Document No.001-87914 Rev. ** ECN # 4026890 Cypress Semiconductor Product Qualification Report QTP# 005004 June 2013 HOTLINK DX FAMILY – R42LHDHA TECHNOLOGY FAB 4 CY7C924DX 200 Mbaud HOTLink ™Transmitter CY7C954DX UTOPIA HOTLink™ Transceiver CY7C9689 TAXI™ Compatible HOTLink™ Transceiver HOTLink is a trademark of Cypress Semiconductor, Inc. TAXI and TAXIchip are trademarks of Advanced Micro Devices, Inc. CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Zhaomin Ji Principal Reliability Engineer (408) 432-7021 Mira Ben-Tzur Quality Engineering Director (408) 943-2675 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 10 Document No.001-87914 Rev. ** ECN # 4026890 PRODUCT QUALIFICATION HISTORY Qual Report 99041 Device CY7C924DX, CY7C954DX, CY7C9689, R42LHDHA Technology, Fab 4 Date Comp Nov 99 005004 4 layer mask change (Contact, Via, MM1 and MM1) to enhance functionality Apr 01 Description of Qualification Purpose Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 10 Document No.001-87914 Rev. ** ECN # 4026890 PRODUCT DESCRIPTION Purpose: Qualify 4 layer (Contact, Via, MM1 and MM1) mask change to CY7C924DX and its Hotlink DX family (CY7C954DX and CY7C9689), RAM42LHDHA Technology, Fab 4 Marketing Part #: CY7C924DX / CY7C954DX / CY7C9689 Device Description: 5V, Commercial, available in 100-pin TQFP package Cypress Division Cypress Semiconductor, Data Com Division (DCOM) Overall Die (or Mask) REV Level (pre-requisite for qualification): Rev. A What ID marking on Die: 7C924A TECHNOLOGY/FAB PROCESS DESCRIPTION - R42LHDHA Number of Metal Layers: 2 Passivation Type and Materials: Metal Metal 1: 500Å TiW /600A AL5% Composition Metal 2: 500Å TiW/800 Å Al : 7,000 Å SiO2 + 6,000 Å Si2N4 Generic Process Technology/Design Rule (-drawn): CMOS, Double Metal /0.35 m Gate Oxide Material/Thickness (MOS): SiO2 110Å Location of Die Fab Facility: Cypress Semiconductor - Bloomington, MN Die Fab Line ID/Wafer Process ID: Fab 4/R42LHDHA PACKAGE AVAILABILITY PACKAGE 100-pin TQFP ASSEMBLY SITE FACILITY ASE, TAIWN-G, CML-RA, CHINA, JT Note: Package Qualification details upon request Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 10 Document No.001-87914 Rev. ** ECN # 4026890 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: A100 100-pin Thin Quad Flat Pack (TQFP) Hitachi CEL 9200 V-O per UL94 Oxygen Rating Index: >28% Lead Frame Material: Copper Lead Finish, Composition / Thickness: Solder Plated, 85%Sn, 15%Pb Die Backside Preparation Method/Metallization: N/A Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: Ablestik 8361H Die Attach Method: Silver Epoxy Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0um Thermal Resistance Theta JA °C/W: 38.4C/W Package Cross Section Yes/No: N/A Name/Location of Assembly (prime) facility: ASE Taiwan ELECTRICAL TEST / FINISH DESCRIPTION Test Location: KYEC,Taiwan, CML-RA Fault Coverage: 100% Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 10 Document No.001-87914 Rev. ** ECN # 4026890 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F O High Temperature Operating Life Early Failure Rate Dynamic Operating Condition, Vcc = 5.75 V 125 C High Temperature Operating Life Long Term Failure Rate Dynamic Operating Condition, Vcc = 6.5 V 125 C O P High Accelerated Saturation Test (HAST) 130C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level 3 O 192 Hrs, 30C/60%RH+3IR-Reflow, 220C+5, 0 C P Pressure Cooker Test No bias, 121 C, 100%RH Precondition: JESD22 Moisture Sensitivity Level 3 P O Dynamic Operating Condition, Vcc = 6.5 V 125 C O O P O 192 Hrs, 30C/60%RH+3IR-Reflow, 220 C +5, 0 C Electrostatic Discharge 2,200V Human Body Model (ESD-HBM) MIL-STD-883, Method 3015.7 Electrostatic Discharge 500V, JESD22-C101C P P Charge Device Model (ESD- CDM) Acoustic Microscopy Latch-up Sensitivity JSTD-020 P 125C, 12V, 300Ma, 125C, 11V, 200mA In accordance with JEDEC 17 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 10 P Document No.001-87914 Rev. ** ECN # 4026890 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life1,2 Long Term Failure Rate 1 2 3 Device Tested/ Device Hours # Fails Activation Energy Thermal Failure Rate4 AF3 3976 0 N/A N/A 0 PPM 480,532 DHRs 0 0.7 170 34 FIT Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. k = Boltzmann's constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. 