AO4615 Complementary Enhancement Mode Field Effect Transistor General Description Features The AO4615 uses advanced trench technology MOSFETs to provide excellent RDS(ON) and low gate charge. The complementary MOSFETs may be used to form a level shifted high side switch, and for a host of other applications. It is ESD protected. Standard product AO4615 is Pb-free (meets ROHS & Sony 259 specifications). AO4615L is a Green Product ordering option. AO4615 and AO4615L are electrically identical n-channel p-channel VDS (V) = 30V -30V -5.7A (V GS=10V) ID = 7.2A (VGS=10V) RDS(ON) RDS(ON) < 24mΩ (VGS=10V) < 39m Ω (VGS = -10V) < 40mΩ (VGS=4.5V) < 62m Ω (VGS = -4.5V) ESD rating: 1500V (HBM) P-channel MOSFET has an additional ROC < 1MΩ for open circuit protection. D1 D2 S2 G2 S1 G1 1 2 3 4 8 7 6 5 D2 D2 D1 D1 G2 G1 ROC S2 SOIC-8 n-channel Absolute Maximum Ratings T A=25°C unless otherwise noted Parameter Max n-channel Symbol VDS Drain-Source Voltage 30 V Gate-Source Voltage ±20 GS Pulsed Drain Current TA=25°C Power Dissipation Avalanche Current B Repetitive avalanche energy 0.1mH Junction and Storage Temperature Range 30 -30 2 2 1.44 1.44 15 20 A 11 20 mJ -55 to 150 -55 to 150 °C EAR TJ, TSTG Thermal Characteristics: n-channel and p-channel Parameter A t ≤ 10s Maximum Junction-to-Ambient A Steady-State Maximum Junction-to-Ambient Steady-State Maximum Junction-to-Lead C A t ≤ 10s Maximum Junction-to-Ambient A Steady-State Maximum Junction-to-Ambient Steady-State Maximum Junction-to-Lead C Alpha & Omega Semiconductor, Ltd. V -4.9 IAR B ±20 Units V 6.1 PD TA=70°C Max p-channel -30 -5.7 ID IDM TA=70°C B p-channel 7.2 TA=25°C Continuous Drain A Current S1 Symbol RθJA RθJL RθJA RθJL Max A W Typ n-ch n-ch n-ch 55 92 37 Units 62.5 °C/W 110 °C/W 50 °C/W p-ch p-ch p-ch 48 87 37 62.5 °C/W 110 °C/W 50 °C/W AO4615 N-Channel Electrical Characteristics (T J=25°C unless otherwise noted) Symbol Parameter STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage Min Conditions ID=250µA, VGS=0V IGSS Gate-Body leakage current VDS=0V, VGS=±20V VGS(th) Gate Threshold Voltage VDS=VGS ID=250µA 1 ID(ON) On state drain current VGS=10V, VDS=5V 20 5 VGS=10V, I D=7.2A TJ=125°C VGS=4.5V, I D=4A gFS Forward Transconductance VSD IS=1A Diode Forward Voltage Maximum Body-Diode Continuous Current VDS=5V, ID=4A DYNAMIC PARAMETERS Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance SWITCHING PARAMETERS Qg(10V) Total Gate Charge Qg(4.5V) Total Gate Charge Qgs Gate Source Charge Qgd Gate Drain Charge tD(on) Turn-On DelayTime tr Turn-On Rise Time V 1 TJ=55°C Static Drain-Source On-Resistance 10 µA 10 µA 2 3 V 20 24 29 35 30 40 mΩ 1 V 3 A 630 pF A 18 522 mΩ S 0.77 VGS=0V, VDS=15V, f=1MHz 110 VGS=0V, VDS=0V, f=1MHz 2.1 3 Ω 11 15 nC 5.3 7 nC pF 75 VGS=10V, VDS=15V, I D=7.2A VGS=10V, VDS=15V, RL=2.1Ω, RGEN=3Ω pF 1.9 nC 4 nC 4.7 7 ns 4.9 10 ns 16.2 22 ns 3.5 7 ns ns nC tD(off) Turn-Off DelayTime tf Turn-Off Fall Time trr Body Diode Reverse Recovery Time IF=7.2A, dI/dt=100A/µs 15.7 20 Body Diode Reverse Recovery Charge IF=7.2A, dI/dt=100A/µs 7.9 10 Qrr Units 30 Zero Gate Voltage Drain Current IS Max VDS=24V, VGS=0V IDSS RDS(ON) Typ A: The value of R θJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The value in any given application depends on the user's specific board design. The current rating is based on the t≤ 10s thermal resistance rating. B: Repetitive rating, pulse width limited by junction