VISHAY 12TTS08SPBF_10

VS-12TTS08SPbF High Voltage Series
Vishay Semiconductors
Phase Control SCR, 8 A
FEATURES
2
Anode
• Meets MSL level 1, per J-STD-020, LF
maximum peak of 260 °C
• Compliant to RoHS directive 2002/95/EC
• Halogen-free according to IEC 61249-2-21
definition
1
Cathode
D2PAK
• Designed and qualified for industrial level
3
Gate
APPLICATIONS
• Input rectification and crow-bar (soft start)
• Vishay input diodes, switches and output rectifiers which
are available in identical package outlines
PRODUCT SUMMARY
VT at 8 A
< 1.2 V
DESCRIPTION
ITSM
140 A
VRRM
800 V
The VS-12TTS08SPbF High Voltage Series of silicon
controlled rectifiers are specifically designed for medium
power switching and phase control applications. The glass
passivation technology used has reliable operation up to
125 °C junction temperature.
OUTPUT CURRENT IN TYPICAL APPLICATIONS
APPLICATIONS
SINGLE-PHASE BRIDGE
THREE-PHASE BRIDGE
UNITS
13.5
17
A
Capacitive input filter TA = 55 °C, TJ = 125 °C,
common heatsink of 1 °C/W
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER
TEST CONDITIONS
Sinusoidal waveform
IT(AV)
VALUES
UNITS
8
A
IT(RMS)
12.5
VRRM/VDRM
800
V
ITSM
140
A
1.2
V
dV/dt
150
V/μs
dI/dt
100
A/μs
- 40 to 125
°C
VRRM, MAXIMUM PEAK
REVERSE VOLTAGE
V
VDRM, MAXIMUM PEAK
DIRECT VOLTAGE
V
IRRM/IDRM
AT 125 °C
mA
800
800
1.0
8 A, TJ = 25 °C
VT
Range
TJ
VOLTAGE RATINGS
PART NUMBER
VS-12TTS08SPbF
Document Number: 94499
Revision: 08-Jun-10
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
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VS-12TTS08SPbF High Voltage Series
Vishay Semiconductors
Phase Control SCR, 8 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average on-state current
Maximum RMS on-state current
Maximum peak one-cycle
non-repetitive surge current
Maximum I2t for fusing
IT(AV)
IT(RMS)
ITSM
I2t
TEST CONDITIONS
VALUES
8
TC = 108 °C, 180° conduction, half sine wave
12.5
A
10 ms sine pulse, rated VRRM applied, TJ = 125 °C
120
10 ms sine pulse, no voltage reapplied, TJ = 125 °C
140
10 ms sine pulse, rated VRRM applied, TJ = 125 °C
72
10 ms sine pulse, no voltage reapplied, TJ = 125 °C
100
1000
A2√s
1.2
V
16.2
mΩ
0.87
V
Maximum I2√t for fusing
I2√t
t = 0.1 ms to 10 ms, no voltage reapplied, TJ = 125 °C
Maximum on-state voltage drop
VTM
8 A, TJ = 25 °C
On-state slope resistance
rt
Threshold voltage
VT(TO)
Maximum reverse and direct leakage current
IRM/IDM
UNITS
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
A2s
0.05
VR = Rated VRRM/VDRM
1.0
mA
Typical holding current
IH
Anode supply = 6 V, resistive load, initial IT = 1 A
30
Maximum latching current
IL
Anode supply = 6 V, resistive load
50
TJ = 25 °C
150
V/μs
100
A/μs
VALUES
UNITS
Maximum rate of rise of off-state voltage
dV/dt
Maximum rate of rise of turned-on current
dI/dt
TRIGGERING
PARAMETER
SYMBOL
TEST CONDITIONS
PGM
8.0
Maximum average gate power
PG(AV)
2.0
Maximum peak positive gate current
+ IGM
1.5
A
