INTEGRATED CIRCUITS DATA SHEET TDA8566TH 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs Objective specification File under Integrated Circuits, IC01 2001 Apr 24 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH FEATURES • Low power dissipation in any short-circuit condition • Differential inputs • Thermally protected • Very high Common Mode Rejection Ratio (CMRR) • Reverse polarity safe • High common mode input signal handling • Protected against electrostatic discharge • Requires very few external components • No switch-on/switch-off plops • High output power • Low thermal resistance. • 4 and 2 Ω load driving capability • Low offset voltage at output GENERAL DESCRIPTION • Fixed gain The TDA8566TH is an integrated class-B output amplifier contained in a 20-lead small outline plastic package. The device contains 2 amplifiers in a Bridge-Tied Load (BTL) configuration. The output power is 2 × 25 W in a 4 Ω load or 2 × 40 W in a 2 Ω load. It has a differential input stage and 2 diagnostic outputs. The device is primarily developed for car radio applications. • Diagnostic facility (distortion, short-circuit and temperature pre-warning) • Good ripple rejection • Mode select switch (operating, mute and standby) • Load dump protection • Short-circuit proof to ground, to VP and across the load QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP operating supply voltage 6 14.4 18 V IORM repetitive peak output current − − 7.5 A Iq(tot) total quiescent current − 115 − mA Istb standby current − 0.1 10 µA Isw switch-on current − − 40 µA Zi input impedance 100 120 − kΩ Pout output power − 25 − W RL = 2 Ω; THD = 10% − 40 − W SVRR supply voltage ripple rejection Rs = 0 Ω − 60 − dB αcs channel separation Rs = 10 kΩ − 50 − dB RL = 4 Ω; THD = 10% CMRR common mode rejection ratio − 75 − dB Gv closed loop voltage gain 25 26 27 dB Vn(o) noise output voltage − − 120 µV Rs = 0 Ω ORDERING INFORMATION TYPE NUMBER TDA8566TH 2001 Apr 24 PACKAGE NAME DESCRIPTION VERSION HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2 2 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH BLOCK DIAGRAM handbook, full pagewidth IN1+ IN1− 8 + mute switch VP1 VP2 12 19 CM − 9 13 + 2.3 kΩ VA OUT1+ − 2.3 kΩ + (9×) mute switch CM − 15 60 kΩ + 2.3 kΩ 60 kΩ VA OUT1− − 2.3 kΩ n.c. 4, 5, 6, 7 (9×) 20 standby switch MODE TDA8566TH Vref SGND standby reference voltage VA 10 mute switch CLIP 11 CLIP 1× DIAG 60 kΩ IN2+ IN2− 1 DIAG mute reference voltage 60 kΩ 2 + mute switch CM − 3 16 2.3 kΩ + VA OUT2+ − 2.3 kΩ + mute switch (9×) CM − 18 2.3 kΩ + VA − 2.3 kΩ 17 (9×) 14 MGU358 PGND2 PGND1 Fig.1 Block diagram. 2001 Apr 24 3 OUT2− Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH PINNING SYMBOL PIN DESCRIPTION DIAG 1 short-circuit and temperature pre-warning diagnostic output IN2+ 2 channel 2 input positive IN2− 3 channel 2 input negative n.c. 4 not connected n.c. 5 not connected n.c. 6 not connected VP2 19 2 IN2+ n.c. 7 not connected OUT2− 18 3 IN2− IN1+ 8 channel 1 input positive PGND2 17 4 n.c. IN1− 9 channel 1 input negative OUT2+ 16 SGND 10 signal ground CLIP 11 clip detection output VP1 12 supply voltage 1 OUT1+ 13 channel 1 output positive PGND1 14 power ground 1 OUT1− 15 channel 1 output negative OUT2+ 16 channel 2 output positive PGND2 17 power ground 2 OUT2− 18 channel 2 output negative VP2 19 supply voltage 2 MODE 20 mode select switch input (standby/mute/operating) 2001 Apr 24 handbook, halfpage 1 DIAG MODE 20 5 n.c. TDA8566TH OUT1− 15 6 n.c. PGND1 14 7 n.c. OUT1+ 13 8 IN1+ VP1 12 9 IN1− CLIP 11 10 SGND MGU356 Fig.2 Pin configuration. 4 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH FUNCTIONAL DESCRIPTION Short-circuit diagnostic (pin DIAG) The TDA8566TH contains 2 identical amplifiers and can be used for BTL applications. The gain of each amplifier is fixed at 26 dB. Special features of this device are: When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the output stages are switched off until the short-circuit is removed and the device is switched on again (with a delay of approximately 20 ms after the removal of the short-circuit). During this short-circuit condition, pin DIAG is continuously LOW. 1. Mode select switch 2. Clip detection 3. Short-circuit diagnostic When a short-circuit occurs across the load of one or both channels, the output stages are switched off for approximately 20 ms. After that time the load condition is checked during approximately 50 µs to see whether the short-circuit is still present. Due to this duty