HUF75307T3ST
Data Sheet
October 1999
2.6A, 55V, 0.090 Ohm, N-Channel UltraFET
Power MOSFET
File Number
4364.4
Features
• 2.6A, 55V
This N-Channel power MOSFET is
manufactured using the innovative
UltraFET™ process. This advanced
process technology achieves the
lowest possible on-resistance per silicon area, resulting in
outstanding performance. This device is capable of
withstanding high energy in the avalanche mode and the
diode exhibits very low reverse recovery time and stored
charge. It was designed for use in applications where power
efficiency is important, such as switching regulators,
switching converters, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable
and battery-operated products.
• Ultra Low On-Resistance, rDS(ON) = 0.090Ω
• Diode Exhibits Both High Speed and Soft Recovery
• Temperature Compensating PSPICE™ Model
• Thermal Impedance SPICE Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount
Components to PC Boards”
Symbol
Formerly developmental type TA75307.
D
Ordering Information
PART NUMBER
HUF75307T3ST
PACKAGE
SOT-223
BRAND
G
5307
S
NOTE: HUF75307T3ST is available only in tape and reel.
Packaging
SOT-223
DRAIN
(FLANGE)
SOURCE
DRAIN
GATE
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
UltraFET™ is a trademark of Intersil Corporation. PSPICE® is a trademark of MicroSim Corporation.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
HUF75307T3ST
Absolute Maximum Ratings
TA = 25oC, Unless Otherwise Specified
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Drain Current
Continuous (Figure 2) (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAS
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
UNITS
V
V
V
55
55
±20V
2.6
Figure 5
Figures 6, 14, 15
1.1
9.09
-55 to 150
A
W
mW/oC
oC
300
260
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to 125oC.
TA = 25oC, Unless Otherwise Specified
Electrical Specifications
MIN
TYP
MAX
UNITS
Drain to Source Breakdown Voltage
PARAMETER
SYMBOL
BVDSS
ID = 250µA, VGS = 0V (Figure 11)
55
-
-
V
Gate to Source Threshold Voltage
VGS(TH)
VGS = VDS, ID = 250µA (Figure 10)
2
-
4
V
VDS = 50V, VGS = 0V
-
-
1
µA
VDS = 45V, VGS = 0V, TA = 150oC
-
-
250
µA
VGS = ±20V
-
-
100
nA
ID = 2.6A, VGS = 10V) (Figure 9)
-
0.070
0.090
Ω
VDD = 30V, ID ≅ 2.6A,
RL = 11.5Ω, VGS = 10V,
RGS = 25Ω
-
-
55
ns
-
5
-
ns
Zero Gate Voltage Drain Current
IDSS
Gate to Source Leakage Current
IGSS
Drain to Source On Resistance
rDS(ON)
Turn-On Time
tON
Turn-On Delay Time
td(ON)
-
30
-
ns
td(OFF)
-
35
-
ns
tf
-
25
-
ns
tOFF
-
-
90
ns
Rise Time
tr
Turn-Off Delay Time
Fall Time
Turn-Off Time
Total Gate Charge
TEST CONDITIONS
Qg(TOT)
VGS = 0V to 20V
Gate Charge at 10V
Qg(10)
VGS = 0V to 10V
Threshold Gate Charge
Qg(TH)
VGS = 0V to 2V
VDD = 30V,
ID ≅ 2.6A,
RL = 11.5Ω
Ig(REF) = 1.0mA
(Figure 13)
-
14
17
nC
-
8.3
10
nC
-
0.6
0.8
nC
Gate to Source Gate Charge
Qgs
-
1.00
-
nC
Gate to Drain “Miller” Charge
Qgd
-
4.00
-
nC
Input Capacitance
CISS
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
Thermal Resistance Junction to Ambient
RθJA
VDS = 25V, VGS = 0V,
f = 1MHz
(Figure 12)
-
250
-
pF
-
115
-
pF
-
30
-
pF
Pad Area = 0.171 in2 (see note 2)
-
-
110
oC/W
Pad Area = 0.068 in2
-
-
128
oC/W
Pad Area = 0.026 in2
-
-
147
oC/W
Source to Drain Diode Specifications
PARAMETER
SYMBOL
Source to Drain Diode Voltage
MIN
TYP
MAX
UNITS
ISD = 2.6A
-
-
1.25
V
trr
ISD = 2.6A, dISD/dt = 100A/µs
-
-
40
ns
QRR
ISD = 2.6A, dISD/dt = 100A/µs
-
-
50
nC
VSD
Reverse Recovery Time
Reverse Recovered Charge
TEST CONDITIONS
NOTE:
2. 110 oC/W measured using FR-4 board with 0.171in2 footprint for 1000s.
