TPS3839 www.ti.com SBVS193 – JUNE 2012 Ultra-Low Power, Supply Voltage Supervisor Check for Samples: TPS3839 FEATURES DESCRIPTION • • • • • • • The TPS3839 is an ultra-low current, 150-nA (typ) voltage supervisory circuit that monitors a single voltage. The device asserts an active-low reset signal whenever the VDD supply voltage drops below the factory-trimmed reset threshold voltage. The reset output remains asserted for 200 ms (typ) after the VDD voltage rises above the threshold voltage. The TPS3839 is designed to ignore fast transients on the VDD pin. 2 1-mm × 1-mm µSON or 3-Pin SOT23 Package Ultra-Low Supply Current: 150 nA (typ) Operating Supply Voltage: 0.6 V to 6.5 V Ensured Valid RESET for VDD > 0.6 V Push-Pull RESET Output Temperature Range: –40°C to +85°C Factory-Trimmed RESET Threshold Voltages APPLICATIONS • • • • • • Portable and Battery-Powered Equipment Industrial Equipment Cell Phones Glucose Monitors Metering Televisions The ultra-low current consumption of 150 nA makes the TPS3839 ideal for use in low-power and portable applications. The TPS3839 is ensured to have the correct output logic state for supply voltages down to 0.6 V. The device features precision factory-trimmed threshold voltages and extremely low power operation. The TPS3839 is available is a 3-pin SOT23 (DBZ) package or a 4-pin 1-mm × 1-mm (DQN) µSON package. 3.3 V DBZ PACKAGE SOT23-3 (TOP VIEW) C1 0.1 mF VDD VDD TPS3839K33 mP RESET GND GND 1 3 RST RESET DQN PACKAGE 1-mm ´ 1-mm TBD (TOP VIEW) RESET 1 4 VDD NC 2 3 GND VDD 2 GND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2012, Texas Instruments Incorporated PRODUCT PREVIEW 1 TPS3839 SBVS193 – JUNE 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT PREVIEW (1) PRODUCT THRESHOLD VOLTAGE (V) PACKAGE TYPE TOP MARKINGS TPS3839A09DQN 0.900 X2SON TBD TPS3839G12DQN 1.120 X2SON TBD TPS3839G12DBZ 1.120 SOT23 TBD TPS3839E16DQN 1.520 X2SON TBD TPS3839G18DQN 1.670 X2SON TBD TPS3839G18DBZ 1.670 SOT23 TBD TPS3839L30DBZ 2.630 SOT23 TBD TPS3839K33DQN 2.930 X2SON TBD TPS3839K33DBZ 2.930 SOT23 TBD TPS3839G33DQN 3.080 X2SON TBD TPS3839K50DQN 4.380 X2SON TBD TPS3839K50DBZ 4.380 SOT23 TBD For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. VALUE Voltage Current MIN MAX VDD –0.3 7 V On RESET –0.3 7 V 5 mA RESET pin Continuous total power dissipation Temperature (2) Electrostatic discharge (ESD) rating: (1) (2) UNIT See Thermal Information Table Operating ambient, TA –40 +85 Storage, Tstg –65 +150 °C 2 kV 500 V Human body model (HBM) Charge device model (CDM) °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. As a result of the low dissipated power in this device, it is assumed that TJ is equal to TA. THERMAL INFORMATION TPS3839 THERMAL METRIC (1) DRY (µSON) UNITS 6 PINS θJA Junction-to-ambient thermal resistance 293.8 θJCtop Junction-to-case (top) thermal resistance 165.1 θJB Junction-to-board thermal resistance 160.8 ψJT Junction-to-top characterization parameter 27.3 ψJB Junction-to-board characterization parameter 65.8 θJCbot Junction-to-case (bottom) thermal resistance 65.8 (1) 2 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS3839 TPS3839 www.ti.com SBVS193 – JUNE 2012 ELECTRICAL CHARACTERISTICS At TA = –40°C to +85°C, 0.9 V < VDD< 6.5 V, and C1 = 0.1 µF, unless otherwise noted. TEST CONDITIONS VDD Input supply range V(VO) Minimum VDD voltage for valid output IOL = 1 µA IDD Supply current (into VDD pin) Output not connected VOL VOH V(THA) VIT– Vhys Low-level output voltage RESET High-level output voltage RESET MIN 0.9 Hysteresis voltage MAX UNIT 