S T S 3400 S amHop Microelectronics C orp. S ep.21 2004 N-C hannel E nhancement Mode Field E ffect Trans is tor F E AT UR E S P R ODUC T S UMMAR Y V DS S ID R DS (ON) S uper high dense cell design for low R DS (ON ). ( m W ) Max R ugged and reliable. 50 @ V G S = 10V 30V S OT-23 package. 3.5A 70 @ V G S =4.5V D S OT-23 D G S G S AB S OL UTE MAXIMUM R ATINGS (T A =25 C unles s otherwis e noted) S ymbol P arameter Limit Unit Drain-S ource Voltage V DS 30 V Gate-S ource Voltage V GS 20 V Drain C urrent-C ontinuous a @ T J =25 C b -P ulsed ID 3.5 A IDM 13 A Drain-S ource Diode Forward C urrent a IS 1.25 A Maximum P ower Dissipation a PD 1.25 W T J , T S TG -55 to 150 C Operating Junction and S torage Temperature R ange THE R MAL CHAR ACTE R IS TICS Thermal R esistance, Junction-to-Ambient a R thJA 1 100 C /W S T S 3400 E LE CTR ICAL CHAR ACTE R IS TICS (T A =25 C unless otherwise noted) Parameter S ymbol Condition Drain-S ource Breakdown Voltage BV DS S V GS = 0V, ID = 250uA Zero Gate Voltage Drain Current IDS S V DS = 24V, V GS = 0V Gate-Body Leakage IGS S V GS = 20V, V DS = 0V Gate Threshold Voltage V GS (th) V DS = V GS , ID = 250uA Drain-S ource On-S tate R esistance R DS (ON) Min Typ C Max Unit OFF CHAR ACTE R IS TICS 30 V 1 uA 100 nA 1.7 2.5 V V GS = 10V, ID = 3.5A 40 50 m-ohm V GS = 4.5V, ID = 2A 55 70 m-ohm ON CHAR ACTE R IS TICS b ID(ON) gFS On-S tate Drain Current Forward Transconductance V DS = 5V, V GS = 10V V DS = 5V, ID =3.5A 1 10 A 6 S 600 PF 125 PF 95 PF 14.2 ns 4.8 ns 19.6 ns 9.3 ns 6.8 nC 3.1 nC 1.95 nC DYNAMIC CHAR ACTE R IS TICS c Input Capacitance C IS S Output Capacitance C OS S R everse Transfer Capacitance CRSS S WITCHING CHAR ACTE R IS TICS Turn-On Delay Time R ise Time V DS =10V, V GS = 0V f =1.0MH Z c tD(ON) tr Turn-Off Delay Time tD(OFF) Fall Time Total Gate Charge tf Qg Gate-S ource Charge Q gs Gate-Drain Charge Q gd V DD = 10V, ID = 1A, V GS = 10V, R L = 10 ohm R GE N = 6 ohm V DS =10V, ID = 3.5A, V GS =4.5V 2 S T S 3400 E LE CTR ICAL CHAR ACTE R IS TICS (T A=25 C unless otherwise noted) Parameter DR AIN-S OUR CE DIODE CHAR ACTE R IS TICS b Diode Forward Voltage 0.82 V GS = 0V, Is =1.25A VSD 1.2 Notes a.S urface Mounted on FR 4 Board, t 10sec. b.Pulse Test:Pulse Width 300us, Duty Cycle 2%. c.Guaranteed by design, not subject to production testing. 25 20 25 C V G S =5V I D , Drain C urrent (A) ID , Drain C urrent(A) V G S =10,9,8,7,6V 12 V G S =4V 8 4 0 -55 C 20 16 V G S =3V 0 1 2 3 4 5 T j=125 C 15 10 5 0 0.0 6 V DS , Drain-to-S ource Voltage (V ) 2.2 400 200 C os s RDS(ON), On-Resistance (Normalized) C is s 1.8 2.4 3.0 3.6 V G S =10V I D =3.5A 1.8 600 1.2 F igure 2. Trans fer C haracteris tics 1000 800 0.6 V G S , G ate-to-S ource Voltage (V ) F igure 1. Output