VS-GB150TS60NPbF Datasheet

VS-GB150TS60NPbF
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Vishay Semiconductors
INT-A-PAK “Half-Bridge”
(Ultrafast Speed IGBT), 138 A
FEATURES
• Generation 5 Non Punch Through (NPT)
technology
• Ultrafast: optimized for hard switching speed
• Low VCE(on)
• 10 μs short circuit capability
• Square RBSOA
• Positive VCE(on) temperature coefficient
• HEXFRED® antiparallel diode with ultrasoft reverse
recovery characteristics
• Industry standard package
INT-A-PAK
• Al2O3 DBC
• UL approved file E78996
• Designed for industrial level
PRODUCT SUMMARY
VCES
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
600 V
IC DC
138 A
VCE(on) at 150 A, 25 °C
2.64 V
Speed
8 kHz to 30 kHz
Package
INT-A-PAK
Circuit
Half bridge
BENEFITS
• Benchmark efficiency for UPS and welding application
• Rugged transient performance
• Direct mounting on heatsink
• Very low junction to case thermal resistance
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Collector to emitter voltage
VCES
Continuous collector current
IC
TEST CONDITIONS
MAX.
UNITS
600
V
TC = 25 °C
138
TC = 80 °C
93
Pulsed collector current
ICM
300
Clamped inductive load current
ILM
300
Diode continuous forward current
IF
Gate to emitter voltage
VGE
Maximum power dissipation
PD
Isolation voltage
Operating junction temperature range
Storage temperature range
VISOL
A
TC = 25 °C
TC = 80 °C
178
121
± 20
TC = 25 °C
500
TC = 80 °C
280
Any terminal to case, t = 1 min
2500
V
W
TJ
-40 to +150
TStg
-40 to +150
V
°C
Revision: 10-Jun-15
Document Number: 94502
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown voltage
Collector to emitter voltage
Gate threshold voltage
Collector to emitter leakage current
Diode forward voltage drop
Gate to emitter leakage current
SYMBOL
VBR(CES)
VCE(on)
VGE(th)
ICES
VFM
IGES
TEST CONDITIONS
MIN.
TYP.
MAX.
VGE = 0 V, IC = 500 μA
600
-
-
VGE = 15 V, IC = 100 A
-
2.2
2.7
VGE = 15 V, IC = 150 A
-
2.64
3
VGE = 15 V, IC = 100 A, TJ = 125 °C
-
2.68
3.11
VGE = 15 V, IC = 150 A, TJ = 125 °C
-
3.25
3.79
VCE = VGE, IC = 500 μA
3
4.2
6
VGE = 0 V, VCE = 600 V
-
0.01
0.2
VGE = 0 V, VCE = 600 V, TJ = 150 °C
-
7.5
15
UNITS
V
mA
IC = 100 A
-
1.39
1.78
IC = 150 A
-
1.52
1.91
IC = 100 A, TJ = 125 °C
-
1.31
1.72
IC = 150 A, TJ = 125 °C
-
1.49
2.05
VGE = ± 20 V
-
-
± 200
nA
MIN.
TYP.
MAX.