6.5 V 0.6 V 600 mA VDD = 0.9 V to 1.2 V, IOL = 120 µA 0.4 V VDD = 1.2 V to 2.8 V, IOL = 0.5 mA 0.4 V VDD = 2.8 V to 6.5 V, IOL = 2 mA 0.4 V 150 VDD = 0.9 V to 1.8 V, IOH = –50 µA VDD – 0.4 V VDD = 1.8 V to 3.3 V, IOH = –0.5 mA VDD – 0.4 V VDD = 3.3 V to 6.5 V, IOH = –2 mA VDD – 0.4 V Negative-going input threshold accuracy Negative-going threshold voltage TYP –2.0 ±1.0 +2.0 % TPS3839A09 0.882 0.900 0.918 V TPS3839G12 1.098 1.120 1.142 V TPS3839E16 1.490 1.520 1.550 V TPS3839G18 1.637 1.670 1.703 V TPS3839L30 2.577 2.630 2.683 V TPS3839K33 2.871 2.930 2.989 V TPS3839G33 3.018 3.080 3.142 V TPS3839K50 4.292 4.380 4.468 V(SENSE) falling PRODUCT PREVIEW PARAMETER V 10 mV TIMING REQUIREMENTS PARAMETER MIN tW Minimum VDD pulse width to RESET tD RESET delay time (power-up delay) tPHL Propagation delay, VDD falling (power-down delay) TYP MAX 1 120 200 20 UNIT µs 320 ms µs Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS3839 3 TPS3839 SBVS193 – JUNE 2012 www.ti.com PIN CONFIGURATIONS DQN PACKAGE 1-mm × 1-mm TBD (TOP VIEW) RESET 1 4 DBZ PACKAGE SOT23-3 (TOP VIEW) VDD GND NC 2 3 1 3 GND VDD 2 RESET PIN ASSIGNMENTS PIN NO PRODUCT PREVIEW PIN NAME DQN DBZ GND 3 1 Ground DESCRIPTION NC 2 — Do not connect RESET 1 2 Active low RESET output. RESET has a push-pull output drive and is capable of directly driving input pins. This in remains low as long as VDD is below the factory threshold voltage and remains low until a certain time (tD) after VDD rises above the threshold voltage. VDD 4 3 Supply voltage FUNCTIONAL BLOCK DIAGRAM VDD Delay RESET VREF GND Figure 1. TPS3895A Block Diagram 4 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS3839 TPS3839 www.ti.com SBVS193 – JUNE 2012 APPLICATION INFORMATION APPLICATION CIRCUIT Figure 2 shows an example typical application circuit. 3.3 V C1 0.1 mF VDD VDD TPS3839K33 mP RESET RST GND GND VDD TRANSIENT REJECTION The TPS3839 has built-in rejection of fast transients on the VDD pin. Transient rejection is dependent on both transient duration and transient amplitude. Transient amplitude is measured from the bottom of the transient to the negative threshold voltage of the TPS3839, as shown in Figure 3. VTH VDD Transient Amplitude Duration (tW) Figure 3. Voltage Transient Measurement The TPS3839 does not respond to fast-duration, low-amplitude or long-duration, small-amplitude transients. Figure 4 shows the relationship between the transient amplitude and duration required to trigger a reset. Any combination of duration and amplitude above the curve generates a reset signal. FPO Figure 4. TPS3839 Transient Rejection Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS3839 5 PRODUCT PREVIEW Figure 2. Typical Application Circuit TPS3839 SBVS193 – JUNE 2012 www.ti.com INPUT CAPACITOR The TPS3839 uses a unique sampling scheme to maintain an extremely low average quiescent current of 150 nA. The TPS3839 typically only consumes approximately 100 nA of dc current. However, this current rises to approximately 15 µA for about 200 µs while the TPS3839 samples the input voltage. If the source impedance is high then the additional current during sampling may trigger a false reset because of the apparent voltage drop at VDD. For high VDD source or trace impedance applications, it is recommended to add a small 0.1-µF bypass capacitor near the TPS3839 VDD pin. The bypass capacitor effectively keeps the average current at 150 nA and reduces the effects of a high-impedance voltage source. BIDIRECTIONAL RESET PINS Some microcontrollers have bidirectional RESET pins that act