2
HUF75307T3ST
Typical Performance Curves
1.2
3.0
POWER DISSIPATION MULTIPLIER
RθJA = 110oC/W
1.0
ID, DRAIN CURRENT (A)
2.5
0.8
0.6
0.4
0.2
0
0
50
100
2.0
1.5
1.0
0.5
0
25
150
50
FIGURE 1. NORMALIZED POWER DISSIPATION vs AMBIENT
TEMPERATURE
ZθJA, NORMALIZED
THERMAL IMPEDANCE
10
1
75
100
125
150
TA, AMBIENT TEMPERATURE (oC)
TA, AMBIENT TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
AMBIENT TEMPERATURE
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
RθJA = 110oC/W
0.1
PDM
t1
0.01
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TA
SINGLE PULSE
0.001
10-5
10-4
10-3
10-2
10-1
100
t, RECTANGULAR PULSE DURATION (s)
101
102
103
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
30
TJ = MAX RATED
TA = 25oC
RθJA = 110oC/W
10
IDM, PEAK CURRENT (A)
ID, DRAIN CURRENT (A)
100
100µs
1ms
1
10ms
0.1
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(ON)
0.01
1
VDSS(MAX) = 55V
10
100
VDS, DRAIN TO SOURCE VOLTAGE (V)
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
3
200
TA = 25oC FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
I
10
= I25
150 - TA
125
RθJA = 110oC/W
1
10-3
10-2
10-1
100
101
t, PULSE WIDTH (s)
102
FIGURE 5. PEAK CURRENT CAPABILITY
103
HUF75307T3ST
Typical Performance Curves
25
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R ≠ 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
10
ID, DRAIN CURRENT (A)
IAS, AVALANCHE CURRENT (A)
20
(Continued)
STARTING TJ = 25oC
STARTING TJ = 150oC
1
0.01
20
VGS = 6V
15
10
10
VGS = 5V
5
0
0.1
1
tAV, TIME IN AVALANCHE (ms)
VGS = 20V
VGS = 10V
VGS = 7V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
TA = 25oC
0
1
2
3
4
5
VDS, DRAIN TO SOURCE VOLTAGE (V)
NOTE: Refer to Intersil Application Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
2.5
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
VDD = 15V
20
-55oC
25oC
NORMALIZED DRAIN TO SOURCE
ON RESISTANCE
ID, DRAIN CURRENT (A)
25
150oC
15
10
5
0
0
1.5
FIGURE 7. SATURATION CHARACTERISTICS
3.0
4.5
6.0
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
VGS = 10V, ID = 2.6A
2.0
1.5
1.0
0.5
-80
7.5
-40
VGS, GATE TO SOURCE VOLTAGE (V)
NORMALIZED GATE
THRESHOLD VOLTAGE
1.2
VGS = VDS, ID = 250µA
1.0
0.8
0.6
0.4
-80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE (oC)
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
4
160
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
1.2
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
FIGURE 8. TRANSFER CHARACTERISTICS
0
40
80
120
TJ, JUNCTION TEMPERATURE (oC)
ID = 250µA
1.1
1.0
0.9
0.8
-80
-40
0
40
80
120
160
TJ , JUNCTION TEMPERATURE (oC)
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
HUF75307T3ST
Typical Performance Curves
(Continued)
VGS = 0V, f = 1MHz
CISS = CGS + CGD
CRSS = CGD
COSS = CDS + CGD
400
C, CAPACITANCE (pF)
VGS , GATE TO SOURCE VOLTAGE (V)
500
300
CISS
200
COSS
100
CRSS
0
10
8
10
20
30
40
50
VDS , DRAIN TO SOURCE VOLTAGE (V)
VDD = 30V
6
4
2
0
0
WAVEFORMS IN
DESCENDING ORDER:
ID = 2.6A
ID = 1.5A
ID = 0.5A
60
0
2
4
6
8
Qg, GATE CHARGE (nC)
FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
NOTE: Refer to Intersil Application Notes AN7254 and AN7260.