UNITS
-
2.0
-
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
Turn-on switching loss
SYMBOL
TEST CONDITIONS
Eon
IC = 150 A, VCC = 360 V, VGE = 15 V,
Rg = 10  L = 200 μH, TJ = 25 °C
Turn-off switching loss
Eoff
-
3.9
-
Total switching loss
Etot
-
5.9
-
Turn-on switching loss
Eon
-
2.42
-
Turn-off switching loss
Eoff
-
4.2
-
Total switching loss
Etot
-
6.62
-
-
390
-
tr
-
100
-
td(off)
-
402
-
-
80
-
Turn-on delay time
Rise time
Turn-off delay time
Fall time
td(on)
mJ
IC = 150 A, VCC = 360 V, VGE = 15 V,
Rg = 10  L = 200 μH, TJ = 125 °C
ns
tf
Reverse bias safe operating area
RBSOA
TJ = 150 °C, IC = 300 A,
Rg = 10 VGE = 15 V to 0
Short circuit safe operating area
SCSOA
TJ = 150 °C, VCC = 400 V, VP = 600 V,
Rg = 10 VGE = 15 V to 0
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
IF = 50 A, dIF/dt = 200 A/μs,
VCC = 400 V, TJ = 25 °C
IF = 50 A, dIF/dt = 200 A/μs,
VCC = 400 V, TJ = 125 °C
Fullsquare
10
-
-
-
226
260
ns
-
17
20
A
-
1900
2600
nC
-
290
330
ns
-
25
30
A
-
3600
5000
nC
Revision: 10-Jun-15
Document Number: 94502
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VS-GB150TS60NPbF
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THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNITS
TJ, TStg
-40
-
150
°C
-
0.17
0.25
-
0.19
0.32
-
0.1
-
case to heatsink
-
-
4
case to terminal 1, 2, 3
-
-
3
-
185
-
Operating junction and storage temperature range
IGBT
Junction to case per leg
RthJC
Diode
Case to sink per module
Mounting torque
RthCS
Weight
Nm
g
200
200
Vge = 18V
Vge = 15V
Vge = 12V
150
180
160
140
IcE (A)
IcE (A)
°C/W
Vge = 9V
100
120
100
80
60
50
Tj = 125°C
40
20
0
1
2
3
0
4
1
2
3
4
5
6
7
8
VCE (V)
VGE (V)
Fig. 1 - Typical IGBT Output Characteristics
TJ = 25 °C, tp = 500 μs
Fig. 3 - Typical Transfer Characteristics
VCE = 20 V, tp = 500 μs
200
4.5
VCE, Collector -to-Emitter Voltage (V)
Vge = 18V
Vge = 15V
Vge = 12V
150
IcE (A)
Tj = 25°C
0
0
Vge = 9V
100
50
0
4
Ic = 200A
3.5
Ic = 150A
3
Ic = 75A
2.5
2
1.5
0
1
2
3
4
5
0
30
60
90
120
150
VCE (V)
TJ, Junction Temperature (°C)
Fig. 2 - Typical IGBT Output Characteristics
TJ = 125 °C, tp = 500 μs
Fig. 4 - Typical Collector to Emitter Voltage vs.
Junction Temperature
VGE = 15 V, 500 μs pulse width
Revision: 10-Jun-15
Document Number: 94502
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VS-GB150TS60NPbF
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Vishay Semiconductors
1000
200
td(off)
Switching Time (ns)
IF (A)
150
100
50
Tj = 125°C
td(on)
tf
100
tr
Tj = 25°C
10
0
0.0
0.5
1.0
1.5
0
2.0
40
80
120
160
IC (A)
Fig. 5 - Diode Forward Characteristics, tp = 500 μs
Fig. 8 - Typical Switching Time vs. IC
TJ = 125 °C, L = 200 μH, VCC = 360 V,
Rg = 10 , VGE = 15 V
160
9.0
140
8.0
120
7.0
Energy (mJ)
TC, Case Temperature (°C)
VF (V)
100
80
DC
60
6.0
Eoff
5.0
Eon
4.0
40
3.0
20
2.0
0
0
40
80
120
0
160
10
20
30
40
50
Rg (Ω)
Maximum DC Collector Current (A)
Fig. 9 - Typical Energy Loss vs. Rg
TJ = 125 °C, L = 200 μH, VCC = 360 V,
ICE = 150 A, VGE = 15 V
Fig. 6 - Maximum Collector Current vs.
