CDC341 1-LINE TO 8-LINE CLOCK DRIVER SCAS333D – DECEMBER 1992 – REVISED OCTOBER 1998 D D D D D D D DW PACKAGE (TOP VIEW) Low Output Skew, Low Pulse Skew for Clock-Distribution and Clock-Generation Applications TTL-Compatible Inputs and Outputs Distributes One Clock Input to Eight Outputs Distributed VCC and Ground Pins Reduce Switching Noise High-Drive Outputs (– 48-mA IOH, 48-mA IOL) State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Packaging Options Include Plastic Small-Outline (DW) Packages VCC 1G 2G A P0 P1 VCC 2Y4 2Y3 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 1Y1 1Y2 GND 1Y3 1Y4 GND 2Y1 2Y2 GND description The CDC341 is a high-performance clock-driver circuit that distributes one (A) input signal to eight (Y) outputs with minimum skew for clock distribution. Through the use of the control pins (1G and 2G), the outputs can be placed in a low state regardless of the A input. The propagation delays are adjusted at the factory using the P0 and P1 pins. These pins are not intended for customer use and should be strapped to GND. The CDC341 is characterized for operation from 0°C to 70°C. FUNCTION TABLE INPUTS 1G 2G X L L OUTPUTS A 1Y1 – 1Y4 2Y1 – 2Y4 X L L L L H L L H H L H H L H H L H H H H H Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC-ΙΙΒ is a trademark of Texas Instruments Incorporated. Copyright 1998, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CDC341 1-LINE TO 8-LINE CLOCK DRIVER SCAS333D – DECEMBER 1992 – REVISED OCTOBER 1998 logic symbol† 1G 2G 2 3 G1 G2 1 1 A 4 1 1 2 2 2 2 19 18 16 15 13 12 9 8 1Y1 1Y2 1Y3 1Y4 2Y1 2Y2 2Y3 2Y4 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1G 2G 2 19 3 18 16 15 A 1Y2 1Y3 1Y4 4 13 12 9 8 2 1Y1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2Y1 2Y2 2Y3 2Y4 CDC341 1-LINE TO 8-LINE CLOCK DRIVER SCAS333D – DECEMBER 1992 – REVISED OCTOBER 1998 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Voltage range applied to any output in the high state or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC + 0.5 V Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA Maximum power dissipation at TA = 55°C (in still air) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For more information, refer to the Package Thermal Considerations application note in the ABT Advanced BiCMOS Technology Data Book, literature number SCBD002. recommended operating conditions (see Note 3) MIN MAX UNIT 4.75 5.25 V VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current VCC – 48 mA Low-level output current 48 mA fclock l k Input clock frequency High-level input voltage 2 V 0.8 Input voltage 0 One output bank loaded 80 Both output banks loaded 40 TA Operating free-air temperature NOTE 3: Unused pins (input or I/O) must be held high or low. POST OFFICE BOX 655303 0 • DALLAS, TEXAS 75265 70 V V MHz °C 3 CDC341 1-LINE TO 8-LINE CLOCK DRIVER SCAS333D – DECEMBER 1992 – REVISED OCTOBER 1998 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK TEST CONDITIONS VCC = 4.75 V, VCC = 4.75 V, II = –18 mA IOH = – 3 mA VOH VCC = 5 V, VCC = 4.75 V, IOH = – 3 mA IOH = – 48 mA VOL II IO‡ VCC = 4.75 V, VCC = 5.25 V, IOL = 48 mA VI = VCC or GND VCC = 5.25 V, VO = 2.5 V ICC VCC = 5.25 V,, VI = VCC or GND MIN TA = 25°C TYP† MAX MIN MAX UNIT –1.2 V –1.2 2.5 2.5 3 3 2 2 V 0.5 V ±1 µA – 200 mA ±1 – 50 IO = 0,, – 100 – 200 – 50 Outputs high 2 3.5 Outputs low 24 33 Ci VI = 2.5 V or 0.5 V 3 † All typical values are at VCC = 5 V. ‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second. mA pF switching characteristics, CL = 50 pF (see Figures 1 and 2) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPLH tPHL G Y A Y tsk(o) tsk(p) VCC = 5 V, TA = 25°C MIN TYP MAX VCC = 4.75 V to 5.25 V, TA = 0°C to 70°C MIN MAX 3.5 4.5 3.1 4.9 3.5 4.3 3.1 4.9 2 3.8 2 4 2 3.8 2 4 0.3 0.5 0.6 0.6 0.8 0.9 1 1 UNIT ns ns ns tsk(pr) tr A Y 1.5 ns tf A Y 1.5 ns tpd performance information relative to VCC and temperature variation (see Note 4) DtPLH(TA)† DtPHL(TA)† Temperature drift of tPLH from 0°C to 70°C Temperature drift of tPHL from 0°C to 70°C – 52 ps / 10°C DtPLH(VCC)‡ DtPHL(VCC)‡§ VCC drift of tPLH from 4.75 V to 5.25 V VCC drift of tPHL from 4.75 V to 5.25 V 28 ps / 100 mV – 41 ps / 10°C 20 ps / 100 mV † Virtually independent of VCC ‡ Virtually independent of temperature NOTE 4: The data extracted is from a wide range of characterization material. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CDC341 1-LINE TO 8-LINE CLOCK DRIVER SCAS333D – DECEMBER 1992 – REVISED OCTOBER 1998 PARAMETER MEASUREMENT INFORMATION From Output Under Test CL = 50 pF (see Note A) 500 Ω LOAD CIRCUIT 3V Input (see Note B) 1.5 V 1.5 V 0V tPLH Output tPHL 1.5 V 0.8 V 2V tr 1.5 V 0.8 V VOH VOL tf VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. Figure 1. Load Circuit and Voltage Waveforms A 1G 2G 1Yn tPLH1 tPHL1 tPLH2 tPHL2 2Yn NOTES: A. Output skew, tsk(o), is calculated as the greater of: – The difference between the fastest and slowest of tPLHn (n = 1, 2) – The difference between the fastest and slowest of tPHLn (n = 1, 2) B. Pulse skew, tsk(p), is calculated as the greater of | tPLHn – tPHLn | (n = 1, 2). C. Process skew, tsk(pr), is calculated as the greater of: – The difference between the fastest and slowest of tPLHn (n = 1, 2) across multiple devices under identical operating conditions – The difference between the fastest and slowest of tPHLn (n = 1, 2) across multiple devices under identical operating conditions Figure 2. Waveforms for Calculation of tsk(o), tsk(p), tsk(pr) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CDC341 1-LINE TO 8-LINE CLOCK DRIVER SCAS333D – DECEMBER 1992 – REVISED OCTOBER 1998 MECHANICAL INFORMATION DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 16 PIN SHOWN 0.050 (1,27) 0.020 (0,51) 0.014 (0,35) 16 0.010 (0,25) M 9 0.419 (10,65) 0.400 (10,15) 0.010 (0,25) NOM 0.299 (7,59) 0.293 (7,45) Gage Plane 0.010 (0,25) 1 8 0°– 8° A 0.050 (1,27) 0.016 (0,40) Seating Plane 0.104 (2,65) MAX 0.012 (0,30) 0.004 (0,10) 0.004 (0,10) PINS ** 16 20 24 A MAX 0.410 (10,41) 0.510 (12,95) 0.610 (15,49) A MIN 0.400 (10,16) 0.500 (12,70) 0.600 (15,24) DIM 4040000 / D 02/98 NOTES: A. B. C. D. 6 All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MS-013 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 1998, Texas Instruments Incorporated