TOSHIBA 2SK4016

2SK4016
TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (π−MOS VI)
2SK4016
Switching Regulator Applications
•
•
•
•
Unit: mm
Low drain-source ON-resistance: RDS (ON) = 0.33 Ω (typ.)
High forward transfer admittance: |Yfs| = 10 S (typ.)
Low leakage current: IDSS = 100 μA (VDS = 600 V)
Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)
Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Drain-source voltage
VDSS
600
V
Drain-gate voltage (RGS = 20 kΩ)
VDGR
600
V
Gate-source voltage
VGSS
±30
V
(Note 1)
ID
13
Pulse (t = 1 ms)
(Note 1)
IDP
52
Drain power dissipation (Tc = 25°C)
PD
50
W
Single-pulse avalanche energy
(Note 2)
EAS
1033
mJ
Avalanche current
IAR
13
A
Repetitive avalanche energy (Note 3)
EAR
5.0
mJ
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55~150
°C
DC
Drain current
A
1: Gate
2: Drain
3: Source
JEDEC
―
JEITA
SC-67
TOSHIBA
2-10U1B
Weight : 1.7 g (typ.)
Thermal Characteristics
Characteristic
Symbol
Max
Unit
Thermal resistance, channel to case
Rth (ch-c)
2.5
°C/W
Thermal resistance, channel to ambient
Rth (ch-a)
62.5
°C/W
2
Note 1: Ensure that the channel temperature does not exceed 150°C.
Note 2: VDD = 90 V, Tch = 25°C (initial), L = 10.7 mH, IAR = 13 A, RG = 25 Ω
1
Note 3: Repetitive rating: Pulse width limited by maximum channel temperature
This transistor is an electrostatic-sensitive device. Handle with care.
3
1
2005-05-30
2SK4016
Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Min
Typ.
Max
Unit
IGSS
VGS = ±25 V, VDS = 0 V
⎯
⎯
±10
μA
V (BR) GSS
IG = ±10 μA, VDS = 0 V
±30
⎯
⎯
V
IDSS
VDS = 600 V, VGS = 0 V
⎯
⎯
100
μA
Gate leakage current
Gate-source breakdown voltage
Test Condition
Drain cutoff current
V (BR) DSS
ID = 10 mA, VGS = 0 V
600
⎯
⎯
V
Vth
VDS = 10 V, ID = 1 mA
2.0
⎯
4.0
V
Drain-source ON-resistance
RDS (ON)
VGS = 10 V, ID = 6.5 A
⎯
0.33
0.50
Ω
Forward transfer admittance
⎪Yfs⎪
VDS = 10 V, ID = 6.5 A
5.0
10
⎯
S
Input capacitance
Ciss
⎯
3100
⎯
Reverse transfer capacitance
Crss
⎯
20
⎯
Output capacitance
Coss
⎯
270
⎯
VOUT
⎯
60
⎯
RL =
30Ω
⎯
110
⎯
Drain-source breakdown voltage
Gate threshold voltage
Rise time
VDS = 25 V, VGS = 0 V, f = 1 MHz
tr
Turn-on time
ton
15 Ω
Switching time
Fall time
ID = 6.5 A
10 V
VGS
0V
tf
Turn-off time
VDD ∼
− 200 V
Duty <
= 1%, tw = 10 μs
toff
Total gate charge
Qg
Gate-source charge
Qgs
Gate-drain charge
Qgd
VDD ∼
− 400 V, VGS = 10 V, ID = 13 A
pF
ns
⎯
50
⎯
⎯
215
⎯
⎯
62
⎯
⎯
40
⎯
⎯
22
⎯
nC
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
(Note 1)
IDR
⎯
⎯
⎯
13
A
(Note 1)
IDRP
⎯
⎯
⎯
52
A
Continuous drain reverse current
Pulse drain reverse current
Forward voltage (diode)
VDSF
IDR = 13 A, VGS = 0 V
⎯
⎯
−1.7
V
Reverse recovery time
trr
IDR = 13 A, VGS = 0 V,
⎯
220
⎯
ns
Reverse recovery charge
Qrr
dIDR/dt = 100 A/μs
⎯
0.8
⎯
μC
Marking
2SK4016
Part No. (or abbreviation code)
Lot No.
A line indicates a
lead (Pb)-free package or
lead (Pb)-free finish.