Maximum peak negative gate voltage
- VGM
10
V
Maximum peak gate power
Maximum required DC gate current to trigger
Maximum required DC gate voltage to trigger
Maximum DC gate voltage not to trigger
Maximum DC gate current not to trigger
IGT
VGT
VGD
IGD
W
Anode supply = 6 V, resistive load, TJ = - 65 °C
20
Anode supply = 6 V, resistive load, TJ = 25 °C
15
Anode supply = 6 V, resistive load, TJ = 125 °C
10
Anode supply = 6 V, resistive load, TJ = - 65 °C
1.2
Anode supply = 6 V, resistive load, TJ = 25 °C
1
Anode supply = 6 V, resistive load, TJ = 125 °C
0.7
mA
V
0.2
TJ = 125 °C, VDRM = Rated value
0.1
mA
VALUES
UNITS
SWITCHING
PARAMETER
SYMBOL
Typical turn-on time
tgt
Typical reverse recovery time
trr
Typical turn-off time
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2
tq
TEST CONDITIONS
TJ = 25 °C
0.8
3
TJ = 125 °C
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
μs
100
Document Number: 94499
Revision: 08-Jun-10
VS-12TTS08SPbF High Voltage Series
Phase Control SCR, 8 A
Vishay Semiconductors
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Maximum thermal resistance,
junction to case
RthJC
Maximum thermal resistance,
junction to ambient
RthJA
Typical thermal resistance,
case to heatsink
RthCS
VALUES
UNITS
- 40 to 125
°C
DC operation
1.5
62
Mounting surface, smooth and greased
°C/W
0.5
2
g
0.07
oz.
minimum
6 (5)
maximum
12 (10)
kgf ⋅ cm
(lbf ⋅ in)
Approximate weight
Mounting torque
12TTS08
R thJC (DC) = 1.5 K/ W
120
115
Conduc tion Angle
110
30°
60°
105
90°
120°
180°
100
0
2
4
6
8
10
12TTS08S
10
180°
120°
90°
60°
30°
9
8
7
6
RMSLimit
5
4
Conduction Angle
3
2
12TTS08
TJ= 125°C
1
0
0
1
2
3
4
5
6
7
8
9
Average On-state Current (A)
Average On-state Current (A)
Fig. 1 - Current Rating Characteristics
Fig. 3 - On-State Power Loss Characteristics
125
12TTS08
R thJC(DC) = 1.5 K/ W
120
115
Conduction Period
110
30°
60°
90°
120°
105
180°
DC
100
0
2
4
6
8
10
12
14
Average On-state Current (A)
Fig. 2 - Current Rating Characteristics
Document Number: 94499
Revision: 08-Jun-10
Maximum Average On-state Power Loss (W)
Maximum Allowable Case Temperature (°C)
Maximum Allowable Case Temperature (°C)
125
Maximum Average On-state Power Loss (W)
Case style D2PAK (SMD-220)
Marking device
14
DC
180°
120°
90°
60°
30°
12
10
8
RMS Limit
6
4
Conduction Period
2
12TTS08
TJ = 125°C
0
0
2
4
6
8
10
12
14
Average On-state Current (A)
Fig. 4 - On-State Power Loss Characteristics
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
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VS-12TTS08SPbF High Voltage Series
Phase Control SCR, 8 A
130
At Any Rated Load Condition And With
Rated V RRM Applied Following Surge.
120
Initial TJ= 125°C
@60 Hz 0.0083 s
@50 Hz 0.0100 s
110
100
90
80
70
12TTS08
60
1
10
150
Peak Half Sine Wave On-state Current (A)
Peak Half Sine Wave On-state Current (A)
Vishay Semiconductors
Maximum Non Repetitive Surge Current
Versus Pulse Train Duration. Control
Of Conduction May Not Be Maintained.
