DATA SHEET MOS INTEGRATED CIRCUIT µ PD6345 8 BIT SERIAL IN/PARALLEL OUT DRIVER The µPD6345 is a monolithic Bi-CMOS integrated Circuit designed to drive LED, Solenoid and Relay. This device consists of an 8-bit shift register, latch and buffer with high voltage N-P-N Transistors (Open Collector). Data is serially loaded into shift register on the positive-going transition of the clock. Parallel data is transferred to the output buffers through the 8-bit latch while the latch enable input is high and latched when the latch enable is low. When the output enable input is low, all outputs are off (High Impedance). FEATURES • High Speed Serially-shifted Data Input. • Latches on all driver Outputs. • 40 V Output Voltage Rating. • 60 mA Output Sink Current. • Built in power supply voltage detection circuit. • Capable of connection to cascade additional device. • Wide Operating Temperature Range: –40 to +85 °C • Bi-CMOS STRUCTURE ORDERING INFORMATION Part Number Package µPD6345C 16 Pin Plastic DIP (300 mil) µPD6345GS 16 Pin Plastic SOP (300 mil) Document No. IC-2166A (2nd edition) (O.D. No. IC-5437A) Date Published March 1997 P Printed in Japan © 1995 1988 µPD6345 PIN CONFIGURATION (Top View) VSS 1 16 VDD EN 2 15 RES LAT 3 14 SCK SO 4 13 SIN O8 5 12 O1 O7 6 11 O2 O6 7 10 O3 O5 8 9 O4 PIN IDENTIFICATION 2 Pin No. Symbol Pin name 1 GND 2 EN Output Enable Input When this pin is low or open, all outputs are OFF, and data is output during high. 3 LAT Latch Enable Input When this pin is low or open, data is latched and data is through to output during high. 4 SO Serial data Output Output Serial data is output on positive-going transition of the clock. In case of connection to cascade additional device (µPD6345), this pin will be connected to SIN terminal of additional device. 5 to 12 O8 to O1 Driver Output Output High Voltage and Current Driver Outputs. 13 SIN Serial data Input Input Data is loaded to shift register on positive-going transition. 14 SCK Clock Input Data of SIN is loaded to shift register on positive-going transition of SCK. Also, serial data is output from SO on positive-going transition of SCK. 15 RES Reset Input When this pin is low or open, data of shift register is all cleared, and this device operate normally during high. 16 VDD Power Supply Ground Input/Output — — Function Connection to Ground (GND) of system. Normally supply 5 V. µPD6345 BLOCK DIAGRAM O1 O2 O3 O4 O5 O6 O7 O8 EN 100 kΩ P1 P2 P3 P4 P5 P6 P7 P8 S1 S2 S3 S4 S5 S6 S7 S8 LAT 100 kΩ SIN SO 100 kΩ RES SCK 100 kΩ 100 kΩ P1 to P8 ; Latch Circuits S1 to S8 ; 8-bit Shift register TRUTH TABLE SCK EN RES LAT OUT SIN SO*1 O1 On H H H L High Impedance On – 1 S7 H H H H L On – 1 S7 H H L*2 * NO CHANGE NO CHANGE S7 L H * * * * * * * * L H * * H L * High Impedance High Impedance NO CHANGE NO CHANGE High Impedance High Impedance NO CHANGE NO CHANGE S7 S8 Note SCK = CLOCK EN = Output Enable RES= Reset LAT= Latch Enable SIN = Serial data Input OUT = Driver Output SO = Serial data Output * = H or L H = High level L = Low level L L *1) Seventh data S7 of shift register is loaded to eighth data S8 on positive-going transition of clock, and is output to Serial data Output pin. *2) Shift register operates normally. 