Document No. 001-87127 Rev. ** ECN #: 4008892 Cypress Semiconductor Product Qualification Report QTP# 98142 May 2013 Low Voltage Synchronous FIFOs R28 Technology, FAB 3 CY7C4421V/CY7C4425V 64 x 9/64 x 18 CY7C4201V/CY7C4205V 256 x 9/256 x 18 CY7C4211V/CY7C4215V 512 x 9/512 x 18 CY7C4221V/CY7C4225V 1K x 9/1K x 18 CY7C4231V/CY7C4235V 2K x 9/2K x 18 CY7C4241V/CY7C4245V 4K x 9/4K x 18 CY7C4251V 8K x 9 CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Reliability Director (408) 943-2675 Zhaomin Ji Reliability Engineer Principal (408) 432-7021 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 9 Document No. 001-87127 Rev. ** ECN #: 4008892 PRODUCT QUALIFICATION HISTORY Qual Report Description of Qualification Purpose Date Comp 97272 7043XS\7C43Xl 3.3V Sync FIFO Family, Ram28- Fab3 March 1998 98142 Low Voltage Synchronous FIFOs R28 Technology, FAB 3 June 1998 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 9 Document No. 001-87127 Rev. ** ECN #: 4008892 PACKAGE AVAILABILITY PACKAGE 68-Lead Plastic Lead Chip Carrier ASSEMBLY FACILITY SITE Amkor Philippines (PHIL-M) Note: Package Qualification details upon request Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 9 Document No. 001-87127 Rev. ** ECN #: 4008892 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: J68 68 lead Plastic Leaded Chip Carrier (PLCC) G600 Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: None Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Method/Metallization: Grinding Preparation Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8361J Bond Diagram Designation 10-02241 Wire Bond Method: Thermosonic Wire Material/Size: Gold, 1.0mil Thermal Resistance Theta JA °C/W: 65.10 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-14012 Name/Location of Assembly (prime) facility: Amkor Philippines (PHIL-M) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Fault Coverage: 100% Note: Please contact a Cypress Representative for other package availability Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 9 Document No. 001-87127 Rev. ** ECN #: 4008892 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Resu lt P/ P High Temperature Operating Life Dynamic Operating Condition, Vcc = 3.8V, 150 C High Temperature Steady State Life Static Operating condition, Vcc = 3.8V, 150 C P Read & Record Life Test Dynamic Operating Contidion, Vcc = 5.75V, 150 C P Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C/60%RH) P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V, JESD22-A114E Electrostatic Discharge Charge Device Model (ESD-CDM) 500V, JESD22-C101C Latchup Sensitivity – Dynamic In accordance with JEDEC 17 Latchup Sensitivity – Static Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 9 P P P Document No. 001-87127 Rev. ** ECN #: 4008892 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life1,2 Long Term Failure Rate Device Tested/ Device Hours # Fails 3539 Devices 0 200,000 DHRs 0 Activation Energy n/a 0.7 Thermal AF4 n/a 0 PPM 170 27 FITs 1 Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C. 2 Chi-squared 60% estimations used to calculate the failure rate. 3 Thermal Acceleration Factor is calculated from the Arrhenius equation 1⎤ ⎤ ⎡ EA ⎡ 1 AF = exp ⎢ ⎢ where: ⎣ k ⎣ T2 Failure Rate - ⎥ ⎥ T1 ⎦ ⎦ EA =The Activation Energy of the defect mechanism. k = Boltzmann's constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. 4 Failure rate was based on Low Voltage Synchronous, R28 technology, Fab 3 qualifications (QTP 97272, 98142). Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 9 Document No.001-87127 Rev. ** ECN # 4008892 Reliability Test Data QTP # : 98142 Device Mechanism STRESS: Assy Lot # Rej ALPHA-X 3808790 219802189 48 2007 0 ALPHA-X 3808790 219802189 COMP 3 0 ALPHA-X 3808790 3 0 219802189 COMP HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 3.8V) CY7C4245V-JC CY7C4245V-JC STRESS: Samp ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015 (2,200V) CY7C4245V-JC STRESS: Duration ESD-CHARGE DEVICE MODEL (1,000V) CY7C4245V-JC STRESS: Assy Loc HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 3.8V) CY7C4245V-JC STRESS: Fab Lot # ALPHA-X ALPHA-X 3808790 3808790 219802189 219802189 80 500 270 270 0 0 300 45 0 TC COND. C, -65 TO 150C, PRECOND. 192 HRS 30C/60%RH CY7C4245V-JC ALPHA-X 3808790 219802189 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 9 Failure Document No.001-87127 Rev. ** ECN # 4008892 Reliability Test Data QTP #: 97272 Device Mechanism STRESS: Assy Loc Rej PHIL-M 3743164 349705972 48 349705972 COMP 1532 0 PHIL-M 3743164 3 0 PHIL-M 3743164 349705972 COMP 3 0 HI-ACCEL SATURATION TEST (140C, 3.63V), PRECOND. 192 HRS 30C/60%RH CY7C4245V-JC STRESS: Samp ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015 (4400V) CY7C4245V-JC STRESS: Duration ESD-CHARGE DEVICE MODEL (1500V) CY7C4245V-JC STRESS: Assy Lot # HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 3.8V) CY7C4245V-JC STRESS: Fab Lot # PHIL-M 3743164 349705972 128 48 0 HIGH TEMP STEADY STATE LIFE TEST (150C, 3.63V) CY7C4245V-JC PHIL-M 3743164 349705972 80 78 0 CY7C4245V-JC PHIL-M 3743164 349705972 168 78 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 3.8V) CY7C4245V-JC PHIL-M 3743164 349705972 80 130 0 CY7C4245V-JC PHIL-M 3743164 349705972 500 130 0 STRESS: READ & RECORD LIFE TEST (150C, 3.8V) CY7C4245V-JC PHIL-M 3743164 349705972 48 10 0 CY7C4245V-JC PHIL-M 3743164 349705972 80 10 0 CY7C4245V-JC PHIL-M 3743164 349705972 500 10 0 STRESS: TC COND. C, -65 TO 150C, PRECOND. 168 HRS 85C/85%RH CY7C4221V-JC ALPHA-X 3743164 219713130 300 48 0 CY7C4221V-JC ALPHA-X 3743164 219713130 1000 48 0 STRESS: TC COND. C, -65 TO 150C, PRECOND. 192 HRS 30C/60%RH CY7C4221V-AC KOREA-Q 3743164 619711520 300 55 0 CY7C4245V-ASCB KOREA-Q 3743164 619800774 300 54 0 CY7C4245V-ASCB KOREA-Q 3743164 619800774 1000 51 0 CY7C4235V-JC KOREA-A 3744296 619800785 300 54 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 9 Failure Document No.001-87127 Rev. ** ECN # 4008892 Document History Page Document Title: Document Number: QTP # 98142 : LOW VOLTAGE SYNCHRONOUS FIFOS R28 TECHNOLOGY, FAB 3 001-87127 Rev. ECN Orig. of No. Change ** 4008892 ILZ Description of Change Initial Spec Release Qualification report published on Cypress.com is not in spec format. Initiated spec for QTP 98142 and updated current assembly site and package information qualified for package options for this device qualifcation. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 9