4 EFR and LFR FIT Rate based on QTP #005004 and QTP #99041. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 10 Document No.001-87914 Rev. ** ECN # 4026890 Reliability Test Data QTP #: 005004 Device STRESS: Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 5.75V, Vcc Max) CY7C9689-AC (7C924A) 610106773 TAIWN-G 96 CY7C9689-AC (7C924A) 4046354 610106773 STRESS: ESD-CHARGE DEVICE MODEL (500V) TAIWN-G 96 CY7C9689-AC (7C924A) TAIWN-G COMP 9 0 COMP 9 0 COMP 3 0 STRESS: 4046354 610106773 829 170 0 0 ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015 (2,200V) CY7C9689-AC (7C924A) STRESS: 4046354 4046354 610106773 TAIWN-G STATIC LATCH-UP TESTING (125C, 12V, +/300mA) CY7C9689-AC (7C924A) 4046354 610106773 TAIWN-G Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 10 Document No.001-87914 Rev. ** ECN # 4026890 Reliability Test Data QTP #: 99041 ASSY-LOC FABLOT# DEVICE ASSYLOT # DURATION S/S REJ FAIL MODE STRESS: ACOUSTIC CY7C924DX-AC TAIWN-G 4915058 349900163L1 COMP 16 0 CY7C924DX-AC TAIWN-G 4916167 619915601L1 COMP 16 0 STRESS: CLASS YIELD CY7C924DX-AC TAIWN-G 4915058 349900163L1 COMP 2000 0 CY7C924DX-AC TAIWN-G 4935550 349900307 COMP 2500 0 CY7C924DX-AC TAIWN-G 4916167 619915601L1 COMP 2000 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 6.5V) 0 CY7C924DX-AC TAIWN-G 4915058 349900163L1 84 1009 0 CY7C924DX-AC TAIWN-G 4935550 349900307 84 1002 0 CY7C924DX-AC TAIWN-G 4916167 619915601L1 84 966 0 STRESS: ESD-CHARGE DEVICE MODEL (1000V) CY7C924DX-AC TAIWN-G 4915058 349900163L1 COMP 3 0 CY7C924DX-AC TAIWN-G 4935550 349900307 COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015 (2200V) CY7C924DX-AC TAIWN-G 4915058 349900163L1 COMP 3 0 CY7C924DX-AC TAIWN-G 4935550 349900307 COMP 3 0 STRESS: STATIC LATCH-UP (125C, 11V, +/-200mA) CY7C924DX-AC TAIWN-G 4915058 349900163L1 COMP 3 0 CY7C924DX-AC TAIWN-G 4935550 349900307 COMP 3 0 STRESS: HI-ACCEL SATURATION TEST (130C/85%RH/5.5V), PRECOND. 192 HRS 30C/60%RH CY7C924DX-AC TAIWN-G 4915058 349900163L1 128 46 0 CY7C924DX-AC TAIWN-G 4916167 619915601L1 128 48 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 6.5V) CY7C924DX-AC CY7C924DX-AC TAIWN-G TAIWN-G 4915058 4915058 349900163L1 349900163L1 168 770 239 235 0 0 CY7C924DX-AC CY7C924DX-AC TAIWN-G TAIWN-G 4935550 4935550 349900307 349900307 168 500 239 239 0 0 CY7C924DX-AC CY7C924DX-AC TAIWN-G TAIWN-G 4916167 4916167 619915601L1 619915601L1 168 770 233 233 0 0 168 46 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH) CY7C924DX-AC TAIWN-G 4915058 349900163L1 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 10 Document No.001-87914 Rev. ** ECN # 4026890 Reliability Test Data QTP #: 99041 DEVICE STRESS: ASSYLOT DURATION S/S # TC COND. C, -65 TO 150C, PRECOND. 192 HRS 30C/60%RH (MSL 3) ASSY-LOC FABLOT# REJ FAIL MODE CY7C924DX-AC CY7C924DX-AC CY7C924DX-AC TAIWN-G TAIWN-G TAIWN-G 4915058 4915058 4915058 349900163L1 349900163L1 349900163L1 1000 300 500 46 46 46 0 0 0 CY7C924DX-AC CY7C924DX-AC CY7C924DX-AC TAIWN-G TAIWN-G TAIWN-G 4916167 4916167 4916167 619915601L1 619915601L1 619915601L1 1000 300 500 48 48 48 0 0 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 10 Document No.001-87914 Rev. ** ECN # 4026890 Document History Page Document Title: QTP# 005004 : HOT LINK DX FAMILY , (CY7C924DX/954DX/9689) R42LHDHA TECHONOLOGY , FAB 4 Document Number: 001-87914 Rev. ECN Orig. of No. Change ** 4026890 ILZ Description of Change Initial Spec Release Qualification report published on Cypress.com is not in spec format. Initiated spec for QTP 005004 and removed all Cypress reference spec and replaced with Industry standard. Updated package availability based on current qualified assembly. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 10