temperature. C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. RθJL and RθJC are equivalent terms referring to thermal resistance from junction to drain lead. D. The static characteristics in Figures 1 to 6 are obtained using 80µs pulses, duty cycle 0.5% max. E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA curve provides a single pulse rating. F. Rev 0: July 2005 THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Alpha & Omega Semiconductor, Ltd. AO4615 N-CH TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 30 5V 10V 20 4.5V 25 15 ID(A) ID (A) 20 3.5V 10 5 VDS=5V 16 4V 12 8 125°C 4 VGS=3V 25°C 0 0 0 1 2 3 4 0 5 0.5 2 2.5 3 3.5 4 4.5 150 175 1.6 35 Normalized On-Resistance 40 RDS(ON) (mΩ) 1.5 VGS (Volts) Figure 2: Transfer Characteristics VDS (Volts) Fig 1: On-Region Characteristics VGS=4.5V 30 25 20 15 VGS=10V 1.5 VGS=10V ID=7.2A 1.4 1.3 VGS=4.5V ID=4A 1.2 1.1 1 0.9 0.8 10 0 5 10 15 0 20 25 50 75 100 125 Temperature ( °C) Figure 4: On-Resistance vs. Junction Temperature ID (Amps) Figure 3: On-Resistance vs. Drain Current and Gate Voltage 70 1.0E+01 ID=7.2A 60 1.0E+00 1.0E-01 50 IS Amps RDS(ON) (mΩ) 1 125°C 40 125°C 1.0E-02 25°C 1.0E-03 30 20 1.0E-04 25°C 1.0E-05 10 2 4 6 8 10 VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage Alpha & Omega Semiconductor, Ltd. 0.0 0.2 0.4 0.6 0.8 VSD (Volts) Figure 6: Body diode characteristics 1.0 AO4615 N-CH TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 1000 10 800 Capacitance (pF) VGS (Volts) 8 f=1MHz VGS=0V 900 VDS=15V ID=7.2A 6 4 Ciss 700 600 500 400 300 200 2 Coss 100 0 Crss 0 0 2 4 6 8 10 12 0 Qg (nC) Figure 7: Gate-Charge characteristics 100 100µs 0.1s 1s DC 0.1 1 10 ZθJA Normalized Transient Thermal Resistance 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E) Figure 9: Maximum Forward Biased Safe Operating Area (Note E) D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA RθJA=62.5°C/W 30 20 0 0.001 100 VDS (Volts) 10 25 10 10s 0.1 20 TJ(Max)=150°C TA=25°C 30 10µs 10ms 1 15 40 Power W ID (Amps) 1ms 10 10 VDS (Volts) Figure 8: Capacitance Characteristics TJ(Max)=150°C TA=25°C RDS(ON) limited 5 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 1 0.1 PD Ton Single Pulse 0.01 0.00001 0.0001 0.001 0.01 0.1 1 T 10 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance Alpha & Omega Semiconductor, Ltd. 100 1000 AO4615 P-Channel Electrical Characteristics (T J=25°C unless otherwise noted) Symbol Parameter STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage Conditions Min ID=-250µA, VGS=0V -30 IGSS Gate-Body leakage current VDS=0V, VGS=±5V VGS(th) Gate Threshold Voltage VDS=VGS ID=-250µA -1 ID(ON) On state drain current VGS=-10V, VDS=-5V 30 RDS(ON) Static Drain-Source On-Resistance -5 15 VGS=-10V, I D=-5.7A TJ=125°C VGS=-4.5V, I D=-4A Forward Transconductance VSD Diode Forward Voltage IS=-1A,VGS=0V Maximum Body-Diode Continuous Current VDS=-5V, ID=-5.7A V 32 39 46 56 48 62 13 mΩ mΩ S -1 V 3 A 1250 pF 161 4.5 10 Ω 0.7 1 ΜΩ 18 24 nC 8.9 12 nC Reverse Transfer Capacitance Gate resistance VGS=0V, VDS=0V, f=1MHz Roc Open-circuit protection resistance VGS=5V Gate Source Charge µA A 1035 Crss Qgs -3 µA VGS=0V, VDS=-15V, f=1MHz Rg SWITCHING PARAMETERS Qg(10V) Total Gate Charge (10V) Qg(4.5V) Total Gate Charge (4.5V) -2 -0.77 DYNAMIC PARAMETERS Ciss Input Capacitance Output Capacitance V TJ=55°C gFS Units -1 Zero Gate Voltage Drain Current Coss Max VDS=-24V, VGS=0V IDSS IS Typ pF 99 VGS=-10V, VDS=-15V, I D=-5.7A 0.5 pF 3.8 Qgd Gate