Initial TJ= 125°C
No Voltage Reapplied
Rated VRRM Reapplied
140
130
120
110
100
90
80
70
12TTS08
60
50
0.01
100
0.1
1
Pulse Train Duration (s)
Number Of Equal Amplitude Half Cycle Current Pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
Fig. 6 - Maximum Non-Repetitive Surge Current
Instantaneous On-state Current (A)
1000
12TTS08
100
TJ= 25°C
10
TJ= 125°C
1
0.5
1
1.5
2
2.5
3
3.5
Instantaneous On-state Voltage (V)
Transient Thermal Impedance Z thJC (°C/W)
Fig. 7 - On-State Voltage Drop Characteristics
10
Steady State Value
(DC Operation)
1
0.1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
Single Pulse
12TTS08
0.01
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Fig. 8 - Thermal Impedance ZthJC Characteristics
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 94499
Revision: 08-Jun-10
VS-12TTS08SPbF High Voltage Series
Phase Control SCR, 8 A
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
12
T
T
S
08
S
1
2
3
4
5
6
7
1
-
HPP product suffix
2
-
Current rating (12.5 A)
3
-
Circuit configuration:
TRL PbF
8
9
T = Single thyristor
4
-
Package:
T = TO-220AC
5
-
Type of silicon:
S = Standard recovery rectifier
6
-
Voltage rating (08 = 800 V)
7
-
S = TO-220 D2PAK (SMD-220) version
8
-
None = Tube
TRL = Tape and reel (left oriented)
TRR = Tape and reel (right oriented)
9
-
PbF = Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95046
Part marking information
www.vishay.com/doc?95054
Packaging information
www.vishay.com/doc?95032
Document Number: 94499
Revision: 08-Jun-10
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
5
Outline Dimensions
Vishay Semiconductors
D2PAK
DIMENSIONS in millimeters and inches
Conforms to JEDEC outline D2PAK (SMD-220)
(2)(3)
E
B
Pad layout
A
A
(E)
c2
11.00
MIN.
(0.43)
A
(3) L1
4
9.65
MIN.
(0.38)
(D1) (3)
Detail A
D
H
1
2
17.90 (0.70)
15.00 (0.625)
(2)
3
3.81
MIN.
(0.15)
L2
B
B
2.32
MIN.
(0.08)
A
2 x b2
c
2.64 (0.103)
2.41 (0.096)
(3)
E1
C
View A - A
2xb
± 0.004 M B
0.010 M A M B
Plating
H
2x e
Base
Metal
(4)
b1, b3
Gauge
plane
Seating
plane
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
SYMBOL
MILLIMETERS
MIN.
c1 (4)
(c)
B
0° to 8°
MAX.
L3
Lead tip
A1
L
(b, b2)
L4
Section B - B and C - C
Scale: None
Detail “A”
Rotated 90 °CW
Scale: 8:1
INCHES
MIN.
MAX.
NOTES
SYMBOL
MILLIMETERS
MIN.
MAX.
INCHES
MIN.
MAX.
NOTES
A
4.06
4.83
0.160
0.190
D1
6.86
8.00
0.270
0.315
3
A1
0.00
0.254
0.000
0.010
E
9.65
10.67
0.380
0.420
2, 3
E1
7.90
8.80
0.311
0.346
3
b
0.51
0.99
0.020
0.039
b1
0.51
0.89
0.020
0.035
b2
1.14
1.78
0.045
0.070
b3
1.14
1.73
0.045
0.068
c
0.38
0.74
0.015
0.029
c1
0.38
0.58
0.015
0.023
c2
1.14
1.65
0.045
0.065
D
8.51
9.65
0.335
0.380
4
4
4
e
0.100 BSC
H
14.61
15.88
0.575
0.625
L
1.78
2.79
0.070
0.110
L1
-
1.65
-
0.066
L2
1.27
1.78
0.050
0.070
L3
2
2.54 BSC
L4
0.25 BSC
4.78
5.28
3
0.010 BSC
0.188
0.208
Notes
(1) Dimensioning and tolerancing per ASME Y14.5 M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Datum A and B to be determined at datum plane H
(6) Controlling dimension: inch
(7) Outline conforms to JEDEC outline TO-263AB
Document Number: 95046
Revision: 31-Mar-11
For technical questions within your region, please contact one of the following:
www.vishay.com
[email protected], [email protected], [email protected]
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
Vishay
Disclaimer
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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Document Number: 91000
Revision: 11-Mar-11
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