both as an input and an output. A series resistor should be placed between the TPS3839 output and the microcontroller RESET pin to protect against excessive current flow when both the TPS3839 and the microcontroller attempt to drive the RESET line. Figure 5 shows the connection of the TPS3839 with a microcontroller using a series resistor to drive a bidirectional RESET line. 3.3 V VCC VDD PP PRODUCT PREVIEW RESET TPS3839K33 RST 47 k: GND Figure 5. Connection to Bidirectional RESET Pin SINGLE ALKALINE CELL MONITORING The low operating voltage and threshold options make the TPS3839 well-suited for monitoring single-cell alkaline battery applications. Figure 6 shows the TPS3839A09 used to disable a boost converter when the cell voltage reaches 0.9 V, which is the end of the discharge voltage for a single alkaline battery cell. When the cell voltage reaches 0.9 V, the TPS61261 enable pin is driven low. This setting disables the TPS61261 and places it in a low-current shutdown state. The combination of the TPS3839 and TPS61261 only consumes 250 nA (typical) from the discharged battery. TPS61261 VIN VOUT 3.3 V at 40 mA 4.7 PH FB L 10 PF One Cell Alkaline 10 PF VDD RESET EN RI GND 5 k: GND TPS3839A09 Figure 6. Disabled Boost Converter 6 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS3839 PACKAGE OPTION ADDENDUM www.ti.com 15-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins TPS3839A09DBZR PREVIEW SOT-23 DBZ 3 TBD Call TI Call TI TPS3839A09DBZT PREVIEW SOT-23 DBZ 3 TBD Call TI Call TI TPS3839A09DQNR PREVIEW X2SON DQN 4 3000 TBD Call TI Call TI TPS3839A09DQNT PREVIEW X2SON DQN 4 250 TBD Call TI Call TI TPS3839E16DBZR PREVIEW SOT-23 DBZ 3 TBD Call TI Call TI TPS3839E16DBZT PREVIEW SOT-23 DBZ 3 TPS3839E16DQNR PREVIEW X2SON DQN 4 TPS3839E16DQNT PREVIEW X2SON DQN TPS3839G12DBZR PREVIEW SOT-23 DBZ TPS3839G12DBZT PREVIEW SOT-23 TPS3839G12DQNR PREVIEW TPS3839G12DQNT PREVIEW TPS3839G18DBZR Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) TBD Call TI Call TI 3000 TBD Call TI Call TI 4 250 TBD Call TI Call TI 3 3000 TBD Call TI Call TI DBZ 3 250 TBD Call TI Call TI X2SON DQN 4 3000 TBD Call TI Call TI X2SON DQN 4 250 TBD Call TI Call TI PREVIEW SOT-23 DBZ 3 3000 TBD Call TI Call TI TPS3839G18DBZT PREVIEW SOT-23 DBZ 3 250 TBD Call TI Call TI TPS3839G18DQNR PREVIEW X2SON DQN 4 3000 TBD Call TI Call TI TPS3839G18DQNT PREVIEW X2SON DQN 4 250 TBD Call TI Call TI TPS3839G33DBZR PREVIEW SOT-23 DBZ 3 TBD Call TI Call TI TPS3839G33DBZT PREVIEW SOT-23 DBZ 3 TBD Call TI Call TI TPS3839G33DQNR PREVIEW X2SON DQN 4 3000 TBD Call TI Call TI TPS3839G33DQNT PREVIEW X2SON DQN 4 250 TBD Call TI Call TI TPS3839K33DBZR PREVIEW SOT-23 DBZ 3 3000 TBD Call TI Call TI TPS3839K33DBZT PREVIEW SOT-23 DBZ 3 250 TBD Call TI Call TI TPS3839K33DQNR PREVIEW X2SON DQN 4 3000 TBD Call TI Call TI TPS3839K33DQNT PREVIEW X2SON DQN 4 250 TBD Call TI Call TI TPS3839K50DBZR PREVIEW SOT-23 DBZ 3 3000 TBD Call TI Call TI TPS3839K50DBZT PREVIEW SOT-23 DBZ 3 250 TBD Call TI Call TI TPS3839K50DQNR PREVIEW X2SON DQN 4 3000 TBD Call TI Call TI TPS3839K50DQNT PREVIEW X2SON DQN 4 250 TBD Call TI Call TI TPS3839L30DBZR PREVIEW SOT-23 DBZ 3 3000 TBD Call TI Call TI TPS3839L30DBZT PREVIEW SOT-23 DBZ 3 250 TBD Call TI Call TI Addendum-Page 1 (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 15-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TPS3839L30DQNR PREVIEW X2SON DQN 4 TBD Call TI Call TI TPS3839L30DQNT PREVIEW X2SON DQN 4 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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