Case Temperature
4.5
10000
4.0
Eoff
3.0
Energy (mJ)
Energy Time (ns)
3.5
2.5
2.0
1.5
Eon
1000
td(off)
td(on)
tr
100
1.0
tf
0.5
0
10
0
50
100
150
IC (A)
Fig. 7 - Typical Energy Loss vs. IC
TJ = 125 °C, L = 200 μH, VCC = 360 V,
Rg = 10 , VGE = 15 V
0
10
20
30
40
50
RG (Ω)
Fig. 10 - Typical Switching Time vs. Rg,
TJ = 125 °C, L = 200 μH, VCC = 360 V,
ICE = 150 A, VGE = 15 V
Revision: 10-Jun-15
Document Number: 94502
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-GB150TS60NPbF
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Vishay Semiconductors
100
17
16
Total Switching Losses (mJ)
10 ohm
90
80
IRR (A)
70
27 ohm
60
50
40
47 ohm
30
14
13
12
11
10
9
8
7
6
20
40
60
80
100
120
140
0
160
20
30
40
50
RG (Ω)
Fig. 11 - Typical Diode Irr vs. IF
TJ = 125 °C
Fig. 14 - Typical Switching Losses vs. Gate Resistance,
TJ = 125 °C, L = 200 μH, Rg = 10 , VCC = 360 V, VGE = 15 V
10
Ic = 150A
Total Switching Losses (mJ)
80
60
40
Ic = 100A
Ic = 75A
1
20
0
10
20
30
40
0
50
25
50
75
100
125
TJ - Junction Temperature (°C)
RG (Ω)
Fig. 12 - Typical Diode Irr vs. Rg
TJ = 125 °C, IF = 150 A
Fig. 15 - Typical Switching Losses vs. Junction Temperature;
L = 200 μH, Rg = 10 , VCC = 360 V, VGE = 15 V
90
Total Switching Losses (mJ)
8
80
IRR (A)
10
IF (A)
100
IRR (A)
15
70
60
7
6
5
4
3
2
1
0
50
200
400
600
800
1000
1200
1400
dIF / dt (A/μs)
Fig. 13 - Typical Diode Irr vs. dIF/dt
TJ = 125 °C, VCC = 360 V, IF = 150 A, VGE = 15 V
0
40
80
120
160
IC (A)
Fig. 16 - Typical Switching Losses vs. Collector to Emitter Current;
TJ = 125 °C, Rg1 = 10 , Rg2 = 0 , VCC = 360 V, VGE = 15 V
Revision: 10-Jun-15
Document Number: 94502
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VS-GB150TS60NPbF
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Thermal response (Z thJC)
1
D = 0.5
0.1
D = 0.2
D = 0.1
D = 0.05
0.01
D = 0.02
D = 0.01
Notes:
1. Duty Factor D = t1/t2
Single Pulse
(Thermal Response)
0.001
1E-05
1E-04
1E-03
2. Peak Tj = Pdm x ZthJC + Tc
1E-02
1E-01
1E+00
1E+01
t1 , Rectangular Pulse Duration (sec)
Fig. 17 - Maximum Transient Thermal Impedance, Junction to Case (IGBT)
Thermal response (Z thJC)
1
D = 0.5
0.1
D = 0.2
D = 0.1
D = 0.05
0.01
D = 0.02
D = 0.01
Notes:
1. Duty Factor D = t1/t2
Single Pulse
(Thermal Response)
0.001
1E-05
1E-04
1E-03
2. Peak Tj = Pdm x ZthJC + Tc
1E-02
1E-01
1E+00
1E+01
t1 , Rectangular Pulse Duration (sec)
Fig. 18 - Maximum Transient Thermal Impedance, Junction to Case (HEXFRED®)
Revision: 10-Jun-15
Document Number: 94502
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VS-GB150TS60NPbF
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ORDERING INFORMATION TABLE
Device code
VS-
G
B
150
T
S
60
N
PbF
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Insulated Gate Bipolar Transistor (IGBT)
3
-
B = IGBT Generation 5 NPT
4
-
Current rating (150 = 150 A)
5
-
Circuit configuration (T = Half-bridge)
6
-
Package indicator (S = INT-A-PAK)
7
-
Voltage rating (60 = 600 V)
8
-
Speed/type (N = Ultrafast IGBT)
9
-
Lead (Pb)-free
CIRCUIT CONFIGURATION
3
6
7
1
4
5
2
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95543
Revision: 10-Jun-15
Document Number: 94502
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Outline Dimensions
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Vishay Semiconductors
INT-A-PAK IGBT
Ø 6.5
(Ø 0.25)
80 (3.15)
23 (0.91)
14.3
(0.56)
23 (0.91)
5 (0.20)
2.8 x 0.8
(0.11 x 0.03)
14.5
(0.57)
2
3
5
1
66 (2.60)
3 screws M5 x 10
4
35 (1.38)
7
6
17 (0.67)
29 (1.15)
28 (1.10)
9 (0.33)
30
(1.18)
7 (0.28)
DIMENSIONS in millimeters (inches)
37 (1.44)
94 (3.70)
Revision: 27-Mar-13
Document Number: 95543
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Revision: 02-Oct-12
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