FREESCALE MRF553

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by MRF553/D
SEMICONDUCTOR TECHNICAL DATA
The RF Line
Designed primarily for wideband large signal predriver stages in the VHF
frequency range.
• Specified @ 12.5 V, 175 MHz Characteristics
Output Power = 1.5 W
Minimum Gain = 11.5 dB
Efficiency 60% (Typ)
1.5 W, 175 MHz
RF LOW POWER
TRANSISTOR
NPN SILICON
• Cost Effective PowerMacro Package
• Electroless Tin Plated Leads for Improved Solderability
• Circuit board photomaster available upon request by
contacting RF Tactical Marketing in Phoenix, AZ.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector–Emitter Voltage
VCEO
16
Vdc
Collector–Base Voltage
VCBO
36
Vdc
Emitter–Base Voltage
VEBO
4.0
Vdc
Collector Current — Continuous
IC
500
mAdc
Total Device Dissipation @ TC = 75°C (1, 2)
Derate above 75°C
PD
3.0
40
Watts
mW/°C
Storage Temperature Range
Tstg
– 55 to +150
°C
CASE 317D–02, STYLE 2
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance Junction to Case
Symbol
Max
Unit
RθJC
25
°C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
Collector–Emitter Breakdown Voltage
(IC = 10 mAdc, IB = 0)
V(BR)CEO
16
—
—
Vdc
Collector–Emitter Breakdown Voltage
(IC = 5.0 mAdc, VBE = 0)
V(BR)CES
36
—
—
Vdc
Collector–Base Breakdown Voltage
(IC = 5.0 mAdc, IE = 0)
V(BR)CBO
36
—
—
Vdc
Emitter–Base Breakdown Voltage
(IE = 1.0 mAdc, IC = 0)
V(BR)EBO
4.0
—
—
Vdc
ICES
—
—
5.0
mAdc
hFE
30
—
200
—
Characteristic
OFF CHARACTERISTICS
Collector Cutoff Current
(VCE = 15 Vdc, VBE = 0, TC = 25°C)
ON CHARACTERISTICS
DC Current Gain
(IC = 250 mAdc, VCE = 5.0 Vdc)
NOTES:
(continued)
1. TC, Case temperature measured on collector lead immediately adjacent to body of package.
2. The MRF553 PowerMacro must be properly mounted for reliable operation. AN938, “Mounting Techniques in PowerMacro Transistor,”
discusses methods of mounting and heatsinking.
REV 7
RF DEVICE DATA
MOTOROLA
Motorola, Inc. 1995
MRF553
1
ELECTRICAL CHARACTERISTICS — continued (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Cob
—
12
20
pF
DYNAMIC CHARACTERISTICS
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
FUNCTIONAL TESTS
Common–Emitter Amplifier Power Gain
(VCC = 12.5 Vdc, Pout = 1.5 W, f = 175 MHz)
Figures 1, 2
Gpe
11.5
13
—
dB
Collector Efficiency
(VCC = 12.5 Vdc, Pout = 1.5 W, f = 175 MHz)
Figures 1, 2
η
50
60
—
%
ψ
Load Mismatch Stress
(VCC = 12.5 Vdc, Pout = 1.5 W, f = 175 MHz,
VSWR ≥ 10:1 All Phase Angles)
—
No Degradation in Output Power
5xB
R1
VBB =
12.5 V
VCC =
12.5 V
L9
C5
C6
+
R2
+
B
D1
C9
C10
L5
C8
B
C4
L8
L4
D.U.T.
L1
RF
INPUT
C2
L6
L7
C7
RF
OUTPUT
L3
L2
C1
C3
C1 — 36 pF Mini Underwood
C2 — 47 pF Mini Underwood
C3 — 91 pF Mini Underwood
C4 — 68 pF Mini Underwood
C5, C9 — 1.0 µF Erie Red Cap Capacitor
C6, C10 — 0.1 µF, 35 V Tantulum
C7 — 470 pF Chip Capacitor
C8 — 2200 pF Chip Capacitor
R1 — 4.7 kΩ, 1/4 W
R2 — 100 Ω, 1/4 W
D1 — 1N4148 Diode
L1 — 3 Turns, #18 AWG, 0.210″ ID, 3/16″ Length
L2, L4, L7 — 0.62″, #18 AWG Wire Bent into “V”
L3, L6 — 60 x 125 x 250 Mils Copper Pad on 27 Mils Thick Alumina Substrate
L5 — 12 µH Molded Choke
L8 — 7 Turns, #18 AWG, 0.170″ ID, 7/16″ Length
L9 — 1.0″, #18 AWG Wire with 5 Ferrite Beads
B — Ferrite Bead
Board Material — Glass Teflon, εr = 2.56, t = 0.0625″
Figure 1. 140 – 175 MHz Broadband Circuit Schematic