Drain Charge 4.1 tD(on) Turn-On DelayTime 8 tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf Turn-Off Fall Time nC nC 11 ns VGS=-10V, VDS=-15V, RL=2.6Ω, RGEN=3Ω 6 12 ns 19.5 26 ns 5.9 12 ns 20.2 27 13.5 18 ns nC trr Body Diode Reverse Recovery Time IF=-5.7A, dI/dt=100A/µs Qrr Body Diode Reverse Recovery Charge IF=-5.7A, dI/dt=100A/µs A: The value of R θJA is measured with the device mounted on 1in22 FR-4 board with 2oz. Copper, in a still air environment with TAA =25°C. The value in θJA any in given dependsdepends on the user's specific design. current is rating basedisonbased the t≤on 10s rating. rating. valu any application a given application on the user's board specific board The design. Therating current thethermal t≤ 10s resistance thermal resistance B: Repetitive rating, pulse width limited by junction temperature. is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. RθJL and RθJC are equivalent terms referring to C. The R θJA θJA θJL thermal resistance from junction to drain lead. D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80µs pulses, duty cycle 0.5% max. D. The static characteristics Figures 1 to 6,12,14 are on obtained using 80µswith pulses, cyclein0.5% E. These tests are performedinwith the device mounted 1 in2 FR-4 board 2oz.duty Copper, a stillmax. air environment with TA=25°C. The SOA E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA curve curve provides a single pulse rating. provides a single pulse rating. F. Rev 0: July 2005 THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Alpha & Omega Semiconductor, Ltd. AO4615 P-CH TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 30 -10V -5V 25 VDS=-5V 20 20 -4V -ID(A) -ID (A) 25 -4.5V -6V 15 -3.5V 10 10 125°C 5 VGS=-3V 5 15 25°C 0 0 0 1 2 3 4 5 0 1 100 Normalized On-Resistance 80 RDS(ON) (mΩ) 3 4 5 6 1.60 90 70 VGS=-4.5V 60 50 VGS=-10V 40 30 VGS=-10V ID=-5.7A 1.40 VGS=-4.5V ID=-4A 1.20 1.00 0.80 20 0 5 10 15 20 0 25 25 50 75 100 125 150 175 Temperature (°C) Figure 4: On-Resistance vs. Junction Temperature -ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage 100 1.0E+01 90 1.0E+00 ID=-5.7A 80 1.0E-01 70 125°C 1.0E-02 125°C -IS (A) RDS(ON) (mΩ) 2 -VGS(Volts) Figure 2: Transfer Characteristics -VDS (Volts) Fig 1: On-Region Characteristics 60 1.0E-03 50 25°C 1.0E-04 40 25°C 1.0E-05 30 1.0E-06 20 3 4 5 6 7 8 9 -VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage Alpha & Omega Semiconductor, Ltd. 10 0.0 0.2 0.4 0.6 0.8 -VSD (Volts) Figure 6: Body-Diode Characteristics 1.0 AO4615 P-CH TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 1500 10 VDS=-15V ID=-5.7A 1250 Capacitance (pF) -VGS (Volts) 8 6 4 2 Ciss 1000 750 500 Coss 0 0 4 8 12 16 0 20 0 -Qg (nC) Figure 7: Gate-Charge Characteristics 10µs 100µs RDS(ON) limited 0.1s 1ms 1s 25 30 TJ(Max)=150°C TA=25°C 20 DC 0.1 1 10 100 -VDS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note E) 10 20 10 10s 0.1 15 30 10ms 1.0 10 40 TJ(Max)=150°C, TA=25°C 10.0 5 -VDS (Volts) Figure 8: Capacitance Characteristics Power (W) -ID (Amps) 100.0 ZθJA Normalized Transient Thermal Resistance Crss 250 D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA RθJA=62.5°C/W 0 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E) In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 1 PD 0.1 Single Pulse 0.01 0.00001 0.0001 0.001 T 0.1 1 10 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance Alpha & Omega Semiconductor, Ltd. 0.01 Ton 100 1000