2
2005-05-30
2SK4016
ID – VDS
ID – VDS
20
6.3
10
DRAIN CURRENT ID (A)
7
8
10
COMMON SOURCE
Tc = 25°C
PULSE TEST
8
7
6
5.7
4
5.4
2
16
6.3
12
6
8
5.7
4
5.4
VGS = 5 V
0
0
0
2
4
6
8
10
VGS = 5 V
0
DRAIN−SOURCE VOLTAGE VDS (V)
10
20
DRAIN−SOURCE VOLTAGE VDS (V)
DRAIN CURRENT ID (A)
16
12
8
100
Tc = −55°C
4
25
0
0
4
2
6
ID = 13 A
4
2
6
3
0
4
8
12
16
20
(V)
RDS (ON) – ID
10
DRAIN−SOURCE ON-RESISTANCE
RDS (ON) (Ω)
FORWARD TRANSFER ADMITTANCE
⎪Yfs⎪ (S)
6
GATE−SOURCE VOLTAGE VGS
COMMON SOURCE
VDS = 10 V
PULSE TEST
Tc = −55°C
10
25
100
1
1
COMMON SOURCE
Tc = 25°C
PULSE TEST
(V)
|Yfs| – ID
0.1
0. 1
50
8
0
10
GATE−SOURCE VOLTAGE VGS
100
40
VDS – VGS
10
COMMON SOURCE
VDS = 10 V
PULSE TEST
20
30
DRAIN−SOURCE VOLTAGE VDS (V)
ID – VGS
24
COMMON SOURCE
Tc = 25°C
PULSE TEST
6.6
8
6
DRAIN CURRENT ID (A)
10
10
1
VGS = 10 V
V
0.1
0.1
100
DRAIN CURRENT ID (A)
COMMON SOURCE
Tc = 25°C
PULSE TEST
1
10
100
DRAIN CURRENT ID (A)
3
2005-05-30
2SK4016
RDS (ON) − Tc
IDR − VDS
100
COMMON SOURCE
VDS = 10 V
PULSE TEST
1.2
0.8
ID = 10 A
3
6
0.4
−40
0
40
80
CASE TEMPERATURE
120
160
10
5
10
1
0.1
Tc (°C)
VGS = 0 V
1
3
0
0.4
0.8
C − VDS
Vth (V)
10000
GATE THRESHOLD VOLTAGE
(pF)
Ciss
CAPACITANCE C
1000
Coss
100
COMMON SOURCE
VGS = 0 V
Crss
f = 1 MHz
10 Tc = 25°C
1
10
ID = 1 mA
3
2
1
0
−80
100
600
DRAIN−SOURCE VOLTAGE VDS (V)
PD (W)
DRAIN POWER DISSIPATION
0
40
80
120
160
Tc (°C)
DYNAMIC INPUT/OUTPUT
CHARACTERISTICS
80
60
40
20
80
−40
CASE TEMPERATURE
PD − Tc
40
COMMON SOURCE
VDS = 10 V
DRAIN−SOURCE VOLTAGE VDS (V)
0
0
1.6
Vth − Tc
4
0.1
1.2
DRAIN−SOURCE VOLTAGE VDS (V)
120
160
CASE TEMPERATURE
Tc (°C)
500
12.5
Tc = 25°C
VDD = 100V
VDS
200V
10
400V
300
7.5
VGS
200
5
100
2.5
0
0
200
ID = 13 A
PULSE TEST
400
15
COMMON SOURCE
20
40
(V)
0
−80
COMMON SOURCE
Tc = 25°C
PULSE TEST
GATE−SOURCE VOLTAGE VGS
1.6
DRAIN REVERSE CURRENT IDR (A)
DRAIN−SOURCE ON-RESISTANCE
RDS (ON) (Ω)
2.0
0
80
60
TOTAL GATE CHARGE Qg (nC)
4
2005-05-30
2SK4016
NORMALIZED TRANSIENT THERMAL
IMPEDANCE rth (t)/Rth (ch-c)
rth – tw
10
1
Duty = 0.5
0.2
0.1
0.1
0.05
PDM
0.02
t
0.01
0.01
SINGLE PULSE
T
Duty = t/T
Rth (ch-c) = 2.5°C/W
0.001
10μ
1m
100μ
100m
10m
PULSE WIDTH
10
1
tw (s)
EAS – Tch
SAFE OPERATING AREA
100
1200
ID max (PULSED) *
1000
100 μs *
DRAIN CURRENT ID
(A)
ID max (CONTINUOUS) *
800
10
1 ms *
600
400
DC OPERATION
Tc = 25°C
1
200
0
*SINGLE NONREPETITIVE
25
PULSE Tc = 25°C
0.1
CURVES MUST BE
50
75
100
125
150
Channel temperature (initial) Tch (°C)
DERATED LINEARLY WITH
INCREASE IN TEMPERATURE
VDSS max
0.01
1
10
100
DRAIN−SOURCE VOLTAGE
1000
VDS
15 V
(V)
BVDSS
IAR
−15 V
VDS
VDD
Test circuit
RG = 25 Ω
VDD = 90 V, L = 10.7 mH
5
Waveform
EAS =
Ε
⎛
⎞
1
B VDSS
⎟
⋅ L ⋅ I2 ⋅ ⎜
⎜B
⎟
2
−
V
DD ⎠
⎝ VDSS
2005-05-30
2SK4016
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
6
2005-05-30