FIGURE 13. GATE CHARGE WAVEFORMS FOR CONSTANT
GATE CURRENT
Test Circuits and Waveforms
VDS
BVDSS
L
tP
VARY tP TO OBTAIN
REQUIRED PEAK IAS
+
RG
VDS
IAS
VDD
VDD
-
VGS
DUT
tP
0V
IAS
0
0.01Ω
tAV
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 15. UNCLAMPED ENERGY WAVEFORMS
VDS
VDD
RL
Qg(TOT)
VDS
VGS = 20V
VGS
Qg(10)
+
VDD
DUT
Ig(REF)
VGS = 10V
VGS
-
VGS = 2V
0
Qg(TH)
Ig(REF)
0
FIGURE 16. GATE CHARGE TEST CIRCUIT
5
FIGURE 17. GATE CHARGE WAVEFORM
HUF75307T3ST
Test Circuits and Waveforms
(Continued)
VDS
tON
tOFF
td(ON)
td(OFF)
tf
tr
RL
VDS
90%
90%
+
VGS
-
VDD
10%
10%
0
DUT
90%
RGS
VGS
VGS
0
FIGURE 18. SWITCHING TIME TEST CIRCUIT
10%
50%
50%
PULSE WIDTH
FIGURE 19. RESISTIVE SWITCHING WAVEFORMS
Thermal Resistance vs. Mounting Pad Area
The maximum rated junction temperature, TJ(MAX), and the
thermal resistance of the heat dissipating path determines
the maximum allowable device power dissipation, PD(MAX),
in an application. Therefore the application’s ambient
temperature, TA (oC), and thermal resistance RθJA (oC/W)
must be reviewed to ensure that TJ(MAX) is never exceeded.
Equation 1 mathematically represents the relationship and
serves as the basis for establishing the rating of the part.
( T J ( MAX ) – T A )
P D ( MAX ) = -------------------------------------------R θJA
state power with no air flow. This graph provides the
necessary information for calculation of the steady state
junction temperature or power dissipation. Pulse
applications can be evaluated using the Intersil device Spice
thermal model or manually utilizing the normalized maximum
transient thermal impedance curve.
200
RθJA = 75.9 -19.3 ln(AREA)
In using surface mount devices such as the SOT-223
package, the environment in which it is applied will have a
significant influence on the part’s current and maximum
power dissipation ratings. Precise determination of the
PD(MAX) is complex and influenced by many factors:
1. Mounting pad area onto which the device is attached and
whether there is copper on one side or both sides of the
board.
2. The number of copper layers and the thickness of the
board.
3. The use of external heat sinks.
4. The use of thermal vias.
5. Air flow and board orientation.
6. For non steady state applications, the pulse width, the
duty cycle and the transient thermal response of the part,
the board and the environment they are in.
Intersil provides thermal information to assist the designer’s
preliminary application evaluation. Figure 20 defines the
RθJA for the device as a function of the top copper
(component side) area. This is for a horizontally positioned
FR-4 board with 1oz copper after 1000 seconds of steady
6
RθJA (oC/W)
(EQ. 1)
150
147oC/W - 0.026in2
128oC/W - 0.068in2
110oC/W - 0.171in2
100
50
0.01
0.1
1.0
AREA, TOP COPPER AREA (in2)
FIGURE 20. THERMAL RESISTANCE vs MOUNTING PAD
AREA
Displayed on the curve are the three RθJA values listed in
the Electrical Specifications table. The three points were
chosen to depict the compromise between the copper board
area, the thermal resistance and ultimately the power
dissipation, PD(MAX). Thermal resistances corresponding to
other component side copper areas can be obtained from
Figure 20 or by calculation using Equation 2. The area, in
square inches is the top copper area including the gate and
source pads.
