FAIRCHILD FDMS2572

FDMS2572
N-Channel UltraFET Trench® MOSFET
150V, 27A, 47mΩ
Features
tm
General Description
„ Max rDS(on) = 47mΩ at VGS = 10V, ID = 4.5A
UItraFET devices combine characteristics that enable
benchmark efficiency in power conversion applications.
Optimized for rDS(on), low ESR, low total and Miller gate charge,
these devices are ideal for high frequency DC to DC converters.
„ Max rDS(on) = 53mΩ at VGS = 6V, ID = 4.5A
„ Low Miller Charge
„ Optimized efficiency at high frequencies
Application
„ UIS Capability (Single pulse and Repetitive pulse)
„ Distributed Power Architectures and VRMs
„ RoHS Compliant
„ Primary Switch for 24V and 48V Systems
„ High Voltage Synchronous Rectifier
S
Pin 1
D
S
S
D
D
G
D
D
5
4 G
D
6
3 S
D
7
2 S
D
8
1 S
Power 56 (Bottom view)
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
VDS
Drain to Source Voltage
Parameter
VGS
Gate to Source Voltage
Drain Current -Continuous (Package limited)
TC = 25°C
TA = 25°C
-Continuous
TJ, TSTG
±20
V
27
(Note 1a)
-Pulsed
PD
Units
V
27
TC = 25°C
-Continuous (Silicon limited)
ID
Ratings
150
A
4.5
30
Power Dissipation
TC = 25°C
Power Dissipation
TA = 25°C
78
(Note 1a)
Operating and Storage Junction Temperature Range
2.5
-55 to +150
W
°C
Thermal Characteristics
RθJC
Thermal Resistance, Junction to Case
RθJA
Thermal Resistance, Junction to Ambient
1.6
(Note 1a)
50
°C/W
Package Marking and Ordering Information
Device Marking
FDMS2572
Device
FDMS2572
©2007 Fairchild Semiconductor Corporation
FDMS2572 Rev.C2
Package
Power 56
1
Reel Size
13’’
Tape Width
12mm
Quantity
3000 units
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FDMS2572 N-Channel UltraFET Trench® MOSFET
February 2007
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 250µA, VGS = 0V
∆BVDSS
∆TJ
Breakdown Voltage Temperature
Coefficient
150
V
ID = 250µA, referenced to 25°C
IDSS
Zero Gate Voltage Drain Current
VDS = 120V, VGS = 0V
1
µA
IGSS
Gate to Source Leakage Current
VGS = ±20V, VDS = 0V
±100
nA
4
V
180
mV/°C
On Characteristics (Note 2)
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = 250µA
∆VGS(th)
∆TJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = 250µA, referenced to 25°C
rDS(on)
Drain to Source On Resistance
gFS
Forward Transconductance
2
3
-9.8
mV/°C
VGS = 10V, ID = 4.5A
36
VGS = 6V,
ID = 4.5A
39
47
53
VGS = 10V, ID = 4.5A, TJ = 125°C
69
103
VDS = 10V, ID = 4.5A
14
mΩ
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
VDS = 75V, VGS = 0V,
f = 1MHz
f = 1MHz
1960
2610
pF
130
175
pF
30
45
pF
Ω
1.3
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
Qg(TOT)
Total Gate Charge at 10V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
VDD = 75V, ID = 1.0A
VGS = 10V, RGEN = 6Ω
VGS = 0V to 10V VDD = 75V
ID = 4.5A
11
20
ns
8
16
ns
38
61
ns
31
50
ns
31
43
nC
9
nC
7
nC
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VGS = 0V, IS = 2.2A
(Note 2)
IF = 4.5A, di/dt = 100A/µs
0.7
1.0
V
67
101
ns
130
195
nC
Notes:
1: RθJA is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by
the user's board design.
b. 125°C/W when mounted on a
minimum pad of 2 oz copper
a.50°C/W when mounted on
a 1 in2 pad of 2 oz copper
2: Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%.
