TOSHIBA 2SK4015_09

2SK4015
TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (π−MOS VI)
2SK4015
Switching Regulator Applications
•
•
•
•
Unit: mm
Low drain-source ON-resistance: RDS (ON) = 0.60 Ω (typ.)
High forward transfer admittance: |Yfs| = 7.4 S (typ.)
Low leakage current: IDSS = 100 μA (VDS = 600 V)
Enhancement model: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA)
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Drain-source voltage
VDSS
600
V
Drain-gate voltage (RGS = 20 kΩ)
VDGR
600
V
Gate-source voltage
VGSS
±30
V
(Note 1)
ID
10
Pulse (t = 1 ms)
(Note 1)
IDP
40
Drain power dissipation (Tc = 25°C)
PD
45
W
Single-pulse avalanche energy
(Note 2)
EAS
363
mJ
Avalanche current
IAR
10
A
Repetitive avalanche energy (Note 3)
EAR
4.5
mJ
TOSHIBA
Channel temperature
Tch
150
°C
Weight: 1.7 g (typ.)
Storage temperature range
Tstg
-55 to 150
°C
DC
Drain current
A
1: Gate
2: Drain
3: Source
JEDEC
―
JEITA
SC-67
2-10U1B
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability
Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability
test report and estimated failure rate, etc).
Thermal Characteristics
2
Characteristic
Symbol
Max
Unit
Thermal resistance, channel to case
Rth (ch-c)
2.78
°C/W
Thermal resistance, channel to ambient
Rth (ch-a)
62.5
°C/W
Note 1: Ensure that the channel temperature does not exceed 150°C.
1
Note 2: VDD = 90 V, Tch = 25°C (initial), L = 6.36 mH, IAR = 10 A, RG = 25 Ω
Note 3: Repetitive rating: pulse width limited by maximum channel temperature
This transistor is an electrostatic-sensitive device. Handle with care.
1
3
2009-09-29
2SK4015
Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Typ.
Max
Unit
IGSS
VGS = ±25 V, VDS = 0 V
⎯
⎯
±10
μA
IG = ±10 μA, VDS = 0 V
±30
⎯
⎯
V
IDSS
VDS = 600 V, VGS = 0 V
⎯
⎯
100
μA
Drain cutoff current
Drain-source breakdown voltage
Min
V (BR) GSS
Gate leakage current
Gate-source breakdown voltage
Test Condition
V (BR) DSS
ID = 10 mA, VGS = 0 V
600
⎯
⎯
V
Vth
VDS = 10 V, ID = 1 mA
2.0
⎯
4.0
V
Gate threshold voltage
Drain-source ON-resistance
RDS (ON)
VGS = 10 V, ID = 5 A
⎯
0.60
0.86
Ω
Forward transfer admittance
⎪Yfs⎪
VDS = 10 V, ID = 5 A
3.7
7.4
⎯
S
Input capacitance
Ciss
⎯
1500
⎯
Reverse transfer capacitance
Crss
⎯
15
⎯
Output capacitance
Coss
⎯
180
⎯
VOUT
⎯
22
⎯
RL =
40 Ω
⎯
50
⎯
⎯
36
⎯
⎯
180
⎯
⎯
42
⎯
⎯
23
⎯
⎯
19
⎯
Min
Typ.
Max
Rise time
VDS = 25 V, VGS = 0 V, f = 1 MHz
Turn-on time
ton
50 Ω
Switching time
Fall time
ID = 5 A
10 V
VGS
0V
tr
tf
Turn-off time
VDD ∼
− 200 V
Duty ≤ 1%, tw = 10 μs
toff
Total gate charge
Qg
Gate-source charge
Qgs
Gate-drain charge
Qgd
VDD ∼
− 400 V, VGS = 10 V, ID = 10 A
pF
ns
nC
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Unit
Continuous drain reverse current (Note 1)
IDR
⎯
⎯
⎯
10
A
Pulse drain reverse current
IDRP
⎯
⎯
⎯
40
A
(Note 1)
Forward voltage (diode)
VDSF
IDR = 10 A, VGS = 0 V
⎯
⎯
−1.7
V
Reverse recovery time
trr
IDR = 10 A, VGS = 0 V,
⎯
170
⎯
ns
Reverse recovery charge
Qrr
dIDR/dt = 100 A/μs
⎯
0.6
⎯
μC
Marking
Note 4: A line under a Lot No. identifies the indication of product
Labels.
Not underlined: [[Pb]]/INCLUDES > MCV
Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
K4015
Part No. (or abbreviation code)
Lot No.
Note 4
Please contact your TOSHIBA sales representative for details as to
environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament
and of the Council of 27 January 2003 on the restriction of the use of
certain hazardous substances in electrical and electronic equipment.