MRF553
2
MOTOROLA RF DEVICE DATA
100
18
90
80
Gpe
14
12
IRL, INPUT RETURN LOSS (dB)
G pe , POWER GAIN (dB)
16
ηc
10
Pout = 1.5 W, VCC = 12.5 Vdc
8
6
IRL
4
2
140
150
160
f, FREQUENCY (MHz)
70
60
50
5 40
10 30
15 20
20 10
η c , COLLECTOR EFFICIENCY (%)
20
0
180
170
Figure 2. Typical Performance in
Broadband Circuit
Zin
Ohms
ZOL*
Ohms
f
Frequency
MHz
100 mW
200 mW
300 mW
50 mW
100 mW
150 mW
140
1.65–j3.6
2.0–j2.6
2.3–j1.2
1.7–j4.1
1.8–j3.1
175
2.5–j5.6
2.3–j5.9
2.8–j4.0
2.3–j4.6
2.4–j1.2
VCC = 7.5 V; Pin
VCC = 12.5 V; Pin
VCC = 7.5 V; Pout
1.0 W
1.6 W
1.9–j2.7
9.9–j11.1
2.4–j5.7
12.1–j14.9
VCC = 12.5 V; Pout
2.2 W
1.1 W
2.0 W
2.6 W
10.6–j5.1
10–j4.9
28.3–j21.5
16–j20.5
16.3–j16.5
7.2–j9.8
8.1–j5.4
30.8–j23.3 11.4–j20.9 11.1–j14.3
Zin
Ohms
ZOL*
Ohms
f
Frequency
MHz
50 mW
100 mW
200 mW
25 mW
50 mW
100 mW
1.25 W
1.5 W
2.0 W
1.5 W
2.25 W
3.0 W
90
2.5–j9.3
2.5–j6.4
2.5–j4.4
1.6–j10.7
2.5–j7.1
2.2–j1.3
31.8–j9.2
32–j8.9
30.2–j10.7
45.8–j7.2
45.2–j3.9
40–j4.5
VCC = 7.5 V; Pin
VCC = 12.5 V; Pin
VCC = 7.5 V; Pout
VCC = 12.5 V; Pout
ZOL* = Conjugate of the optimum load impedance into which the device output operates at a given output power, voltage and frequency.
Table 1. Zin and ZOL versus Collector Voltage, Input Power, and Output Power
MOTOROLA RF DEVICE DATA
MRF553
3
4
Pout , POWER OUTPUT (WATTS)
Pout , POWER OUTPUT (WATTS)
2.5
2
1.5
1
f = 175 MHz
VCC = 7.5 Vdc
0.5
0
100
200
Pin, POWER INPUT (mW)
300
3
2
f = 175 MHz
VCC = 12.5 Vdc
1
Figure 3. Power Output versus Power Input
100
Pin, POWER INPUT (mW)
200
150
Figure 4. Power Output versus Power Input
4
4
Pout , OUTPUT POWER (WATTS)
Pout , POWER OUTPUT (WATTS)
50
0
400
3
Pin = 300 mW
2
200 mW
100 mW
1
3
Pin = 150 mW
100 mW
2
50 mW
1
VCC = 7.5 Vdc
140
150
VCC = 12.5 Vdc
160
f, FREQUENCY (MHz)
170
180
140
Figure 5. Power Output versus Frequency
150
160
f, FREQUENCY (MHz)
170
180
Figure 6. Power Output versus Frequency
4
4
Pin = 150 mW
3
2
Pout , POWER OUTPUT (WATTS)
Pout , POWER OUTPUT (WATTS)
Pin = 150 mW
f = 140 MHz
100 mW
50 mW
1
6
8
10
12
VCC, COLLECTOR VOLTAGE (Vdc)
14
Figure 7. Power Output versus
Collector Voltage
MRF553
4
16
f = 175 MHz
3
100 mW
2
50 mW
1
6
8
10
12
VCC, COLLECTOR VOLTAGE (Vdc)
14
16
Figure 8. Power Output versus
Collector Voltage
MOTOROLA RF DEVICE DATA
PACKAGE DIMENSIONS
F
H
R
1
A
4
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. LEAD DIMENSIONS UNCONTROLLED WITHIN
DIMENSION N AND R.
3
D
K
N
T
SEATING
PLANE
C
DIM
A
C
D
F
H
J
K
N
R
T
INCHES
MIN
MAX
0.175
0.205
0.075
0.100
0.033
0.039
0.097
0.104
0.348
0.383
0.008
0.012
0.285
0.320
–––
0.065
–––
0.128
0.025
0.040
MILLIMETERS
MIN
MAX
4.45
5.20
1.91
2.54
0.84
0.99
2.46
2.64
8.84
9.72
0.24
0.30
7.24
8.12
–––
1.65
–––
3.25
0.64
1.01
J
STYLE 2:
PIN 1.
2.
3.
4.
COLLECTOR
EMITTER
BASE
EMITTER
CASE 317D–02
ISSUE C
MOTOROLA RF DEVICE DATA
MRF553
5
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
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against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
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P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447
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51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MRF553
6
◊
*MRF553/D*
MRF553/D
MOTOROLA RF DEVICE
DATA