FDMS2572 Rev.C2
2
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FDMS2572 N-Channel UltraFET Trench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
VGS = 10V
35
ID, DRAIN CURRENT (A)
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
40
PULSE DURATION = 300µs
DUTY CYCLE = 2.0%MAX
VGS = 6V
30
VGS = 5.5V
25
20
VGS = 5V
15
10
5
0
VGS = 4.5V
0
1
2
3
4
VDS, DRAIN TO SOURCE VOLTAGE (V)
5
2.0
ID = 4.5A
VGS = 10V
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-75
-50
-25
0
25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (oC)
Figure 3. Normalized On - Resistance
vs Junction Temperature
ID, DRAIN CURRENT (A)
IS, REVERSE DRAIN CURRENT (A)
PULSE DURATION = 300µs
DUTY CYCLE = 2.0%MAX
40
TJ = 125oC
30
20
TJ = 25oC
VGS = 6V
1.2
VGS = 10V
1.0
0.8
0
TJ =-55oC
1
2
3
4
5
ID = 4.5A
32
40
PULSE DURATION =300µs
DUTY CYCLE = 2.0%MAX
90
80
TJ = 150oC
70
60
50
TJ = 25oC
40
30
3
4
5
6
7
8
9
VGS, GATE TO SOURCE VOLTAGE (V)
10
60
VGS = 0V
10
1
TJ = 125oC
0.1
TJ = 25oC
0.01
TJ = -55oC
1E-4
0.0
6
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 5. Transfer Characteristics
FDMS2572 Rev.C2
8
16
24
ID, DRAIN CURRENT(A)
100
1E-3
10
0
VGS =5.5V
VGS =5V
1.4
Figure 4. On-Resistance vs Gate to
Source Voltage
60
50
1.6
110
2.4
2.2
PULSE DURATION = 300µs
DUTY CYCLE = 2.0%MAX
VGS =4.5V
Figure 2. Normalized On-Resistance
vs Drain Current and Gate Voltage
rDS(on), DRAIN TO
SOURCE ON-RESISTANCE (mOHM)
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
Figure 1. On-Region Characteristics
1.8
0.2
0.4
0.6
0.8
1.0
VSD, BODY DIODE FORWARD VOLTAGE (V)
1.2
Figure 6. Source to Drain Diode
Forward Voltage vs Source Current
3
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FDMS2572 N-Channel UltraFET Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
3000
ID = 4.5A
VDD =50V
8
VDD = 75V
6
VDD = 100V
4
2
0
0
7
Ciss
1000
CAPACITANCE (pF)
VGS, GATE TO SOURCE VOLTAGE(V)
10
14
21
Qg, GATE CHARGE(nC)
28
Coss
100
10
0.1
35
Figure 7. Gate Charge Characteristics
ID, DRAIN CURRENT (A)
IAS, AVALANCHE CURRENT(A)
5
4
TJ = 25oC
3
2
TJ =
1
0.01
125oC
P(PK), PEAK TRANSIENT POWER (W)
100us
1ms
1
10ms
100ms
0.1
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(on)
1E-3
0.1
1s
10s
SINGLE PULSE
TJ = MAX RATED
DC
TA = 25OC
1
10
3
VGS = 6V
2
o
1
RθJA = 50 C/W
50
75
100
125
TA, AMBIENT TEMPERATURE (oC)
150
Figure 10. Maximum Continuous Drain
Current vs Ambient Temperature
60
10
VGS = 10V
4
0
25
50
0.1
1
10
tAV, TIME IN AVALANCHE(ms)
Figure 9. Unclamped Inductive
Switching Capability
ID, DRAIN CURRENT (A)
100
6
5
100
600
2000
1000
VGS = 10V
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
100
150 – T
A
----------------------125
I = I25
TA = 25oC
10
1
0.5
-3
10
SINGLE PULSE
-2
10
-1
10
0
10
1
10
2
10
3
10
t, PULSE WIDTH (s)
VDS, DRAIN to SOURCE VOLTAGE (V)
Figure 11. Forward Bias Safe
Operating Area
FDMS2572 Rev.C2
1
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance vs Drain
to Source Voltage
6
0.01
Crss
f = 1MHz
VGS = 0V
Figure 12. Single Pulse Maximum
Power Dissipation
4
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FDMS2572 N-Channel UltraFET Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
NORMALIZED THERMAL
IMPEDANCE, ZθJA
2
1
0.1
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
PDM
0.01
t1
t2
1E-3
5E-4
-3
10
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TA
SINGLE PULSE
-2
10
-1
0
10
10
1
10
2
10
3
10
t, RECTANGULAR PULSE DURATION (s)
Figure 13. Transient Thermal Response Curve
FDMS2572 Rev.C2
5
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FDMS2572 N-Channel UltraFET Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
FDMS2572 N-Channel UltraFET Trench® MOSFET
www.fairchildsemi.com
6
FDMS2572 Rev.C2
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I22
FDMS2572 Rev. C2
7
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FDMS2572 N-Channel UItraFET Trench® MOSFET
TRADEMARKS