R θJA = 75.9 – 19.3 × ln ( Area )
(EQ. 2)
HUF75307T3ST
PSPICE Electrical Model
.SUBCKT HUF75307T3ST 2 1 3 ;
rev 7/25/97
CA 12 8 3.5e-10
CB 15 14 3.7e-10
CIN 6 8 2.26e-10
LDRAIN
DPLCAP
DRAIN
2
5
10
DBODY 7 5 DBODYMOD
DBREAK 5 11 DBREAKMOD
DPLCAP 10 5 DPLCAPMOD
DBREAK
+
RSLC2
5
51
ESLC
11
-
EBREAK 11 7 17 18 57.4
EDS 14 8 5 8 1
EGS 13 8 6 8 1
ESG 6 10 6 8 1
EVTHRES 6 21 19 8 1
EVTEMP 20 6 18 22 1
IT 8 17 1
RLDRAIN
RSLC1
51
RDRAIN
6
8
ESG
EVTHRES
+ 19 8
+
LGATE
GATE
1
EVTEMP
RGATE +
18 22
9
20
21
DBODY
-
16
MWEAK
6
MMED
MSTRO
RLGATE
LDRAIN 2 5 1e-9
LGATE 1 9 1.4e-9
LSOURCE 3 7 3.1e-10
K1 LGATE LSOURCE 0.131
+
17
EBREAK 18
50
-
LSOURCE
CIN
8
SOURCE
3
7
RSOURCE
RLSOURCE
MMED 16 6 8 8 MMEDMOD
MSTRO 16 6 8 8 MSTROMOD
MWEAK 16 21 8 8 MWEAKMOD
S1A
12
RBREAK 17 18 RBREAKMOD 1
RDRAIN 50 16 RDRAINMOD 7.0e-3
RGATE 9 20 1.9
RLDRAIN 2 5 10
RLGATE 1 9 14
RLSOURCE 3 7 3
RSLC1 5 51 RSLCMOD 1e-6
RSLC2 5 50 1e3
RSOURCE 8 7 RSOURCEMOD 5.6e-2
RVTHRES 22 8 RVTHRESMOD 1
RVTEMP 18 19 RVTEMPMOD 1
S1A
S1B
S2A
S2B
S2A
13
8
14
13
S1B
17
18
RVTEMP
S2B
13
CA
RBREAK
15
CB
6
8
EGS
19
-
-
IT
14
+
+
VBAT
5
8
EDS
-
+
8
22
RVTHRES
6 12 13 8 S1AMOD
13 12 13 8 S1BMOD
6 15 14 13 S2AMOD
13 15 14 13 S2BMOD
VBAT 22 19 DC 1
ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*50),3))}
.MODEL DBODYMOD D (IS = 2.6e-13 RS = 2.34e-2 IKF = 5.5 N = 0.995 TRS1 = 2.8e-3 TRS2 = 1.1e-5 CJO = 3.7e-10 TT = 3.5e-8 M = 0.46
+ XTI = 5.5)
.MODEL DBREAKMOD D (RS = 0.5 IKF = 0.1 N = 1 TRS1 = 3e-3 TRS2 = -5e-5)
.MODEL DPLCAPMOD D (CJO = 5.6e-10 IS = 1e-30 N = 10 M = 0.92)
.MODEL MMEDMOD NMOS (VTO = 3.25 KP = 1.8 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 1.9)
.MODEL MSTROMOD NMOS (VTO = 3.68 KP = 13.5 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u)
.MODEL MWEAKMOD NMOS (VTO = 2.83 KP = 0.03 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 19 RS = 0.1)
.MODEL RBREAKMOD RES (TC1 = 1.08e-3 TC2 = 5e-7)
.MODEL RDRAINMOD RES (TC1 = 1.7e-2 TC2 = 1e-4)
.MODEL RSLCMOD RES (TC1 = 1e-9 TC2 = 1e-4)
.MODEL RSOURCEMOD RES (TC1 = 3.3e-3 TC2 = 1e-9)
.MODEL RVTHRESMOD RES (TC1 = -1.9e-3 TC2 = -4e-6)
.MODEL RVTEMPMOD RES (TC1 = -2.9e-3 TC2 = 2.2e-6)
.MODEL S1AMOD VSWITCH (RON = 1e-5
.MODEL S1BMOD VSWITCH (RON = 1e-5
.MODEL S2AMOD VSWITCH (RON = 1e-5
.MODEL S2BMOD VSWITCH (RON = 1e-5
ROFF = 0.1
ROFF = 0.1
ROFF = 0.1
ROFF = 0.1
VON = -7.1 VOFF= -4)
VON = -4 VOFF= -7.1)
VON = 0.01 VOFF= 1.9)
VON = 1.9 VOFF= 0.01)
.ENDS
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global
Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
7
HUF75307T3ST
SPICE Thermal Model
7
JUNCTION
REV 15 Nov 97
HUF75307T3ST
CTHERM1 7 6 7.5e-5
CTHERM2 6 5 3.5e-4
CTHERM3 5 4 1.2e-3
CTHERM4 4 3 1.5e-2
CTHERM5 3 2 6.9e-2
CTHERM6 2 1 4.5e-1
RTHERM1
RTHERM1 7 6 7.5e-2
RTHERM2 6 5 2.0e-1
RTHERM3 5 4 1.2
RTHERM4 4 3 3.3
RTHERM5 3 2 28
RTHERM6 2 1 90
RTHERM2
CTHERM1
6
CTHERM2
5
RTHERM3
CTHERM3
4
RTHERM4
CTHERM4
3
RTHERM5
CTHERM5
2
RTHERM6
CTHERM6
1
CASE
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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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8