cycle of 50 µs/20 ms the average current consumption during the short-circuit condition is very low (approximately 40 mA). During this condition, pin DIAG is LOW for 20 ms and HIGH for 50 µs; see Fig.4. The power dissipation in any short-circuit condition is very low. 4. Temperature pre-warning 5. Open-collector diagnostic outputs 6. Differential inputs. Mode select switch (pin MODE) • Standby: low supply current • Mute: input signal suppressed • Operating: normal on condition. Since this pin has a very low input current (<40 µA), a low cost supply switch can be applied. To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode for a period of ≥150 ms (charging the input capacitors at pins IN1+, IN1−, IN2+ and IN2−). This can be realized by using a microcontroller or by using an external timing circuit as illustrated in Fig.7. Temperature pre-warning (pin DIAG) When the junction temperature (Tvj) reaches 145 °C, pin DIAG will become continuously LOW. Open-collector diagnostic outputs Pins DIAG and CLIP are open-collector outputs, therefore more devices can be tied together. Pins DIAG and CLIP can also be tied together. An external pull-up resistor is required. Clip detection (pin CLIP) When clipping occurs at one or more output stages, the dynamic distortion detector becomes active and pin CLIP goes LOW. This information can be used to drive a sound processor or a DC volume control to attenuate the input signal and so limit the level of distortion. The output level of pin CLIP is independent of the number of channels that are being clipped. The clip detection circuit is disabled in a short-circuit condition, so if a fault condition occurs at the outputs, pin CLIP will remain at a HIGH level. The clip detection waveforms are illustrated in Fig.3. Differential inputs The input stage is a high-impedance fully differential balanced input stage that is also capable of operating in a single-ended mode with one of the inputs capacitively coupled to an audio ground. It should be noted that if a source resistance is added (input voltage dividers) the CMRR degrades to lower values. MGU357 handbook, halfpageVO (V) 0 VCLIP (V) 0 t (s) Fig.3 Clip detection waveforms. 2001 Apr 24 5 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH handbook, full pagewidthcurrent MGU360 in output stage t (s) short-circuit over the load VDIAG 20 ms (V) t (s) 50 µs Fig.4 Short-circuit diagnostic timing diagram. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP PARAMETER supply voltage CONDITIONS MIN. MAX. UNIT operating − 18 V non-operating − 30 V load dump protection; during 50 ms; tr ≥ 2.5 ms − 45 V IOSM non-repetitive peak output current − 10 A IORM repetitive peak output current − 7.5 A Tstg storage temperature −55 +150 °C Tvj virtual junction temperature − 150 °C Tamb ambient temperature −40 +85 °C Vpsc short-circuit safe voltage − 18 V Vrp reverse polarity voltage − 6.0 V Ptot total power dissipation − 60 W QUALITY SPECIFICATION Quality specification in accordance with “SNW-FQ-611D”, if this type is used as an audio amplifier. THERMAL CHARACTERISTICS Thermal characteristics in accordance with IEC 60747-1. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-c) thermal resistance from junction to case see Fig.5 1.9 K/W Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W 2001 Apr 24 6 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs output 1 handbook, halfpage TDA8566TH output 2 virtual junction 3.2 K/W 3.2 K/W 0.3 K/W case MGU361 Fig.5 Equivalent thermal resistance network. DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; measured in test circuit of Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP Iq supply voltage quiescent current note 1 RL = ∞ 6 − 14.4 115 18 180 V mA VMODE = 14.4 V note 2 8.5 − − − − 15 7.0 − VP 40 − 100 V µA V mV 3.3 − − − − 7.0 − − 6.4 − 60 60 V V mV mV 0 − − 0.1 2 10 V µA − 0.6 V Operating condition VMODE IMODE VO VOO mode select switch level mode select switch current output voltage output offset voltage Mute condition VMODE VO VOO ∆VOO mode select switch level output voltage output offset voltage output offset voltage difference note 2 with respect to operating condition Standby condition VMODE Istb mode select switch level standby current Diagnostic VDIAG diagnostic output voltage during any fault condition − Notes 1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V. 2. At VP = 18 to 30 V the DC output voltage is ≤0.5VP. 2001 Apr 24 7 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH AC CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; RL = 2 Ω; fi = 1 kHz; measured in test circuit of Fig.6; unless otherwise specified. SYMBOL Po THD PARAMETER output power total harmonic distortion CONDITIONS MIN. TYP. MAX. UNIT THD = 0.5% 25 30 − W THD = 10% 33 40 − W THD = 30% 45 55 − W VP = 13.5 V; THD = 0.5% − 25 − W VP = 13.5 V; THD = 10% − 35 − W THD = 0.5%; RL = 4 Ω 16 19 − W THD = 10%; RL = 4 Ω 21 25 − W THD = 30%; RL = 4 Ω 28 35 − W VP = 13.5 V; THD = 0.5%; RL = 4 Ω − 14 − W VP = 13.5 V; THD = 10%; RL = 4 Ω − 22 − W Po = 1 W − 0.1 − % VCLIP = 0.6 V; note 1 − 8 − % − % Po = 1 W; RL = 4 Ω − 0.05 B power bandwidth THD = 0.5%; Po = −1 dB with respect to 25 W − 20 to 20000 − Hz fro(l) low frequency roll off −1 dB; note 2 − 25 − Hz fro(h) high frequency roll off −1 dB Gv closed loop voltage gain SVRR supply voltage ripple rejection Zi input impedance ∆Zi input impedance mismatch Vn(o) noise output voltage αcs channel separation ∆Gv channel unbalance 2001 Apr 24 20 − − kHz 25 26 27 dB operating; note 3 50 − − dB mute; note 3 50 − − dB standby; note 3 80 − − dB differential 100 120 150 kΩ single-ended 50 60 75 kΩ − 2 − % 85 120 µV operating; Rs = 0 Ω; note 4 − operating; Rs = 10 kΩ; note 4 − 100 − µV mute; independent of Rs; note 4 − 60 − µV Po = 25 W; Rs = 10 kΩ 45 − − dB − − 1 dB 8 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs SYMBOL PARAMETER CONDITIONS Vo(mute) output signal voltage in mute Vin = Vin(max) = 1 V (RMS) CMRR common mode rejection ratio TDA8566TH MIN. − TYP. MAX. UNIT − 2 mV Rs = 0 Ω; note 5 60 75 − dB Rs = 45 kΩ; note 6 40 − − dB Notes 1. Dynamic distortion detector active; pin CLIP is LOW. 2. Frequency response externally fixed. 3. Vripple = Vripple(max) = 2 V (p-p); Rs = 0 Ω. 4. Noise measured in a bandwidth of 20 Hz to 20 kHz. 5. Common mode rejection ratio measured at the output (over RL) with both inputs tied together; Vcommon ≤ 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 Ω. 6. Common mode rejection ratio measured at the output (over RL) with both inputs tied together; Vcommon ≤ 3.5 V (RMS); fi = 1 kHz; Rs = 45 kΩ. The mismatch of the input coupling capacitors is excluded. 2001 Apr 24 9 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH TEST AND APPLICATION INFORMATION handbook, full pagewidth + V P= _ 14.4 V + Vmode _ 20 + 8 Rs/2 220 nF 12 19 + 60 kΩ 13 + − TDA8566TH Vin1 Rs/2 220 nF _ 9 60 kΩ − + 2 10 kΩ − CLIP DETECTOR 11 DIAGNOSTIC INTERFACE 1 + 60 kΩ VP VP + 10 220 nF RL1 15 _ Vref + Rs/2 2200 µF/16V 100 nF 10 kΩ CLIP DIAG 16 + − RL2 Vin2 Rs/2 220 nF _ 3 60 kΩ − 18 _ + 14 17 MGU359 Fig.6 Stereo BTL test diagram. Application information DIAGNOSTIC OUTPUT +Vsupply handbook, halfpage Special care must be taken in the PCB layout to separate pin CLIP from pins IN1+, IN1−, IN2+ and IN2− to minimize the crosstalk between the CLIP output and the inputs. S 10 kΩ 100 Ω MODE SELECT SWITCH To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode during ≥150 ms (charging of the input capacitors at pins IN1+, IN1−, IN2+ and IN2−). The circuit in Fig.7 slowly ramps-up the voltage at the mode select switch pin when switching on and results in fast muting when switching off. 47 µF mode select switch 100 kΩ MGD102 Fig.7 Mode select switch circuit. 2001 Apr 24 10 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH PACKAGE OUTLINE HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2 E D A x X c E2 y HE v M A D1 D2 10 1 pin 1 index Q A A2 E1 (A3) A4 θ Lp detail X 20 11 Z w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) D1 D2 E(2) E1 E2 e HE Lp Q +0.12 0.53 0.32 16.0 13.0 −0.02 0.40 0.23 15.8 12.6 1.1 0.9 11.1 10.9 6.2 5.8 2.9 2.5 1.27 14.5 13.9 1.1 0.8 1.7 1.5 bp c D(2) v w x y 0.25 0.25 0.03 0.07 Z θ 2.5 2.0 8° 0° Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 98-02-25 99-11-12 SOT418-2 2001 Apr 24 EUROPEAN PROJECTION 11 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs SOLDERING TDA8566TH If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Wave soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. 2001 Apr 24 12 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(1) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 Apr 24 13 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2001 Apr 24 14 Philips Semiconductors Objective specification 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs NOTES 2001 Apr 24 15 TDA8566TH Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753503/01/pp16 Date of release: 2001 Apr 24 Document order number: 9397 750 08125