IC
Collector current IC (mA)
0.9 mA
0.8 mA
0.7 mA
0.6 mA
120
0.5 mA
0.4 mA
80
0.3 mA
0.2 mA
40
0.1 mA
0
0
2
4
6
8
10
12
100
IC / IB = 10
1
−25°C
0.01
0.1
1
10
25°C
−25°C
200
100
0
100
Ta = 75°C
300
1
Collector current IC (mA)
3
2
100
1 000
VIN  IO
100
VO = 5 V
Ta = 25°C
103
Input voltage VIN (V)
4
10
Collector current IC (mA)
IO  VIN
104
f = 1 MHz
IE = 0
Ta = 25°C
Output current IO (µA)
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
Ta = 75°C
25°C
0.1
Cob  VCB
5
VCE = 10 V
10
Collector-emitter voltage VCE (V)
6
hFE  IC
400
Forward current transfer ratio hFE
Ta = 25°C
IB = 1.0 mA
Collector-emitter saturation voltage VCE(sat) (V)
IC  VCE
160
102
VO = 0.2 V
Ta = 25°C
10
1
0.1
10
1
0
0.1
1
10
Collector-base voltage VCB (V)
100
1
0.4
0.6
0.8
1.0
1.2
Input voltage VIN (V)
SJJ00178CED
1.4
0.01
0.1
1
10
100
Output current IO (mA)
3
XP04313
Characteristics charts of Tr2
IC  VCE
VCE(sat)  IC
− 0.9 mA
− 0.8 mA
− 0.7 mA
−120
Collector current IC (mA)
Ta = 25°C
− 0.6 mA
− 0.5 mA
− 0.4 mA
−80
− 0.3 mA
− 0.2 mA
−40
− 0.1 mA
0
−2
0
−4
−6
−8
−10
−12
IC / IB = 10
−10
−1
− 0.1
−25°C
− 0.01
− 0.1
−1
−104
200
−25°C
100
4
3
2
−10
−100
−1 000
Collector current IC (mA)
VIN  IO
VO = −5 V
Ta = 25°C
−103
−100
Input voltage VIN (V)
f = 1 MHz
IE = 0
Ta = 25°C
Output current IO (µA)
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
25°C
0
−1
−100
Ta = 75°C
300
IO  VIN
−102
−10
VO = − 0.2 V
Ta = 25°C
−10
−1
− 0.1
1
0
− 0.1
−1
−10
−100
Collector-base voltage VCB (V)
4
−10
VCE = −10 V
Collector current IC (mA)
Cob  VCB
5
Ta = 75°C
25°C
Collector-emitter voltage VCE (V)
6
hFE  IC
400
Forward current transfer ratio hFE
IB = −1.0 mA
Collector-emitter saturation voltage VCE(sat) (V)
−100
−160
−1
− 0.4
− 0.6
− 0.8
−1.0
−1.2
Input voltage VIN (V)
SJJ00178CED
−1.4
− 0.01
− 0.1
−1
−10
Output current IO (mA)
−100
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and semiconductors described in this material
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if any of the products or technologies described in this material and controlled under the "Foreign
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(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
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permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL