PANASONIC UN228

Small Signal Transistor Arrays
UNA0228 (UN228)
Silicon PNP epitaxial planar type (2 elements)
Silicon NPN epitaxial planar type (2 elements)
Unit: mm
For motor drives
10
0.2+0.1
–0.0
0.4±0.1
9 8 7 6
0.5
Parameter
NPN
Symbol
Rating
Unit
VCBO
−12
V
Collector-emitter voltage
(Base open)
VCEO
−10
V
Emitter-base voltage
(Collector open)
VEBO
−7
V
IC
−1
A
Peak collector current
ICP
−2.5
A
Collector-base voltage
(Emitter open)
VCBO
12
V
Collector-emitter voltage
(Base open)
VCEO
10
V
Emitter-base voltage
(Collector open)
VEBO
7
V
Overall
Collector current
IC
1
A
Peak collector current
ICP
2.5
A
PT
0.5
W
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
Total power dissipation
*
3 4 5
0.9±0.1
6.5±0.3
12°
Collector-base voltage
(Emitter open)
Collector current
2
0.8
1.5±0.1
1.5 +0.2
–0.1
1
■ Absolute Maximum Ratings Ta = 25°C
PNP
0.5±0.2
5.5±0.3
7.7±0.3
• Small and lightweight
• Low power consumption
• Low voltage drive
• With 4 elements incorporated
45°
12°
■ Features
1: Emitter
2: Base
3: Collector
4: Base
5: Emitter
6: Emitter
7: Base
8: Collector
9: Base
10: Emitter
SO10-G1 Package
Marking Symbol: UN228
Internal Connection
10
9
8
7
6
1
2
3
4
5
Note) *: When the dissipation on one device is TC = 25°C
Note) The part number in the parenthesis shows conventional part number.
Publication date: March 2004
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1
UNA0228
■ Electrical Characteristics Ta = 25°C ± 3°C
• PNP
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = −10 µA, IE = 0
−12
Collector-emitter voltage (Base open)
VCEO
IC = −1 mA, IB = 0
−10
V
Emitter-base voltage (Collector open)
VEBO
IE = −10 µA, IC = 0
−7
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = −10 V, IE = 0
Forward current transfer ratio *1
hFE
VCE = −1 V, IC = − 0.5 A
VCE(sat)
IC = −1 A, IB = −30 mA
− 0.2
VCB = −6 V, IE = 50 mA, f = 200 MHz
150
MHz
65
pF
Collector-emitter saturation
voltage *1
Transition frequency
fT
Conditions
Collector output capacitance
(Common base, input open circuited)
Cob
VCB = −10 V, IE = 0, f = 1 MHz
Forward voltage *2
VF
IF = −1 A
Min
Typ
Max
Unit
V
200
−1
µA
800

− 0.3
V
−1.5
V
Max
Unit
• NPN
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
12
V
Collector-emitter voltage (Base open)
VCEO
IC = 1 mA, IB = 0
10
V
Emitter-base voltage (Collector open)
VEBO
IE = 10 µA, IC = 0
7
Collector-base cutoff current (Emitter open)
ICBO
VCB = 10 V, IE = 0
hFE
VCE = 1 V, IC = 0.5 A
VCE(sat)
IC = 1 A, IB = 30 mA
0.2
Forward current transfer ratio *1
Collector-emitter saturation voltage *1
Conditions
Min
Typ
V
200
1
µA
800

0.3
V
VCB = 6 V, IE = −50 mA, f = 200 MHz
150
MHz
Collector output capacitance
(Common base, input open circuited)
Cob
VCB = 10 V, IE = 0, f = 1 MHz
50
pF
Forward voltage *2
VF
IF = 1 A
Transition frequency
fT
1.5
V
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *1: Pulse measurement
*2: Application to the built-in diode
2
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UNA0228
Common characteristics chart
PT  Ta
Total power dissipation PT (W)
0.6
0.5
0.4
0.3
0.2
0.1
0
0
40
80
120
160
Ambient temperature Ta (°C)
Characteristics charts of PNP transistor block
IC  VBE
−6
Ta = 25°C
−5
−3.2
IB = −14 mA
−2.4
−12 mA
−10 mA
−8 mA
−1.6
−6 mA
Collector current IC (A)
−4.0
Collector current IC (A)
VCE(sat)  IC
VCE = −1 V
−4 mA
− 0.8
25°C
−4
Ta = 75°C
−3
−25°C
−2
0
−4
−6
−8
−10
−2
0
− 0.4 − 0.8 −1.2
0
Forward current transfer ratio hFE
VCE = −1 V
500
Ta = 75°C
25°C
300
−25°C
200
100
0
− 0.01
− 0.1
−1
Ta = 75°C
25°C
−25°C
−2.0
−2.4
−10−3
− 0.01
− 0.1
−1
−10
Collector current IC (A)
Cob  VCB
−1
Collector current IC (A)
−10
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
hFE  IC
400
−1.6
Base-emitter voltage VBE (V)
Collector-emitter voltage VCE (V)
600
IC / IB = 100/3
−10−2
−1
−12
−10
−10−1
−2 mA
0
Collector-emitter saturation voltage VCE(sat) (V)
IC  VCE
−4.8
240
f = 1 MHz
IE = 0
Ta = 25°C
200
160
120
80
40
0
− 0.1
−1
−10
−100
Collector-base voltage VCB (V)
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UNA0228
Characteristics charts of NPN transistor block
IC  VBE
6
Ta = 25°C
3.2
IB = 14 mA
2.4
12 mA
10 mA
8 mA
1.6
6 mA
4 mA
0.8
0
2
4
6
8
10
25°C
4
Ta = 75°C
3
2
0
12
0
Collector-emitter voltage VCE (V)
Ta = 75°C
25°C
−25°C
200
100
0.1
1
Collector current IC (A)
4
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
Forward current transfer ratio hFE
VCE = 1 V
400
0
0.01
0.8
1.2
1.6
2.0
2.4
10
120
f = 1 MHz
IE = 0
Ta = 25°C
100
80
60
40
20
0
0.1
1
10
Collector-base voltage VCB (V)
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10
IC / IB = 100/3
1
Ta = 75°C
25°C
10−1
−25°C
10−2
10−3
0.01
0.1
1
Collector current IC (A)
Cob  VCB
500
300
0.4
Base-emitter voltage VBE (V)
hFE  IC
600
−25°C
1
2 mA
0
VCE = 1 V
5
Collector current IC (A)
Collector current IC (A)
4.0
VCE(sat)  IC
Collector-emitter saturation voltage VCE(sat) (V)
IC  VCE
4.8
100
10
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and semiconductors described in this material
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the products or technical information described in this material and controlled under the "Foreign Exchange
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Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
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(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
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2003 SEP