S DT 452AP S amHop Microelectronics C orp. Augus t , 2002 P -C hannel E nhancement Mode Field E ffect Transistor F E AT UR E S P R ODUC T S UMMAR Y V DS S ID R DS (ON) S uper high dense cell design for low R DS (ON ). ( m W ) TYP R ugged and reliable. 52 @ V G S = -10V -30V S OT-223 P ackage. -5.3A 85 @ V G S = -4.5V D D S D S D S OT-223 G G G S OT-223 (J 23Z) S ABS OLUTE MAXIMUM R ATINGS (T A=25 C unless otherwise noted) S ymbol Limit Unit Drain-S ource Voltage V DS -30 V Gate-S ource Voltage V GS 20 V ID -5.3 A IDM -16 A Drain-S ource Diode Forward C urrent IS 5.3 A Maximum P ower Dissipation @ Tc=25 C Derate above 25 C PD 3 0.08 W W/ C T J , T S TG -65 to 150 C P arameter Drain C urrent-C ontinuous -P ulsed @ TJ=125 C a Operating and S torage Temperature R ange THE R MAL C HAR AC TE R IS TIC S Thermal R esistance, Junction-to-C ase R JC 12 C /W Thermal R esistance, Junction-to-Ambient R JA 42 C /W 1 S DT 452AP E LE CTR ICAL CHAR ACTE R IS TICS (T A =25 C unless otherwise noted) Parameter 5 Condition S ymbol Min Typ C Max Unit OFF CHAR ACTE R IS TICS Drain-S ource Breakdown Voltage BV DS S V GS = 0V, ID = -250uA Zero Gate Voltage Drain Current IDS S V DS = -24V, V GS = 0V Gate-Body Leakage IGS S V GS = 20V, V DS = 0V Gate Threshold Voltage V GS (th) V DS = V GS , ID = -250uA Drain-S ource On-S tate R esistance R DS (ON) On-S tate Drain Current ID(ON) gFS -30 V -1 uA 100 nA -1.5 -3 V V GS = -10V, ID =-5.3A 52 65 m ohm V GS = -4.5V, ID = -4.2A 85 100 m ohm ON CHAR ACTE R IS TICS b Forward Transconductance DYNAMIC CHAR ACTE R IS TICS C IS S Output Capacitance C OS S R everse Transfer Capacitance CRSS S WITCHING CHAR ACTE R IS TICS R ise Time Turn-Off Delay Time V DS = -10V, ID = - 5.3A A -16 -7 S 860 PF 470 PF 180 PF c Input Capacitance Turn-On Delay Time V DS = -5V, V GS = -10V -1 V DS =-15V, V GS = 0V f =1.0MH Z c tD(ON) 9 20 ns 10 40 ns 37 90 ns 23 110 ns V DS =-15V,ID = -5.3A,V GS =-10V 15 20 nC V DS =-15V,ID = -5.3A,V GS =-4.5V 8.8 10.6 nC V DS =-15V, ID = -5.3A, V GS =-10V 3 nC 4 nC V D = -15V, ID = -1A, V GE N = - 10V, R GE N = 6 ohm tr tD(OFF) Fall Time tf Total Gate Charge Qg Gate-S ource Charge Q gs Gate-Drain Charge Q gd 2 S DT 452AP E LE CTR ICAL CHAR ACTE R IS TICS (T A=25 C unless otherwise noted) Parameter Min Typ C Max Unit Condition S ymbol DR AIN-S OUR CE DIODE CHAR ACTE R IS TICS b Diode Forward Voltage 5 V GS = 0V, Is =-5.3A VSD -0.84 -1.3 Notes a.S urface Mounted on FR 4 Board, t 10sec. b.Pulse Test:Pulse Width 300us, Duty Cycle 2%. c.Guaranteed by design, not subject to production testing. 20 10 -55 C 25 C -V G S =10,9,8,7,6V 16 -I D , Drain C urrent (A) -I D , Drain C urrent (A) 8 -V G S =5V 6 4 2 0 12 8 4 0 0 0.5 1.0 1.5 2.0 2.5 T j=125 C 3.0 0 F igure 1. Output C haracteris tics R DS (ON) , On-R es is tance(Ohms ) (Normalized) C , C apacitance (pF ) 2500 2000 1500 C is s C os s C rs s 0 0 5 10 15 20 25 1.5 2 2.5 3 F igure 2. Trans fer C haracteris tics 3000 500 1 -V G S , G ate-to-S ource Voltage (V ) -V DS , Drain-to-S ource Voltage (V ) 1000 0.5 30 1.8 1.6 V G S =-10V I D =-5.3A 1.4 1.2 1.0 0.8 0.6 -50 0 50 100 150 T j, J unction T emperature ( C ) -V DS , Drain-to S ource Voltage (V ) F igure 4. On-R es is tance Variation with Temperature F igure 3. C apacitance 3 V B V DS S , Normalized Drain-S ource B reakdown V oltage 1.09 V DS =V G S I D =-250uA 1.06 1.03 1.00 0.97 0.94 0.91 -50 -25 0 25 50 75 100 125 150 I D =-250uA 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 150 T j, J unction T emperature ( C ) F igure 5. G ate T hres hold V ariation with T emperature F igure 6. B reakdown V oltage V ariation with T emperature 20.0 V G S =0V 12 -Is , S ource-drain current (A) gF S , T rans conductance (S ) 1.15 T j, J unction T emperature ( C ) 15 9 6 3 V DS =-15V 5 10 15 10.0 1.0 0 0 20 0.4 -I DS , Drain-S ource C urrent (A) 0.6 0.7 0.9 1.1 1.3 -V S D , B ody Diode F orward V oltage (V ) F igure 7. T rans conductance V ariation with Drain C urrent F igure 8. B ody Diode F orward V oltage V ariation with S ource C urrent 10 50 V DS =-15V I D =-5.3A 8 -I D , Drain C urrent (A) V G S , G ate to S ource V oltage (V ) 5 V th, Normalized G ate-S ource T hres hold V oltage S DT 452AP 6 4 2 10 RD 0 2 4 6 8 10 12 14 Qg, T otal G ate C harge (nC ) im it 10 10 0.1 0m ms s 1s DC V G S =-10V S ingle P ulse T A =25 C 0.1 16 )L 1 0.03 0 ON S( 1 10 30 50 -V DS , Drain-S ource V oltage (V ) F igure 10. Maximum S afe O perating Area F igure 9. G ate C harge 4 S DT 452AP -V DD ton V IN D td(off) V OUT V OUT 5 tf 90% 90% VG S R GE N toff tr td(on) RL 10% 10% G 90% S V IN 50% 10% 50% INVE R TE D P ULS E WIDTH F igure 12. S witching Waveforms F igure 11. S witching T es t C ircuit r(t),Normalized E ffective T ransient T hermal Impedance 2 1 Duty C ycle=0.5 0.2 P DM 0.1 0.1 t1 0.05 1. 2. 3. 4. 0.02 S ingle P uls e 0.01 10 -4 10 -3 10 -2 10 -1 1 S quare Wave P uls e Duration (s ec) F igure 13. Normalized T hermal T rans ient Impedance C urve 5 t2 R θJ A (t)=r (t) * R θJ A R θJ A =S ee Datas heet T J M-T A = P DM* R θJ A (t) Duty C ycle, D=t1/t2 10 100