2
2009-09-29
2SK4015
ID – VDS
COMMON SOURCE
Tc = 25°C
PULSE TEST
8
ID – VDS
20
10
10
6.3
8
7
8
7
DRAIN CURRENT ID (A)
DRAIN CURRENT ID (A)
10
6
6
5.7
4
5.4
2
VGS = 5 V
16
COMMON SOURCE
Tc = 25°C
PULSE TEST
6.8
6.6
12
6.3
8
6
5.7
4
5.4
VGS = 5 V
0
0
0
2
4
6
8
10
0
DRAIN−SOURCE VOLTAGE VDS (V)
10
20
DRAIN−SOURCE VOLTAGE VDS (V)
DRAIN CURRENT ID (A)
25
8
100
4
0
2
COMMON SOURCE
Tc = 25℃
PULSE TEST
Tc = −55°C
12
0
4
6
8
GATE−SOURCE VOLTAGE VGS
8
4
5
2
2
0
10
ID = 10 A
6
0
(V)
4
8
10
COMMON SOURCE
VDS = 10 V
PULSE TEST
Tc = −55°C
25
100
1
0.1
0. 1
1
16
20
(V)
RDS (ON) – ID
DRAIN−SOURCE ON-RESISTANCE
RDS (ON) (Ω)
FORWARD TRANSFER ADMITTANCE
⎪Yfs⎪ (S)
10
12
GATE−SOURCE VOLTAGE VGS
|Yfs| – ID
100
50
VDS – VGS
10
COMMON SOURCE
VDS = 10 V
PULSE TEST
40
DRAIN−SOURCE VOLTAGE VDS (V)
ID – VGS
16
30
10
1
VGS = 10 V
0.1
0.1
100
DRAIN CURRENT ID (A)
COMMON SOURCE
Tc = 25°C
PULSE TEST
1
10
100
DRAIN CURRENT ID (A)
3
2009-09-29
2SK4015
RDS (ON) − Tc
IDR − VDS
100
COMMON SOURCE
VGS = 10 V
PULSE TEST
ID = 10 A
1.2
2
5
0.8
0.4
−40
0
40
80
CASE TEMPERATURE
120
160
10
0.1
10
5
1
Tc (°C)
VGS = 0 V
1
3
0
0.4
0.8
C − VDS
Vth (V)
Ciss
GATE THRESHOLD VOLTAGE
(pF)
CAPACITANCE C
5
1000
100
Coss
1
0.1
Crss
COMMON SOURCE
VGS = 0 V
f = 1 MHz
Tc = 25°C
1
10
4
3
2
1
0
−80
100
COMMON SOURCE
VDS = 10 V
ID = 1 mA
−40
DRAIN−SOURCE VOLTAGE VDS (V)
DRAIN−SOURCE VOLTAGE VDS (V)
PD (W)
DRAIN POWER DISSIPATION
600
40
30
20
10
80
120
CASE TEMPERATURE
40
80
120
160
Tc (°C)
DYNAMIC INPUT/OUTPUT
CHARACTERISTICS
50
40
0
CASE TEMPERATURE
PD − Tc
0
0
1.6
Vth − Tc
10000
10
1.2
DRAIN−SOURCE VOLTAGE VDS (V)
160
500
400
Tc (°C)
VDS
12.5
VDD = 100 V
200 V
400 V
300
10
7.5
VGS
200
5
100
2.5
0
0
200
15
COMMON SOURCE
ID = 10 A
Tc = 25°C
PULSE TEST
(V)
0
−80
COMMON SOURCE
Tc = 25°C
PULSE TEST
20
40
60
GATE−SOURCE VOLTAGE VGS
1.6
DRAIN REVERSE CURRENT IDR (A)
DRAIN−SOURCE ON-RESISTANCE
RDS (ON) (Ω)
2.0
0
80
TOTAL GATE CHARGE Qg (nC)
4
2009-09-29
2SK4015
NORMALIZED TRANSIENT THERMAL
IMPEDANCE rth (t)/Rth (ch-c)
rth – tw
10
1
Duty
= 0.5
Duty=0.5
0.2
0.1
0.1
0.05
PDM
0.02
t
0.01
T
0.01
0.001
10μ
SINGLE PULSE
100μ
1m
Duty = t/T
Rth (ch-c) = 2.78°C/W
10m
PULSE WIDTH
100m
1
10
tw (s)
SAFE OPERATING AREA
EAS – Tch
100
500
ID max (PULSED) *
10
AVALANCHE ENERGY
EAS (mJ)
DRAIN CURRENT ID
(A)
100 μs *
ID max (CONTINUOUS) *
1 ms *
1
0.1
DC OPERATION
Tc = 25°C
Tc = 25°C
TEMPERATURE.
10
200
100
50
75
100
125
150
CHANNEL TEMPERATURE (INITIAL)
Tch (°C)
CURVES MUST BE DERATED
0.01
1
300
0
25
* SINGLE NONREPETITIVE PULSE
LINEARLY WITH INCREASE IN
400
VDSS max
100
DRAIN-SOURCE VOLTAGE
15 V
1000
VDS
(V)
BVDSS
IAR
−15 V
VDD
TEST CIRCUIT
RG = 25 Ω
VDD = 90 V, L = 6.36 mH
5
VDS
WAVEFORM
Ε AS =
⎛
⎞
1
B VDSS
⎟
⋅ L ⋅ I2 ⋅ ⎜
⎜B
⎟
2
−
V
VDSS
DD
⎝
⎠
2009-09-29
2SK4015
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
6
2009-09-29