3 µPD6345 TIMING CHART RES SCK SIN EN LAT O1 O8 SO 4 µPD6345 ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C ± 2 °C) Supply Voltage VDD –0.3 to 7.0 Input Voltage VIN –0.3 to VDD + 0.3 V Input Current VIN ±10 mA Logic Output Voltage VSO1 –0.3 to VDD + 0.3 V Driver Output Voltage VOUT2 –0.3 to 40 V Driver Output Current IOUT 100 mA Logic Output Current ISO Power Dissipation PD Operating Temperature Storage Temperature V +10 mA –5 850 (DIP), 800 (SOP) mW Topt –40 to + 85 °C Tstg –55 to +150 °C RECOMMENDED OPERATING CONDITIONS ITEM SYMBOL MIN. Operating Temperature Topt –40 Supply Voltage VDD 4.0 Input Voltage VIN High Level Input Voltage MAX. UNIT +85 °C 6.0 V 0 VDD V VIH 0.7 VDD VDD V Low Level Input Voltage VIL 0 0.2 VDD V Clock Frequency fSCK 8 MHz Driver Output Voltage VOUT 38 V 0 TYP. 5.0 5 µPD6345 ELECTRICAL CHARACTERISTICS (RH ≤ 70 %, VSS = 0 V) ITEM CONDITION SYMBOL VDD (V) High Level Input Voltage Low Level Input Voltage VIH VIL Ta = 25 °C Ta = –40 to +85 °C 5.0 3.5 6.0 4.2 5.0 2.4 3.5 V 4.2 1.7 6.0 1.0 1.0 1.2 1.2 V High Level Input Current IIH 6.0 VIN = VDD 100 300 300 µA Low Level Input Current IIL 6.0 VIN = VSS 0.03 0.3 1 µA 5.0 ISOH = –250 µA 3.6 3.6 6.0 ISOH = –300 µA 4.3 4.3 4.0 4.0 5.0 5.0 3.3 3.3 4.0 4.0 High Level Output Voltage 1 High Level Output Voltage 2 VSOH1 VSOH2 5.0 ISOH = –10 µA 6.0 High Level Output Voltage 3 VSOH3 5.0 ISOH = –1 µA 6.0 Low Level Output Voltage VSOL 5.0 Low Level Output Voltage (Driver) High Level Output Leakage Current Supply Current Input Capacitance VOUT(L) 5.0 IOHL 5.0 IDD1 5.0 IDD2 CIN V V V 0.6 ISOL = 8 µA 6.0 6 UNIT MIN. TYP. MAX. MIN. TYP. MAX. V 0.5 IOUT = 60 µA 0.8 1.0 V 10 10 µA 0.25 0.5 1.0 5.0 23 35 40 — 6 15 15 O 1 – O8 0.45 mA pF µPD6345 SWITCHING CHARACTERISTICS (Ta = 25 °C, VDD = 5 V, CL = 15 pF, R (On) = 300 Ω, VOUT = 12 V, tr = tf = 6 ns) ITEM Propagation Delay Time Clock Transition Time SYMBOL CONDITION MIN. TYP. MAX. UNIT tPLH1 SCK → SO (High Level) 20 100 ns tPLH2 SCK → Driver Output (High Level) 20 1 µs tPHL1 SCK → SO (Low Level) 100 ns tPHL2 SCK →Driver Output (Low Level) 1 µs tPHL3 RESET → SO 100 ns tPHL/PLH4 Output Enable → Driver Output 1 µs tPHL/PLH5 Latch Enable → Driver Output 1 µs tr tf SCK µs 70 Maximum Clock Frequency fmax Minimum Data Setup Time tSETUP 20 10 ns Minimum Data Hold Time tHOLD 20 10 ns PWRESET 62.5 10 ns 1 0.55 µs 62.5 38 ns Minimum Reset Pulse Width Minimum Output Enable