Document No.001-89448 Rev. *B ECN # 4517577 Cypress Semiconductor Package Qualification Report QTP# 030604 VERSION*B September 2014 <28-Lead SSOP (209mils) 100% Sn MSL3, 260C Solder Reflow OSE Taiwan (T) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 12 Document No.001-89448 Rev. *B ECN # 4517577 PACKAGE QUALIFICATION HISTORY Qual Report Description of Qualification Purpose Date Comp. 030604 Qualify OSE-Taiwan for <28-lead SSOP (209mils), Pb-Free, MSL1, 260C Solder Reflow Temperature using 9220HF Mold Compound, 8340 Epoxy with 97% Sn 3% Bi Mar 04 043102 New Lead Finish Option for Pb-Free, using Matte Sn with Post Plate Bake and Annealing Process, 260C IR- Reflow temperature assembled in OSE-Taiwan Dec 04 043102 Cypress established policy requiring MSL and Reflow Peak Temperature alignment for Cypress and its Assembly Subcontractors. Downgrade from MSL1 to MSL3 Mar 07 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 12 Document No.001-89448 Rev. *B ECN # 4517577 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: O28 28-lead Shrunk Small Outline Package (SSOP) (209mils) CEL 9220HF V-O per UL 94 Oxygen Rating Index: >51% Lead Frame Material: Copper Lead Finish, Composition / Thickness: 100% Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8340 Die Attach Method: Silver Epoxy Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0 mils Thermal Resistance Theta JA °C/W: 90°C/W Package Cross Section Yes/No: N/A Name/Location of Assembly (prime) facility: OSE-Taiwan (TAIWN-T) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 12 Document No.001-89448 Rev. *B ECN # 4517577 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 P Adhesion of Lead Finish MIL-STD-883, Method 2025 P Die Shear MIL-STD-883, Method 2019 P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009 P High Temperature Storage 150C, no bias P High Temperature Operating Life Dynamic Operating Condition, Vcc Max = 3.8V, 125C P Dynamic Operating Condition, Vcc Max= 3.8V, 150C P High Accelerated Saturation Test (HAST) 130°C, 3.63V, 85%RH Precondition: JESD22 Moisture Sensitivity MSL 1 P Pressure Cooker 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C 121°C, 100%RH, 15 Psig Early Failure Rate High Temperature Operating Life Latent Failure Rate P Precondition: JESD22 Moisture Sensitivity MSL 1 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C Temperature Cycle Precondition: JESD22 Moisture Sensitivity MSL 1 P Resistance to Solvents 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C MIL-STD-883 -2015 P X-Ray MIL-STD-883 - 2012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 12 Document No.001-89448 Rev. *B ECN # 4517577 Reliability Test Data QTP #:030604 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism ACOUSTIC, MSL1 CY2295PVC (7C83000D) 2230116 610240687-1 TAIWN-T COMP 15 0 CY2295PVC (7C83000D) 2230116 610240687-2 TAIWN-T COMP 15 0 CY2295PVC (7C83000D) 2230116 610240687-3 TAIWN-T COMP 15 0 STRESS: ADHESION OF LEAD FINISH CY2295PVC (7C83000D) 2230116 610240687-1 TAIWN-T COMP 5 0 CY2295PVC (7C83000D) 2230116 610240687-2 TAIWN-T COMP 5 0 2230116 610240687-1 TAIWN-T COMP 5 0 2230116 610240687-1 TAIWN-T COMP 15 0 STRESS: DIE SHEAR CY2295PVC (7C83000D) STRESS: EXTERNAL VISUAL CY2295PVC (7C83000D) STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 168 HRS. 85C/85%RH, MSL1 W320-03H (W320031A) 9304372 610305557 TAIWN-T 128 45 0 CY828409OC (7C828409D) 4315282 610347876 TAIWN-T 128 42 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 3.8V, Vcc Max CY7C65640 (7C65640C) 4235326 610249056 TAIWN-T 96 259 0 CY7C65640 (7C65640C) 4235326 610249057 TAIWN-T 120 260 0 CY828409OC (7C828409D) 4315282 610347876 TAIWN-T 96 494 0 CY828409OC (7C828409D) 4315282 610347876M TAIWN-T 96 493 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 3.8V, Vcc Max CY7C65640 (7C65640C) 4235326 610249056 TAIWN-T 80 118 0 CY7C65640 (7C65640C) 4235326 610249056 TAIWN-T 500 106 0 CY7C65640 (7C65640C) 4235326 610249057 TAIWN-T 80 115 0 CY7C65640 (7C65640C) 4235326 610249057 TAIWN-T 500 97 0 STRESS: HIGH TEMPERATURE STORAGE CY2295PVC (7C83000D) 2230116 610240687-1 TAIWN-T 500 45 0 CY2295PVC (7C83000D) 2230116 610240687-1 TAIWN-T 1000 42 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 Hrs., 85C/85%RH, MSL1 CY2295PVC (7C83000D) 2230116 610240687-1 TAIWN-T 184 50 0 CY2295PVC (7C83000D) 2230116 610240687-2 TAIWN-T 176 50 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 12 Document No.001-89448 Rev. *B ECN # 4517577 Reliability Test Data QTP #:030604 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: SOLDERABILITY CY2295PVC (7C83000D) 2230116 610240687-1 TAIWN-T COMP 5 0 CY2295PVC (7C83000D) 2230116 610240687-2 TAIWN-T COMP 5 0 CY2295PVC (7C83000D) 2230116 610240687-3 TAIWN-T COMP 5 0 STRESS: TC CONDITION C, -65C TO 150C, PRE COND 168 HRS. 85C/85%RH, MSL1 CY2295PVC (7C83000D) 2230116 610240687-1 TAIWN-T 300 46 0 CY2295PVC (7C83000D) 2230116 610240687-1 TAIWN-T 500 46 0 CY2295PVC (7C83000D) 2230116 610240687-1 TAIWN-T 1000 46 0 CY2295PVC (7C83000D) 2230116 610240687-2 TAIWN-T 300 50 0 CY2295PVC (7C83000D) 2230116 610240687-2 TAIWN-T 500 50 0 CY2295PVC (7C83000D) 2230116 610240687-2 TAIWN-T 1000 50 0 CY2295PVC (7C83000D) 2230116 610240687-3 TAIWN-T 300 47 0 CY2295PVC (7C83000D) 2230116 610240687-3 TAIWN-T 500 46 0 CY2295PVC (7C83000D) 2230116 610240687-3 TAIWN-T 1000 46 0 CY2295PVC (7C83000D) 2230116 610240687-1 TAIWN-T COMP 15 0 CY2295PVC (7C83000D) 2230116 610240687-2 TAIWN-T COMP 15 0 CY2295PVC (7C83000D) 2230116 610240687-3 TAIWN-T COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 12 Document No.001-89448 Rev. *B ECN # 4517577 Reliability Test Data QTP #:043102 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ADHESION OF LEAD FINISH CY62148BLL OSE-T COMP 3 0 CY8C27443 OSE-T COMP 3 0 CY62148BLL OSE-T COMP 15 0 CY8C27443 OSE-T COMP 15 0 CY62148BLL OSE-T COMP 9 0 CY8C27443 OSE-T COMP 9 0 STRESS: EXTERNAL VISUAL STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 12 Document No.001-89448 Rev. *B ECN # 4517577 Reliability Test Data QTP #: MR094039 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism HI-ACCEL SATURATION TEST, 110C, 85%RH, 5.25V, PRE COND 192 HRS 30C/60%RH, MSL3 CY8C21323 (8C21323BK) 5922005 610932146 TAIWN-T 264 30 0 STRESS: HIGH TEMPERATURE STORAGE CY8C21323 (8C21323BK) 5922005 610932146 TAIWN-T 500 30 0 CY8C21323 (8C21323BK) 5922005 610932146 TAIWN-T 1000 30 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 12 Document No.001-89448 Rev. *B ECN # 4517577 Reliability Test Data QTP #: MR101011 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMPERATURE STORAGE CY8C21323 (8C21323BK) 5928007 610944628 TAIWN-T 500 30 0 CY8C21323 (8C21323BK) 5928007 610944628 TAIWN-T 500 30 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 12 Document No.001-89448 Rev. *B ECN # 4517577 Reliability Test Data QTP #: MR104044 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMPERATURE STORAGE CY8C21323 (8C21323BK) 5026089 611046210 TAIWN-T 500 30 0 CY8C21323 (8C21323BK) 5026089 611046210 TAIWN-T 1000 30 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 12 Document No.001-89448 Rev. *B ECN # 4517577 Reliability Test Data QTP #: MR111012 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMPERATURE STORAGE CY8C21323 (8C21323BK) 5031036 611058400 TAIWN-T 500 30 0 CY8C21323 (8C21323BK) 5031036 611058400 TAIWN-T 1000 30 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 12 Document No.001-89448 Rev. *B ECN # 4517577 Document History Page Document Title:QTP#030604: <28-Lead SSOP (209mils) 100% Sn MSL3, 260C Solder Reflow OSE Taiwan (T) Document Number:001-89448 Rev. ECN Orig. of No. Change ** 4140947 HSTO *A 4238178 HSTO *B 4517577 HSTO Distribution: WEB Posting: Description of Change Initial Spec Release Initiate report as per memo LGQ-696 Added MR094039, MR101011, MR104044, MR111012 test result data Align qualification report based on the new template in the front page None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 12