C haracteris tics C , C apacitance (pF ) 5 C Min Typ Max Unit Condition S ymbol 1.4 1.0 0.6 0.2 C rs s 0 0 5 10 15 20 25 0 30 -50 -25 0 25 50 75 100 125 T j( C ) V DS , Drain-to S ource Voltage (V ) F igure 4. On-R es is tance Variation with Temperature F igure 3. C apacitance 3 V V DS =V G S I D =250uA 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0 25 50 75 100 125 1.3 I D =250uA 1.2 1.1 1.0 0.9 0.8 0.7 -50 -25 0 25 50 75 100 125 T j, J unction T emperature ( C ) T j, J unction T emperature ( C ) with T emperature F igure 6. B reakdown V oltage V ariation with T emperature 12 20 10 10 Is , S ource-drain current (A) gF S , T rans conductance (S ) -50 -25 8 6 4 2 V DS =5V 0 0 V G S , G ate to S ource V oltage (V ) B V DS S , Normalized Drain-S ource B reakdown V oltage 1.3 5 10 15 20 1 T J =25 C 0 0.4 25 0.6 0.8 1.0 1.2 1.4 I DS , Drain-S ource C urrent (A) V S D , B ody Diode F orward V oltage (V ) F igure 7. T rans conductance V ariation with Drain C urrent F igure 8. B ody Diode F orward V oltage V ariation with S ource C urrent 50 10 V DS =10V I D =3.5A 8 I D , Drain C urrent (A) V th, Normalized G ate-S ource T hres hold V oltage S T S 3400 6 4 2 10 RD 0 2 4 6 8 10 12 14 16 it 10 10 0m ms s 1s DC 0.1 V G S =4.5V S ingle P ulse T c=25 C 0.1 Qg, T otal G ate C harge (nC ) ( L im 11 0.03 0 S ) ON 1 10 20 50 V DS , Drain-S ource V oltage (V ) F igure 10. Maximum S afe O perating Area F igure 9. G ate C harge 4 S T S 3400 V DD ton 5 V IN D tf 90% 90% V OUT V OUT VG S R GE N toff td(off) tr td(on) RL INVE R TE D 10% 10% G 90% S V IN 50% 50% 10% P ULS E WIDTH F igure 12. S witching Waveforms F igure 11. S witching T es t C ircuit Thermal Resistance Normalized Transient 10 1 0.5 0.2 0.1 P DM 0.1 t1 0.05 0.02 0.01 0.00001 on 1. 2. 3. 4. Single Pulse 0.01 0.0001 0.001 0.01 0.1 1 Square Wave Pulse Duration(sec) Normalized Thermal Transient Impedance Curve 5 10 t2 R thJ A (t)=r (t) * R thJ A R thJ A =S ee Datas heet T J M-T A = P DM* R thJ A (t) Duty C ycle, D=t1/t2 100 1000 S T S 3400 A L M F G J B C I H E D (TYP.) F 2.70 3.10 2.40 2.80 0.106 0.094 0.110 1.40 1.60 0.055 0.063 0.35 0.50 0.014 0.020 0 0.10 0 0.004 0.45 0.55 0.022 0.018 0.075 REF. 1.00 0.10 1.30 0.20 0.039 0.004 G I 1.90 REF. 0.122 0.051 0.008 J L 0.40 - 0.016 0.45 1.15 0.033 0.045 M 0° 10° 0° 10° 6 - S T S 3400 SOT-23 Tape and Reel Data SOT-23 Carrier Tape UNIT:㎜ PACKAGE SOT-23 A0 3.20 ±0.10 B0 3.00 ±0.10 K0 D0 1.33 ±0.10 ∮1.00 +0.25 D1 ∮1.50 +0.10 E 8.00 +0.30 -0.10 E1 E2 P0 P1 P2 T 1.75 ±0.10 3.50 ±0.05 4.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.20 ±0.02 SOT-23 Reel UNIT:㎜ TAPE SIZE REEL SIZE M N W W1 H K S G R V 8㎜ ∮178 ∮178 ±1 ∮60 ±1 9.00 ±0.5 12.00 ±0.5 ∮13.5 ±0.5 10.5 2.00 ±0.5 ∮10.0 5.00 18.00 7