Pulse Width PWENABLE Minimum Latch Enable Pulse Width Clock Pulse Width PWLATCH PWSCK 13 38 8 62.5 MHz ns 7 µPD6345 TIMING WAVEFORMS 1/f max. tr tr 90 % 90 % 50 % SCK 50 % 10 % 50 % 10 % PWCLOCK tSETUP tHOLD 50 % 50 % SIN 50 % tPLH1 VOH 50 % 50 % SO VOL tPHL1 High Impedance Qn tPLH2 50 % 50 % VOL tPHL2 PW RES EN LAT VOH 50 % 50 % VOL tPLH3 to 5 High Impedance 50 % 50 % On VOL tPHL4 to 5 SO VOH 50 % VOL 8 µPD6345 TYPICAL CHARACTERISTICS (Ta = 25 °C) DRIVER OUTPUT CHARACTERISTICS Driver Output Current IOUT (mA) 100 VDD = 6 V VDD = 5 V 80 VDD = 4 V 60 40 20 0 0 0.2 0.4 0.6 0.8 1.0 Driver Output Voltage VOUT (L) (V) Driver Output Voltage VOUT (L) (V) 0.8 VDD = 5V IOUT = 60 mA 0.6 0.4 0.2 –40 –20 0 20 40 60 85 Ambient Temperature Ta (°C) 9 µPD6345 SUPPLY CURRENT CHARACTERISTICS (8 Outputs is all ON, No load) Supply Current IDD (mA) 40 30 20 10 0 4.0 5.0 6.0 Supply Voltage VDD (V) Supply Current IDD (mA) 40 30 20 10 0 –40 –20 0 20 Ambient Temperature Ta (°C) 10 40 60 80 µPD6345 PACKAGE POWER DISSIPATION CHARACTERISTICS µ PD6345 (DIP) Power Dissipation PD (mW) 800 600 400 200 0 0 25 40 60 85 100 85 100 Ambient Temperature Ta (°C) µ PD6345 (SOP) Power Dissipation PD (mW) 800 600 400 200 0 0 25 40 60 Ambient Temperature Ta (°C) 11 µPD6345 APPLICATION CIRCUIT (1) Driving of Solenoid VCC to 40 V VDD +5 V Solenoid (to 60 mA) VDD VDD 1 chip CPU EN EN LAT LAT SO SIN SCK SCK RES RES O1 O2 O8 VSS VSS µ PD6345 (2) Driving of Solenoid for High Current VCC to 40 V Solenoid (a few Ampere) VDD +5 V VDD VDD R EN EN LAT LAT 1 chip SO CPU SIN Tr O1 O2 SCK SCK RES RES O8 VSS Tr R R VSS µ PD6345 12 Tr µPD6345 (2) Driving of LED VDD (5 V) VDD VDD EN EN LAT LAT SO SIN SCK SCK RES RES 1 chip CPU R R R O1 O2 O8 µ PD6345 13 µPD6345 16PIN PLASTIC DIP (300 mil) 16 9 1 8 A K P I L J H G C F D N M B NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel. R M ITEM MILLIMETERS INCHES A 20.32 MAX. 0.800 MAX. 0.050 MAX. B 1.27 MAX. C 2.54 (T.P.) 0.100 (T.P.) D 0.50±0.10 0.020 +0.004 –0.005 F 1.2 MIN. 0.047 MIN. G 3.5±0.3 0.138±0.012 H 0.51 MIN. 0.020 MIN. I 4.31 MAX. 0.170 MAX. J 5.08 MAX. 0.200 MAX. K 7.62 (T.P.) 0.300 (T.P.) L 6.4 0.252 M 0.25 +0.10 –0.05 0.010 +0.004 –0.003 N 0.25 0.01 P 1.0 MIN. 0.039 MIN. R 0~15° 0~15° P16C-100-300A,C-1 14 µPD6345 16 PIN PLASTIC SOP (300 mil) 16 9 P detail of lead end 1 8 A H J E K F G I C N D M B L M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 10.46 MAX. 0.412 MAX. B 0.78 MAX. 0.031 MAX. C 1.27 (T.P.) 0.050 (T.P.) D 0.40 +0.10 –0.05 0.016 +0.004 –0.003 E 0.1±0.1 0.004±0.004 F 1.8 MAX. 0.071 MAX. G 1.55 0.061 H 7.7±0.3 0.303±0.012 I 5.6 0.220 J 1.1 0.043 K 0.20 +0.10 –0.05 0.008 +0.004 –0.002 L 0.6±0.2 0.024 +0.008 –0.009 M 0.12 0.005 N 0.10 0.004 P 3° +7° –3° 3° +7° –3° P16GM-50-300B-4 15 µPD6345 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 16